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公开(公告)号：US20240222633A1
公开(公告)日：2024-07-04
申请号：US18288221
申请日：2022-04-22
Inventor： Atsutaka KATO , Mari YAMAMOTO , Masanari TAKAHASHI , Futoshi UTSUNO , Hiroyuki HIGUCHI
IPC: H01M4/62 , C01B25/14 , H01M4/13 , H01M10/0562
CPC classification number: H01M4/621 , C01B25/14 , H01M4/13 , H01M10/0562 , C01P2002/72 , C01P2002/82 , C01P2002/85 , C01P2002/86 , C01P2006/40 , H01M2300/0068
Abstract: One of the purposes of the present invention is to provide: a compound which can be used as a binder having ion conductivity; and a battery which contains the compound. One aspect of the present invention is a compound comprising P and S as constituent elements, a group comprising one or more elements selected from the group consisting of O, N and halogen, the group bonding to the P, and a disulfide bond.
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公开(公告)号：US11835426B2
公开(公告)日：2023-12-05
申请号：US17705575
申请日：2022-03-28
Inventor： Akira Hosoyama , Yuji Nakaura , Yoshikado Yamauchi
CPC classification number: G01M7/022 , B06B1/0261 , G01M7/025
Abstract: A vibration control system calculates a Kurtosis Response Spectrum (KRS) of a response waveform which characterizes non-Gaussianity in a random vibration test and is utilized for vibration control. The system compares a target KRS and the response KRS, and controls a characteristic of a phase used to generate a waveform for control such that the response KRS becomes equal to the target KRS. The waveform for control is generated by applying a random phase to each frequency component of an amplitude corresponding to Power Spectral Density (PSD). The system controls a characteristic of this phase (e.g., standard deviation) per frequency, controls the KRS, deforms the waveform for control on the basis of an equalization characteristic, and calculates a drive waveform. The system sequentially updates the equalization characteristic on the basis of the response waveform and the drive waveform. The calculated drive waveform is provided to a vibration generator.
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公开(公告)号：US20210254109A1
公开(公告)日：2021-08-19
申请号：US17192751
申请日：2021-03-04
Applicant: Ensuiko Sugar Refining Co., Ltd. , Osaka Research Institute of Industrial Science and Technology
Inventor： Tetsuya Ito , Hiroki Tadokoro , Hisaharu Masaki , Katsuhiko Mikuni , Hiromi Murakami , Taro Kiso , Takaaki Kiryu
Abstract: The present invention provides a D-glucaric acid-producing bacterium and a method for producing D-glucaric acid. The present invention is characterized in that D-glucaric acid or a salt thereof is produced from one or more saccharides selected from the group consisting of D-glucose, D-gluconic acid and D-glucuronic acid with catalytic action of a specific alcohol dehydrogenase PQQ-ADH (1) and a specific aldehyde dehydrogenase PQQ-ALDH (2), and that D-glucaric acid or a salt thereof is produced by using a microorganism having the PQQ-ADH (1) and the PQQ-ALDH (2) or a processed product thereof in the presence of the one or more saccharides. The present invention can provide a microorganism having improved productivity of D-glucaric acid to be used for production of D-glucaric acid and a method for efficiently producing D-glucaric acid.
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公开(公告)号：US20210187902A1
公开(公告)日：2021-06-24
申请号：US16081424
申请日：2017-02-28
Inventor： Takeshi FUJIWARA , Jyunichi INAGAKI , Yasuyuki AGARI , Hiroshi HIRANO , Joji KADOTA , Akinori OKADA
IPC: B32B7/027 , B32B27/20 , H01L23/373 , C09K19/02 , C09K19/04
Abstract: The present invention is a laminate: with which differences in the thermal expansion coefficient at interfaces between different materials in the interior of a semiconductor element or the like can be kept small; which has high heat resistance; and which has high thermal conductivity. This laminate is provided with at least two layers of thermal expansion-controlling members, the thermal expansion-controlling members including a thermally conductive first inorganic filler joined to one end of a first coupling agent, and a thermally conductive second inorganic filler joined to one end of a second coupling agent; the other end of the first coupling agent and the other end of the second coupling agent are respectively joined to a polymerizable compound, or joined to one another; and the thermal expansion-controlling members have thermal expansion coefficients that are respectively different.
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公开(公告)号：US10969312B2
公开(公告)日：2021-04-06
申请号：US16248809
申请日：2019-01-16
Applicant: SHIMADZU CORPORATION , Osaka Research Institute of Industrial Science and Technology , City of Nagoya , AKITA PREFECTURE
Inventor： Tadaoki Takii , Masaki Nishimura , Satoshi Taniguchi , Mitsuhiko Kimura , Norifumi Kasai
Abstract: Provided are a striking device and a natural frequency measuring device capable of simply and accurately measuring a natural frequency of a system including force detector. The striking device includes an arm capable of swinging around a spindle, and a steel ball arranged in an end part of the arm on a side opposite to the spindle. The spindle is supported by a supporting part capable of lifting up and down relative to a post erected on a magnet stand. A supporting part for supporting a supporting plate is arranged at a position in the post and above the supporting part. A permanent magnet is placed above the supporting plate. The steel ball falls down in an arc shape from a standby height position when the permanent magnet is removed.
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Patent Agency Ranking
公开(公告)号：US10679922B2
公开(公告)日：2020-06-09
申请号：US16081426
申请日：2017-02-28
Inventor： Takeshi Fujiwara , Jyunichi Inagaki , Masako Hinatsu , Yasuyuki Agari , Hiroshi Hirano , Joji Kadota , Akinori Okada
Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.
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公开(公告)号：US20190055444A1
公开(公告)日：2019-02-21
申请号：US16081425
申请日：2017-02-28
Inventor： TAKESHI FUJIWARA , JYUNICHI INAGAKI , YASUYUKI AGARI , HIROSHI HIRANO , JOJI KADOTA , AKINORI OKADA
Abstract: The present invention provides: a composition for low thermal expansion members, which is capable of forming a low thermal expansion member that has a thermal expansion coefficient close to those of the members within a semiconductor element, while having high heat resistance and high heat conductivity; and a low thermal expansion member. A composition for low thermal expansion members according to the present invention is characterized by containing: a heat conductive first inorganic filler that is bonded to one end of a first coupling agent; and a heat conductive second inorganic filler that is bonded to one end of a second coupling agent. This composition for low thermal expansion members is also characterized in that the first inorganic filler and the second inorganic filler are bonded to each other via the first coupling agent and the second coupling agent by means of a curing treatment.
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公开(公告)号：US20190023900A1
公开(公告)日：2019-01-24
申请号：US16081426
申请日：2017-02-28
Inventor： Takeshi FUJIWARA , Jyunichi INAGAKI , Masako HINATSU , Yasuyuki AGARI , Hiroshi HIRANO , Joji KADOTA , Akinori OKADA
Abstract: The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.
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公开(公告)号：US20230381858A1
公开(公告)日：2023-11-30
申请号：US18031255
申请日：2021-10-11
Applicant: OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGY , TOYO ALUMINIUM KABUSHIKI KAISHA
Inventor： Takahiro SUGAHARA , Takayuki NAKAMOTO , Takao MIKI , Kota FUJIWARA , Tomoatsu OZAKI , Isao MURAKAMI , Akiei TANAKA
CPC classification number: B22F1/00 , B22F10/28 , C22C1/0416 , C22C21/00 , B33Y10/00
Abstract: A metal powder for additive manufacturing is used (i) which includes, as a main component, aluminum, and not less than 0.20% by mass and not more than 13% by mass of at least one alloy element other than the aluminum, selected from iron, manganese, chromium, nickel and zirconium, and (ii) in which the content of iron is less than 4.5% by mass.
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公开(公告)号：US11178764B2
公开(公告)日：2021-11-16
申请号：US16962171
申请日：2018-12-25
Inventor： Mayumi Uno , Kazuki Maeda , Masashi Nitani , Busang Cha , Junichi Takeya
Abstract: A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.
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