Systems and methods for reducing condensation along a slider air bearing surface in energy assisted magnetic recording
    11.
    发明授权
    Systems and methods for reducing condensation along a slider air bearing surface in energy assisted magnetic recording 有权
    用于在能量辅助磁记录中沿滑块空气轴承表面减少冷凝的系统和方法

    公开(公告)号:US08599653B1

    公开(公告)日:2013-12-03

    申请号:US13610157

    申请日:2012-09-11

    IPC分类号: G11B11/00

    摘要: Systems and methods for reducing condensation along an air bearing surface of a slider in an energy assisted magnetic recording system are provided. In one embodiment, the invention relates to a slider configured to reduce condensation along an air bearing surface in an energy assisted magnetic recording system, the slider including an air bearing surface (ABS), a write transducer including a portion disposed at the ABS, a hot spot region disposed along the ABS, where the hot spot region includes the portion of the write transducer at the ABS, and a trench surrounding the hot spot region.

    摘要翻译: 提供了一种用于在能量辅助磁记录系统中沿着滑块的空气轴承表面减小冷凝的系统和方法。 在一个实施例中,本发明涉及一种被配置为在能量辅助磁记录系统中沿着空气轴承表面减少冷凝的滑块,滑块包括空气轴承表面(ABS),包括设置在ABS处的部分的写换能器, 沿着ABS布置的热点区域,其中热点区域包括ABS处的写入传感器的部分以及围绕热点区域的沟槽。

    METHOD AND DEVICE FOR PROVIDING ON-BOARD FAILURE LOGGING FOR PLUGGABLE OPTICAL MODULES
    12.
    发明申请
    METHOD AND DEVICE FOR PROVIDING ON-BOARD FAILURE LOGGING FOR PLUGGABLE OPTICAL MODULES 审中-公开
    用于提供可插拔光模块的板上故障记录的方法和装置

    公开(公告)号:US20130202289A1

    公开(公告)日:2013-08-08

    申请号:US13367569

    申请日:2012-02-07

    IPC分类号: H04B10/08

    CPC分类号: H04B10/07

    摘要: A method of capturing a failure log for an optical module may be provided. The optical module may have an optical monitoring circuit and a buffer memory. The method may include measuring environment variables of the optical module using the optical monitoring circuit, and storing the measured environment variables in the buffer memory. In addition, the method may also include receiving time of day information. The measured environment variables may then be associated with the time of day information.

    摘要翻译: 可以提供捕获光学模块的故障日志的方法。 光学模块可以具有光学监视电路和缓冲存储器。 该方法可以包括使用光学监视电路测量光学模块的环境变量,并将测量的环境变量存储在缓冲存储器中。 此外,该方法还可以包括接收时间信息。 所测量的环境变量可以与时间信息相关联。

    SLIDER, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME
    13.
    发明申请
    SLIDER, HEAD GIMBAL ASSEMBLY AND DISK DRIVE UNIT WITH THE SAME 有权
    滑块,头部组件和磁盘驱动单元

    公开(公告)号:US20130050877A1

    公开(公告)日:2013-02-28

    申请号:US13222035

    申请日:2011-08-31

    IPC分类号: G11B5/40 G11B5/60

    摘要: A slider includes a substrate having a trailing edge, a leading edge opposite the trailing edge, and an air bearing surface connecting the trailing edge with the leading edge; a read/write transducer formed at the trailing edge; and a coat layer attached on the trailing edge and covering on the read/write transducer. The slider further includes a protection layer for shielding the read/write transducer thereby preventing the read/write transducer from damaging during a laser soldering process. The present invention can prevent the read/write transducer from damaging during the laser bonding process and, in turn improve the reading and writing performance of the slider. The invention also discloses an HGA and a disk drive unit.

    摘要翻译: 滑块包括具有后缘,与后缘相对的前缘的衬底和将后缘与前缘连接的空气支承表面; 形成在后缘的读/写换能器; 并且附着在后缘上并覆盖读/写换能器的涂层。 滑块还包括用于屏蔽读/写换能器的保护层,从而防止读/写换能器在激光焊接过程中损坏。 本发明可以防止读/写换能器在激光焊接过程中受损,从而提高滑块的读写性能。 本发明还公开了一种HGA和盘驱动单元。

    Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer
    14.
    发明授权
    Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer 有权
    半导体组件包括位于由图案化聚合物层限定的单元中的功率半导体管芯

    公开(公告)号:US08138597B2

    公开(公告)日:2012-03-20

    申请号:US12939561

    申请日:2010-11-04

    IPC分类号: H01L23/34 H01L21/00 H01L23/10

    摘要: A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.

    摘要翻译: 半导体组件包括第一子组件,其包括散热器和设置在散热器的表面上以限定第一表面的暴露部分的第一图案化聚合物层。 第一表面的暴露部分沿着散热表面从第一层径向向内延伸。 子组件还包括设置在第一图案化聚合物层的径向外部部分上的第二图案化聚合物层。 第一和第二层限定用于容纳功率半导体管芯的电池。 焊料设置在散热器表面的暴露部分和电池中。 功率半导体管芯位于第一层的径向向内部分内的单元内,并通过焊料材料热耦合到散热器。

    Method for avoiding die cracking
    15.
    发明授权
    Method for avoiding die cracking 有权
    避免模​​具开裂的方法

    公开(公告)号:US08114758B1

    公开(公告)日:2012-02-14

    申请号:US12848839

    申请日:2010-08-02

    IPC分类号: H01L21/301

    CPC分类号: H01L21/78

    摘要: Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a first die, a second die, and a monitor structure in an area between the first die and the second die, the monitor structure including a first dielectric material, removing the first dielectric material from the monitor structure, and after removing the first dielectric material, cutting the substrate along the area between the first die and the second die to separate the first die from the second die.

    摘要翻译: 本文描述了旨在避免由模具分离产生的模头破裂的方法。 方法可以包括在第一管芯和第二管芯之间的区域中提供包括第一管芯,第二管芯和监测器结构的衬底,所述监测器结构包括第一电介质材料,从监测器结构中去除第一电介质材料 并且在去除第一介电材料之后,沿着第一管芯和第二管芯之间的区域切割基板,以将第一管芯与第二管芯分开。

    SMALL-SIZE PRINTED CIRCUIT BOARD-PRINTED MEANDER LINE INVERTED-F ANTENNA FOR RADIO FREQUENCY INTEGRATED CIRCUITS
    16.
    发明申请
    SMALL-SIZE PRINTED CIRCUIT BOARD-PRINTED MEANDER LINE INVERTED-F ANTENNA FOR RADIO FREQUENCY INTEGRATED CIRCUITS 审中-公开
    无线电频率集成电路的小尺寸印刷电路板印刷线路反相F天线

    公开(公告)号:US20110309993A1

    公开(公告)日:2011-12-22

    申请号:US13164467

    申请日:2011-06-20

    IPC分类号: H01Q1/50 H01Q1/38

    摘要: A printed circuit board-printed antenna for a radio frequency front end with an antenna port for a predefined operating frequency band is disclosed. A ground line and a feed line are connected to a radiating element fixed to a bare section of a printed circuit board substrate. The radiating element is in an inverted-F configuration with a primary segment extending in a perpendicular relationship to the connected ground line and the feed line. A plurality of successive meander segments is initially connected to the primary segment and ends at a radiating element tip. A high frequency current loop is formed with an origin from the feed line to a terminus via the ground line and the radiating element tip. The high frequency current loop confines current and electronic fields on the radiating element.

    摘要翻译: 公开了一种用于射频前端的印刷电路板印刷天线,其具有用于预定工作频带的天线端口。 接地线和馈电线连接到固定到印刷电路板基板的裸露部分的辐射元件。 辐射元件处于倒F形状,其中主段以垂直于连接的接地线和馈线的关系延伸。 多个连续的曲折段最初连接到主段并且在辐射元件尖端处终止。 高频电流回路以原点从馈电线经由接地线和辐射元件尖端形成至终端。 高频电流回路将电流和电场限制在辐射元件上。

    FIELD-CONFINED WIDEBAND ANTENNA FOR RADIO FREQUENCY FRONT END INTEGRATED CIRCUITS
    17.
    发明申请
    FIELD-CONFINED WIDEBAND ANTENNA FOR RADIO FREQUENCY FRONT END INTEGRATED CIRCUITS 审中-公开
    用于无线电频率前端集成电路的现场限制宽带天线

    公开(公告)号:US20110128199A1

    公开(公告)日:2011-06-02

    申请号:US12914922

    申请日:2010-10-28

    IPC分类号: H01Q13/10 H01Q7/00 H01Q1/42

    摘要: A field-confined wideband antenna assembly is disclosed. The antenna assembly includes a radiating element with a planar body that defines a first confining slot. The dimensions of the first confining slot correspond to a first set of resonance frequencies of the radiating element. A feeding line extends from the radiating element in an angularly offset relationship to the planar body. A first grounding line extends from the radiating element in an angularly offset relationship to the first body. A dielectric assembly supports the planar body of the radiating element. There is a first high frequency current loop that is formed from the feeding line to the radiating element about the first confining slot and to the first grounding line. With this, the first high frequency current loop confines current and electric fields on the radiating element.

    摘要翻译: 公开了一种场约束宽带天线组件。 天线组件包括具有限定第一限制槽的平面主体的辐射元件。 第一限制槽的尺寸对应于辐射元件的第一组谐振频率。 馈送线与辐射元件以平面主体成角度地偏移的关系延伸。 第一接地线从辐射元件以与第一主体成角度偏移的关系延伸。 电介质组件支撑辐射元件的平面体。 存在第一高频电流回路,其由围绕第一限制槽和第一接地线的馈送线到辐射元件形成。 因此,第一个高频电流回路将电流和电场限制在辐射元件上。

    Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers
    18.
    发明授权
    Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers 有权
    半导体组件包括位于由第一和第二图案化聚合物层限定的单元上的功率半导体管芯

    公开(公告)号:US07838985B2

    公开(公告)日:2010-11-23

    申请号:US11827593

    申请日:2007-07-12

    IPC分类号: H01L23/34 H01L21/00

    摘要: A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.

    摘要翻译: 半导体组件包括第一子组件,其包括散热器和设置在散热器的表面上以限定第一表面的暴露部分的第一图案化聚合物层。 第一表面的暴露部分沿着散热表面从第一层径向向内延伸。 子组件还包括设置在第一图案化聚合物层的径向外部部分上的第二图案化聚合物层。 第一和第二层限定用于容纳功率半导体管芯的电池。 焊料设置在散热器表面的暴露部分和电池中。 功率半导体管芯位于第一层的径向向内部分内的单元内,并通过焊料材料热耦合到散热器。

    Method for avoiding die cracking
    19.
    发明授权
    Method for avoiding die cracking 有权
    避免模​​具开裂的方法

    公开(公告)号:US07767552B1

    公开(公告)日:2010-08-03

    申请号:US12273432

    申请日:2008-11-18

    IPC分类号: H01L21/301

    CPC分类号: H01L21/78

    摘要: Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a first die, a second die, and a monitor structure in an area between the first die and the second die, the monitor structure including a first dielectric material, removing the first dielectric material from the monitor structure, and after removing the first dielectric material, cutting the substrate along the area between the first die and the second die to separate the first die from the second die.

    摘要翻译: 本文描述了旨在避免由模具分离产生的模头破裂的方法。 方法可以包括在第一管芯和第二管芯之间的区域中提供包括第一管芯,第二管芯和监测器结构的衬底,所述监测器结构包括第一电介质材料,从监测器结构中去除第一电介质材料 并且在去除第一介电材料之后,沿着第一管芯和第二管芯之间的区域切割基板,以将第一管芯与第二管芯分开。

    Field emission system and method for improving its vacuum
    20.
    发明授权
    Field emission system and method for improving its vacuum 失效
    场致发射系统及其真空提高方法

    公开(公告)号:US07489071B2

    公开(公告)日:2009-02-10

    申请号:US11593499

    申请日:2006-11-07

    IPC分类号: H01J1/62

    摘要: The present invention provides a field emission system and a method for improving its vacuum. The present invention employs aging surface-unsaturated carbon nanotubes in non-display areas of the field emission system as getter material to absorb residual gas within the system so as to improve its vacuum. The present method for improving vacuum of the field emission system can be integrated with the standard process of a field emission display device without additional fabricating steps, and thus facilitating the mass production of the field emission display device.

    摘要翻译: 本发明提供一种场致发射系统及其真空改善方法。 本发明在场发射系统的非显示区域中使用老化的表面 - 不饱和碳纳米管作为吸收材料以吸收系统内的残余气体,从而改善其真空度。 用于改善场致发射系统的真空的本方法可以与场发射显示装置的标准过程结合而不需要额外的制造步骤,从而有助于场发射显示装置的大规模生产。