摘要:
Systems and methods for reducing condensation along an air bearing surface of a slider in an energy assisted magnetic recording system are provided. In one embodiment, the invention relates to a slider configured to reduce condensation along an air bearing surface in an energy assisted magnetic recording system, the slider including an air bearing surface (ABS), a write transducer including a portion disposed at the ABS, a hot spot region disposed along the ABS, where the hot spot region includes the portion of the write transducer at the ABS, and a trench surrounding the hot spot region.
摘要:
A method of capturing a failure log for an optical module may be provided. The optical module may have an optical monitoring circuit and a buffer memory. The method may include measuring environment variables of the optical module using the optical monitoring circuit, and storing the measured environment variables in the buffer memory. In addition, the method may also include receiving time of day information. The measured environment variables may then be associated with the time of day information.
摘要:
A slider includes a substrate having a trailing edge, a leading edge opposite the trailing edge, and an air bearing surface connecting the trailing edge with the leading edge; a read/write transducer formed at the trailing edge; and a coat layer attached on the trailing edge and covering on the read/write transducer. The slider further includes a protection layer for shielding the read/write transducer thereby preventing the read/write transducer from damaging during a laser soldering process. The present invention can prevent the read/write transducer from damaging during the laser bonding process and, in turn improve the reading and writing performance of the slider. The invention also discloses an HGA and a disk drive unit.
摘要:
A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.
摘要:
Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a first die, a second die, and a monitor structure in an area between the first die and the second die, the monitor structure including a first dielectric material, removing the first dielectric material from the monitor structure, and after removing the first dielectric material, cutting the substrate along the area between the first die and the second die to separate the first die from the second die.
摘要:
A printed circuit board-printed antenna for a radio frequency front end with an antenna port for a predefined operating frequency band is disclosed. A ground line and a feed line are connected to a radiating element fixed to a bare section of a printed circuit board substrate. The radiating element is in an inverted-F configuration with a primary segment extending in a perpendicular relationship to the connected ground line and the feed line. A plurality of successive meander segments is initially connected to the primary segment and ends at a radiating element tip. A high frequency current loop is formed with an origin from the feed line to a terminus via the ground line and the radiating element tip. The high frequency current loop confines current and electronic fields on the radiating element.
摘要:
A field-confined wideband antenna assembly is disclosed. The antenna assembly includes a radiating element with a planar body that defines a first confining slot. The dimensions of the first confining slot correspond to a first set of resonance frequencies of the radiating element. A feeding line extends from the radiating element in an angularly offset relationship to the planar body. A first grounding line extends from the radiating element in an angularly offset relationship to the first body. A dielectric assembly supports the planar body of the radiating element. There is a first high frequency current loop that is formed from the feeding line to the radiating element about the first confining slot and to the first grounding line. With this, the first high frequency current loop confines current and electric fields on the radiating element.
摘要:
A semiconductor assembly includes a first subassembly comprising a heat sink and a first patterned polymer layer disposed on a surface of the heat sink to define an exposed portion of the first surface. The exposed portion of the first surface extends radially inward along the heat sink surface from the first layer. The subassembly also includes a second patterned polymer layer disposed on a radially outer portion of the first patterned polymer layer. The first and second layers define a cell for accommodating a power semiconductor die. Solder material is disposed on the exposed portion of the heat sink surface and in the cell. A power semiconductor die is located within the cell on a radially inward portion of the first layer and thermally coupled to the heat sink by the solder material.
摘要:
Methods directed to avoiding die cracking resulting from die separation are described herein. A method may include providing a substrate including a first die, a second die, and a monitor structure in an area between the first die and the second die, the monitor structure including a first dielectric material, removing the first dielectric material from the monitor structure, and after removing the first dielectric material, cutting the substrate along the area between the first die and the second die to separate the first die from the second die.
摘要:
The present invention provides a field emission system and a method for improving its vacuum. The present invention employs aging surface-unsaturated carbon nanotubes in non-display areas of the field emission system as getter material to absorb residual gas within the system so as to improve its vacuum. The present method for improving vacuum of the field emission system can be integrated with the standard process of a field emission display device without additional fabricating steps, and thus facilitating the mass production of the field emission display device.