Abstract:
This invention relates to novel sulfur-containing silane coupling agents, and organic polymers containing carbon-carbon double bonds. These novel silanes can be carried on organic and inorganic fillers. The invention also relates to articles of manufacture, particularly tires, made from the elastomer compositions described herein.
Abstract:
This invention relates to novel sulfur-containing silane coupling agents, and organic polymers containing carbon-carbon double bonds. These novel silanes can be carried on organic and inorganic fillers. The invention also relates to articles of manufacture, particularly tires, made from the elastomer compositions described herein.
Abstract:
This invention relates to novel sulfur-containing silane coupling agents, and organic polymers containing carbon-carbon double bonds. These novel silanes can be carried on organic and inorganic fillers. The invention also relates to articles of manufacture, particularly tires, made from the elastomer compositions described herein.
Abstract:
This invention relates to novel sulfur-containing silane coupling agents, and organic polymers containing carbon-carbon double bonds. These novel silanes can be carried on organic and inorganic fillers. The invention also relates to articles of manufacture, particularly tires, made from the elastomer compositions described herein.
Abstract:
This invention relates to novel sulfur-containing silane coupling agents, and organic polymers containing carbon-carbon double bonds. These novel silanes can be carried on organic and inorganic fillers. The invention also relates to articles of manufacture, particularly tires, made from the elastomer compositions described herein.
Abstract:
This invention relates to novel sulfur-containing silane coupling agents, and organic polymers containing carbon-carbon double bonds. These novel silanes can be carried on organic and inorganic fillers. The invention also relates to articles of manufacture, particularly tires, made from the elastomer compositions described herein.
Abstract:
This invention relates to novel free-flowing filler compositions containing silated cyclic core polysulfide coupling agents, and to a rubber containing the filler composition.
Abstract:
Silane compositions of the general formula are provided herein comprising [(RO)x(R1)(3-x)—Si-Mt]q-L-[(Ra)cAr—(CR2═CR22)y]z wherein R and R1 are independently a hydrocarbon group of from 1 to about 20 carbon atoms; R2 are each independently hydrogen or a hydrocarbon group of from 1 to about 20 carbon atoms; M optionally is a divalent hydrocarbon connecting group of from 1 to about 20 carbon atoms to link the silicon atom and the L group; L is a covalently bound hydrocarbon linking group of from 1 to about 20 carbon atoms or a heteroatom linking group selected from the group consisting of —O—, —S—, —NR3— wherein R3 is hydrogen or a hydrocarbon group of from 1 to about 20 carbon atoms; Ra is an alkyl group of 1 to 12 carbon atoms; Ar is a substituted or unsubstituted aromatic group; q is an integer of 1 to 4; t and c are each independently 0 or 1; and x, y and z are each independently integers of 1 to 3, inclusive, with the proviso that t is 1 when L is a heteroatom group. Also provided are processes for preparing the silane compositions and rubber composition comprising the silane compositions.
Abstract:
A method for increasing the hardness of silica/rubber mixtures is disclosed wherein the method comprises blending with said mixture at least one silane and a hardness-increasing amount of at least one member selected from the group consisting of thixotropic fumed silica; precipitated silica; an MQ resin wherein Q is SiO4/2, M is R1R2R3SiO1/2, and R1, R2, and R3 are the same or different functional or non-functional organic groups; carbon black; a thermoplastic resin; and a thermosetting resin.
Abstract:
Solid state memory modules are disclosed having increased density for module size/footprint. Different embodiments also provide for improved interconnect arrangements between the memory modules and the corresponding field programmable gate array (FPGA), micro-processor (μP), or application-specific integrated circuit (ASIC). These interconnects provide for greater module interconnect flexibility, operating speed and operating efficiency. Some memory module embodiments according to the present invention comprises a plurality of solid state memory devices arranged on a first printed circuit board. A second printed circuit board is on and electrically connected to the first printed circuit board, with the second printed circuit board having a pin-out for direct coupling to a host device.