Method for inspecting defect and apparatus for inspecting defect
    14.
    发明授权
    Method for inspecting defect and apparatus for inspecting defect 有权
    检查缺陷的方法和缺陷检查装置

    公开(公告)号:US07586594B2

    公开(公告)日:2009-09-08

    申请号:US11770217

    申请日:2007-06-28

    IPC分类号: G01N21/00

    摘要: The present invention is an apparatus for inspecting foreign particles/defects, comprises an illumination optical system, a detection optical system, a shielding unit which is provided in said detection optical system to selectively shield diffracted light pattern coming from circuit pattern existing on an inspection object and an arithmetic processing system, wherein said shielding unit comprises a micro-mirror array device or a reflected type liquid crystal, or a transmission type liquid crystal, or an object which is transferred a shielding pattern to an optical transparent substrate, or a substrate or a film which is etched so as to leave shielding patterns, or an optical transparent substrate which can be changed in transmission by heating, sudden cold, or light illumination, or change of electric field or magnetic field, or a shielding plate of cylindrical shape or plate shape.

    摘要翻译: 本发明是用于检查异物的缺陷的装置,包括照明光学系统,检测光学系统,屏蔽单元,其设置在所述检测光学系统中,以选择性地屏蔽来自存在于检查对象上的电路图案的衍射光图案 以及算术处理系统,其中所述屏蔽单元包括微镜阵列器件或反射型液晶或透射型液晶,或将屏蔽图案转印到光学透明基板或基板或 蚀刻以留下屏蔽图案的薄膜,或通过加热,突然冷或光照射或电场或磁场的变化或透镜中的可变化的光学透明基板或圆柱形的屏蔽板或 板形。

    INSPECTION APPARATUS AND INSPECTION METHOD
    15.
    发明申请
    INSPECTION APPARATUS AND INSPECTION METHOD 有权
    检查装置和检查方法

    公开(公告)号:US20090140180A1

    公开(公告)日:2009-06-04

    申请号:US12272211

    申请日:2008-11-17

    IPC分类号: G01N21/88

    摘要: Reflected light caused by the state of the surface of a wafer, a foreign material or a defect is superimposed on a haze frequency component caused by the type and thickness of a film or a surface irregularity. It has therefore been difficult to accurately measure the haze frequency component by use of a fixed threshold value. In order to detect a haze frequency component caused by a haze present on the surface of an object to be inspected, light propagating from the object to be inspected is detected and converted into an electric signal. The electric signal is sampled at a predetermined sampling time interval and converted into digital data. A frequency component caused by a foreign material, a defect or the like is separated from the digital data to ensure that a haze frequency component is selected. The haze frequency component is caused by a stain attached to the surface of the wafer, hazy tarnish, a surface irregularity or the like.

    摘要翻译: 由晶片表面的状态,异物或缺陷引​​起的反射光叠加在由膜的类型和厚度或表面不规则性引起的雾度频率分量上。 因此,难以通过使用固定的阈值来精确地测量雾度频率分量。 为了检测由待检查物体的表面上存在的雾度引起的雾度频率分量,检测从被检查物体传播的光,并将其转换为电信号。 以预定的采样时间间隔采样电信号并将其转换为数字数据。 由异物引起的频率分量,缺陷等与数字数据分离,以确保选择雾度频率分量。 雾度频率分量由附着在晶片表面的污迹,模糊晦暗,表面不规则等引起。

    Method and its apparatus for inspecting particles or defects of a semiconductor device
    18.
    发明申请
    Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
    用于检查半导体器件的颗粒或缺陷的方法及其装置

    公开(公告)号:US20050024633A1

    公开(公告)日:2005-02-03

    申请号:US10933977

    申请日:2004-09-03

    IPC分类号: G01N21/88 G01N21/94

    摘要: Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.

    摘要翻译: 通常,作为检测结果,粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。 对于制造过程中的故障采取对策,分析检查装置检测到的颗粒/缺陷。 由于检查装置输出大量检测到的粒子/缺陷,所以需要巨大的时间来分析检测到的粒子/缺陷,从而导致制造过程中的失败的对策的延迟。 在本发明中,用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。 数据处理电路从检查结果统计中指出故障原因,并显示检查结果信息。 通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析,以统计学评价检测出的粒子。

    Defect inspection method, low light detecting method and low light detector
    19.
    发明授权
    Defect inspection method, low light detecting method and low light detector 有权
    缺陷检测方法,低光检测方法和低光检测器

    公开(公告)号:US09588054B2

    公开(公告)日:2017-03-07

    申请号:US13882542

    申请日:2011-10-14

    摘要: A defect inspection method includes an illumination light adjustment step of adjusting light emitted from a light source, an illumination intensity distribution control step of forming light flux obtained in the illumination light adjustment step into desired illumination intensity distribution, a sample scanning step of displacing a sample in a direction substantially perpendicular to a longitudinal direction of the illumination intensity distribution, a scattered light detection step of counting the number of photons of scattered light emitted from plural small areas in an area irradiated with illumination light to produce plural scattered light detection signals corresponding to the plural small areas, a defect judgment step of processing the plural scattered light detection signals to judge presence of a defect, a defect dimension judgment step of judging dimensions of the defect in each place in which the defect is judged to be present and a display step of displaying a position on sample surface and the dimensions of the defect in each place in which the defect is judged to be present.

    摘要翻译: 缺陷检查方法包括调整从光源发出的光的照明光调节步骤,将在所述照明光调节步骤中获得的光束形成为期望的照度分布的照度分布控制步骤,将样品置换的样本扫描步骤 在与照明强度分布的长度方向大致正交的方向上,对从照明光照射的区域的多个小区域发射的散射光的光数进行计数,生成与多个散射光检测信号对应的散射光检测信号的散射光检测步骤 多个小区域,处理多个散射光检测信号以判断缺陷的存在的缺陷判断步骤,判断存在缺陷的每个位置的缺陷的尺寸的缺陷维度判断步骤和显示 显示位置的步骤o n样品表面和缺陷的每个位置的缺陷的尺寸。

    Inspecting apparatus and an inspecting method
    20.
    发明授权
    Inspecting apparatus and an inspecting method 有权
    检查仪器和检查方法

    公开(公告)号:US08831899B2

    公开(公告)日:2014-09-09

    申请号:US13127051

    申请日:2009-10-15

    摘要: A system and method for determining measurement results of a dark-field inspection apparatus up to a microscopic area. A dark-field inspection apparatus is calibrated using a reference wafer having microroughness of an irregular asperity pattern accurately formed on a surface, and the microroughness of the surface having an ensured microroughness degree. This microroughness is measured by using an AFM, and an expected haze value is obtained based on the measured value. Then, haze of the surface of the reference wafer is measured by the dark-field inspection apparatus to be inspected to obtain an actually-measured haze value, and a difference between the expected haze value and the actually-measured haze value is obtained. Based on this difference, a haze measurement parameter of the dark-field inspection apparatus is adjusted so that the actually-measured haze value and the expected haze value match each other.

    摘要翻译: 用于确定暗视场检查装置的测量结果直到微观区域的系统和方法。 使用具有精确形成在表面上的不规则凹凸图案的微粗糙度的参考晶片校准暗场检查装置,并且具有确保的微粗糙度的表面的微粗糙度。 通过使用AFM测量该微粗糙度,并且基于测量值获得预期雾度值。 然后,通过需要检查的暗视野检查装置测量参考晶片的表面的雾度,以获得实际测得的雾度值,并获得预期雾度值和实际测得的雾度值之间的差。 基于该差异,调整暗场检查装置的雾度测量参数,使得实际测量的雾度值和预期雾度值彼此匹配。