Method for detecting abnormality in hydraulic system of molding machine
and apparatus therefor
    13.
    发明授权
    Method for detecting abnormality in hydraulic system of molding machine and apparatus therefor 失效
    成型机液压系统异常检测方法及其设备

    公开(公告)号:US5445773A

    公开(公告)日:1995-08-29

    申请号:US297908

    申请日:1994-08-18

    申请人: Tsuyoshi Arai

    发明人: Tsuyoshi Arai

    摘要: A method for detecting an abnormality of a hydraulic system in a molding machine which comprises a hydraulic cylinder for reciprocating a movable member of the molding machine, a valve for controlling a hydraulic fluid which is supplied into the hydraulic cylinder, and a pair of pressure sensors attached to the hydraulic cylinder, for detecting the pressures in a pair of pressure chambers of the hydraulic cylinder, is disclosed. The method comprises the steps of: holding the valve at a neutral position, and comparing the pressures in the pair of pressure chambers with a preset range of pressure on the basis of detecting signals from the pair of pressure sensors, when the movable member is inoperative; and outputting an abnormality signal when at least one of the pressures in the pair of pressure chambers is out of the preset range of pressure.

    摘要翻译: 一种用于检测成型机中的液压系统异常的方法,包括:用于使成型机的可移动部件往复运动的液压缸,用于控制供给到液压缸中的液压流体的阀和一对压力传感器 公开了用于检测液压缸的一对压力室中的压力的​​液压缸附接到液压缸。 该方法包括以下步骤:将阀保持在中立位置,并且基于来自一对压力传感器的信号,当可动件不起作用时,将压力室对中的压力与预设的压力范围进行比较 ; 并且当所述一对压力室中的至少一个压力超出预定的压力范围时,输出异常信号。

    SEMICONDUCTOR MODULE WITH RESIN-MOLDED PACKAGE OF HEAT SPREADER AND POWER SEMICONDUCTOR CHIP
    16.
    发明申请
    SEMICONDUCTOR MODULE WITH RESIN-MOLDED PACKAGE OF HEAT SPREADER AND POWER SEMICONDUCTOR CHIP 审中-公开
    具有树脂模制的散热器和功率半导体芯片封装的半导体模块

    公开(公告)号:US20110316142A1

    公开(公告)日:2011-12-29

    申请号:US13166101

    申请日:2011-06-22

    IPC分类号: H01L23/34

    摘要: A semiconductor module is provided which includes a resin molded package which is made by a resinous mold assembly. The resin molded package is clamped by covers through a fastener to make the semiconductor module. The resinous mold assembly has formed therein a coolant path that is a portion of a coolant passage through which a coolant flows to coal a semiconductor chip embedded in the resin molded package. The resinous mold assembly is made up of a first mold and a second mold. The first mold has the semiconductor chip, heat spreaders, and electric terminals embedded therein. The second mold is wrapped around an outer periphery of the first mold. The second mold is made of resin which is lower in softening temperature than that of the first mold, thereby facilitating ease of removing the first mold from the resin molded package for reusing the resin molded package.

    摘要翻译: 提供一种半导体模块,其包括由树脂模组件制成的树脂模制包装。 树脂模制包装通过紧固件由盖子夹紧以制造半导体模块。 树脂模具组件中形成有冷却剂路径,冷却剂路径是冷却剂通道的一部分,冷却剂通过该冷却剂通道流入煤以嵌入在树脂模制包装中的半导体芯片。 树脂模具组件由第一模具和第二模具构成。 第一模具具有嵌入其中的半导体芯片,散热器和电气端子。 第二模具围绕第一模具的外周缠绕。 第二模具由比第一模具的软化温度低的树脂制成,从而便于从树脂模制包装中去除第一模具以便重新使用树脂模制包装。

    Method of molding hollow component with high strength and sealability and the hollow component
    19.
    发明授权
    Method of molding hollow component with high strength and sealability and the hollow component 有权
    具有高强度和密封性的中空部件的成型方法和中空部件

    公开(公告)号:US07604764B2

    公开(公告)日:2009-10-20

    申请号:US10850597

    申请日:2004-05-19

    IPC分类号: B29C45/14 B28B7/22 B29C45/00

    摘要: Division members (31, 32) separately molded to form a hollow component are brought into contact with each other and are arranged in dies (14, 24). The peripheral edge of the contact parts is formed with a peripheral edge path (330) to be filled with a molten resin. In the peripheral edge path (330), protrusions (316, 326) are projected from the division members (31, 32) continuously over the whole periphery of the peripheral edge path (330). The molten resin is filled in the peripheral edge path 330, and is welded with the protrusions (316, 326). As a result, a weld structure is obtained in which portions having a high welding strength are continuously formed over the whole periphery of the peripheral edge path (330).

    摘要翻译: 分别成型为中空部件的分割部件(31,32)彼此接触并设置在模具(14,24)中。 接触部分的周缘形成有待熔融树脂填充的周边边缘路径(330)。 在圆周边缘路径330中,突出部316,326从分割部件31,32连续地突出在周边路径330的整个周边。 熔融树脂填充在周缘路径330中,并与突起(316,326)焊接。 结果,获得了在周边路径(330)的整个周边上连续地形成焊接强度高的部分的焊接结构。