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    Fixture and method for attaching components
    12.
    发明授权
    Fixture and method for attaching components 失效
    夹具和附件的方法

    公开(公告)号：US5240549A

    公开(公告)日：1993-08-31

    申请号：US722972

    申请日：1991-06-28

    申请人： William Hamburgen ,  John S. Fitch

    发明人： William Hamburgen ,  John S. Fitch

    IPC分类号： H01L21/00

    CPC分类号： H01L21/67121 ,  B32B37/10 ,  Y10T156/1092

    摘要： A fixture (10) for bonding multiple components together includes a bottom plate (20), a middle plate (22) and a top plate (24). The plates (20), (22) and (24) are aligned by dowels (26) and clamps (30). Bottom plate (20) has a rectangular pocket (32) for holding heat sink (14) and alignment pins (34) for locating plastic pin grid array (PPGA) package (12) over the heat sink (14). An annular projection (40) covered with a conformal pad (42) extends from bottom surface (44) of the middle plate (22). Dowel (50) extends through openings (46) and (36) in the top and middle plates (24) and (22) to apply pressure to chip (16). A first spring (56) is mounted on the dowel (50) and compressed between the top plate (24) and a snap ring (58) to provide pressure from the dowel (50) on the chip (16). A second, larger diameter spring (60) is compressed between the middle plate (22) and the top plate (24) to provide pressure from the middle plate (22) on the PPGA (12). Cartridge heaters (62) are embedded in the bottom plate (20) to provide heat for epoxy or solder bonding. A thermocouple (64) monitors temperature at the bottom plate (20).

    摘要翻译： 用于将多个部件结合在一起的夹具（10）包括底板（20），中间板（22）和顶板（24）。 板（20），（22）和（24）通过榫钉（26）和夹具（30）对准。 底板（20）具有用于保持散热器（14）和用于将塑料针格栅阵列（PPGA）封装（12））定位在散热器（14）上的对准销（34）的矩形袋（32）。 覆盖有保形垫（42）的环形突起（40）从中间板（22）的底表面（44）延伸。 定位销（50）延伸穿过顶部和中间板（24）和（22）中的开口（46）和（36）以向芯片（16）施加压力。 第一弹簧（56）安装在定位销（50）上并在顶板（24）和卡环（58）之间被压缩，以从芯片（16）上的定位销（50）提供压力。 第二个较大直径的弹簧（60）在中间板（22）和顶板（24）之间被压缩，以提供来自PPGA（12）上的中间板（22）的压力。 筒式加热器（62）嵌入在底板（20）中以提供用于环氧树脂或焊料粘结的热量。 热电偶（64）监测底板（20）处的温度。

    Color shifting pumped-phosphor light emitting diode light sources via modulation of current pulses
    13.
    发明授权
    Color shifting pumped-phosphor light emitting diode light sources via modulation of current pulses 有权
    通过调制电流脉冲对色移磷光体发光二极管光源进行调色

    公开(公告)号：US08981665B1

    公开(公告)日：2015-03-17

    申请号：US13156110

    申请日：2011-06-08

    申请人： William Hamburgen ,  Ken Foo

    发明人： William Hamburgen ,  Ken Foo

    IPC分类号： H05B37/02

    CPC分类号： H05B33/0872 ,  H05B33/0866

    摘要： A light source can include an LED configured to emit light having a spectrum of first wavelengths when provided with electrical current, a pumped material configured to absorb at least some of the light emitted by the LED and to emit light having a spectrum of second wavelengths, a power supply configured to provide a series of electrical current pulses to the LED, and a current controller configured to control a time-averaged chromaticity coordinate of a combination of light emitted from the LED and the pumped material by controlling the series of current pulses provided to the LED.

    摘要翻译： 光源可以包括被配置为在被提供有电流时发射具有第一波长谱的光的LED;被配置成吸收LED发射的至少一些光并发射具有第二波长光谱的光的泵浦材料， 电源，被配置为向LED提供一系列电流脉冲;以及电流控制器，其被配置为通过控制提供的一系列电流脉冲来控制从LED发射的光的组合和所泵送的材料的时间平均色度坐标 到LED。

    STRUCTURAL BACKLIGHTING
    14.
    发明申请
    STRUCTURAL BACKLIGHTING 审中-公开
    结构背光

    公开(公告)号：US20150022755A1

    公开(公告)日：2015-01-22

    申请号：US13156968

    申请日：2011-06-09

    申请人： William Hamburgen ,  Amy Han

    发明人： William Hamburgen ,  Amy Han

    IPC分类号： G02F1/1335 ,  H01J9/24

    CPC分类号： G02F1/133603 ,  G02F1/133606 ,  G02F1/133608 ,  G02F2001/133601 ,  G02F2202/28

    摘要： A display assembly includes a display member and backlight member. The backlight member has a light source and is bonded directly to the display member. The backlight member can be bonded directly to a display area of the display member, and an optically transparent adhesive can be used to bond a first surface of the backlight member to a first surface of the display member.

    摘要翻译： 显示组件包括显示构件和背光构件。 背光部件具有光源并且直接粘接到显示部件。 背光部件可以直接接合到显示部件的显示区域，并且可以使用光学透明的粘合剂将背光部件的第一表面粘合到显示部件的第一表面。

    Modular computing environments
    15.
    发明授权
    Modular computing environments 有权
    模块化计算环境

    公开(公告)号：US08743543B2

    公开(公告)日：2014-06-03

    申请号：US13544839

    申请日：2012-07-09

    申请人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

    发明人： Jimmy Clidaras ,  William Whitted ,  William Hamburgen ,  Montgomery Sykora ,  Winnie Leung ,  Gerald Aigner ,  Donald L. Beaty

    IPC分类号： H05K7/20 ,  F25D23/12 ,  F28F7/00 ,  B60F1/00 ,  G06F15/16 ,  G06F13/00

    CPC分类号： H05K7/202 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/1497 ,  H05K7/20754 ,  H05K7/2079

    摘要： A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releaseably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

    摘要翻译： 计算机系统可以包括具有多个对接区域并且被配置为向每个对接区域提供电力，数据网络接口，冷却流体供应和冷却流体返回的连接毂; 以及多个运输容器，每个运输容器都包围向计算机系统增加计算能力的模块化计算环境。 每个运输容器可以包括：a）耦合到数据网络接口的多个处理单元，每个处理单元包括微处理器; b）热交换器，其被配置为通过使来自所述供应器的冷却流体通过所述热交换器循环并将其排出到所述回流中来除去由所述多个处理单元产生的热量; 以及c）对接构件，其构造成在一个对接区域处可释放地联接到所述连接毂，以接收电力，连接到所述数据网络接口，以及接收和排出冷却流体。

    Changing data center cooling modes
    17.
    发明授权
    Changing data center cooling modes 有权
    更改数据中心冷却模式

    公开(公告)号：US07864530B1

    公开(公告)日：2011-01-04

    申请号：US12059569

    申请日：2008-03-31

    申请人： William Hamburgen ,  Jimmy Clidaras ,  Andrew B. Carlson

    发明人： William Hamburgen ,  Jimmy Clidaras ,  Andrew B. Carlson

    IPC分类号： H05K7/20

    CPC分类号： H05K7/2079 ,  H05K7/20827

    摘要： A method of providing utilities to a computer data center is discussed. The method includes initially connecting one or more non-evaporative cooling units to a data center as primary cooling plants, obtaining a government-issued water permit, and after obtaining the government-issued water permit, transitioning primary cooling for the data center to one or more evaporative cooling towers.

    摘要翻译： 讨论了向计算机数据中心提供实用程序的方法。 该方法包括首先将一个或多个非蒸发冷却单元连接到作为主要冷却设备的数据中心，获得政府颁发的水许可证，并且在获得政府颁发的水许可证之后，将数据中心的主要冷却转换为一个或 更多蒸发冷却塔。

    Data Center Uninterruptible Power Distribution Architecture
    19.
    发明申请
    Data Center Uninterruptible Power Distribution Architecture 有权
    数据中心不间断配电架构

    公开(公告)号：US20090206670A1

    公开(公告)日：2009-08-20

    申请号：US12432567

    申请日：2009-04-29

    申请人： William Whitted ,  Montgomery Sykora ,  Ken Krieger ,  Benchiao Jai ,  William Hamburgen ,  Jimmy Clidaras ,  Donald L. Beaty ,  Gerald Aigner

    发明人： William Whitted ,  Montgomery Sykora ,  Ken Krieger ,  Benchiao Jai ,  William Hamburgen ,  Jimmy Clidaras ,  Donald L. Beaty ,  Gerald Aigner

    IPC分类号： H02J9/00

    CPC分类号： G06F1/30 ,  H02J9/061 ,  Y02B10/72 ,  Y10T307/615 ,  Y10T307/625

    摘要： Apparatus and associated method and computer program products involve a highly efficient uninterruptible power distribution architecture to support modular processing units. As an illustrative example, a modular processing unit includes an corresponding uninterruptible power system in which only one AC-to-DC rectification occurs between the utility AC grid and the processing circuit (e.g., microprocessor) loads. In an illustrative data center facility, a power distribution architecture includes a modular array of rack-mountable processing units, each of which has processing circuitry to handle network-related processing tasks. Associated with each modular processing unit is an uninterruptible power supply (UPS) to supply operating power to the network processing circuitry. Each UPS includes a battery selectively connectable across a DC bus, and a AC-to-DC rectifier that converts an AC input voltage to a single output voltage on the DC bus. The regulated DC bus voltage may be close to the battery's fully charged voltage.

    摘要翻译： 装置和相关方法以及计算机程序产品涉及一种高效的不间断配电架构来支持模块化处理单元。 作为说明性示例，模块化处理单元包括相应的不间断电力系统，其中在公用交流电网和处理电路（例如，微处理器）负载之间仅发生一个AC至DC整流。 在说明性数据中心设施中，配电架构包括可机架安装的处理单元的模块化阵列，每个处理单元具有处理网络相关处理任务的处理电路。 与每个模块化处理单元相关联的是不间断电源（UPS），用于向网络处理电路提供工作电源。 每个UPS包括可以跨DC总线选择性连接的电池，以及将AC输入电压转换为DC总线上的单个输出电压的AC至DC整流器。 调节的直流母线电压可能接近电池的完全充电电压。

    Data Center Air Circulation
    20.
    发明申请
    Data Center Air Circulation 有权
    数据中心空气循环

    公开(公告)号：US20080055850A1

    公开(公告)日：2008-03-06

    申请号：US11757348

    申请日：2007-06-01

    申请人： Andrew Carlson ,  William Hamburgen ,  Jimmy Clidaras

    发明人： Andrew Carlson ,  William Hamburgen ,  Jimmy Clidaras

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20136 ,  A62C3/16 ,  G06F1/20 ,  H05K7/1497 ,  H05K7/20727 ,  H05K7/20736

    摘要： A method for cooling electronic equipment can include flowing cooling air across a plurality of computer units and into a common warm air plenum located at a first end of the computer units; flowing air from the warm air plenum through one or more cooling units, and into an area located at a second end of the computer units; and controlling a flow rate of air out of the warm air plenum to maintain a predetermined pressure differential between the second end of the computer units and the first end of the computer units.

    摘要翻译： 用于冷却电子设备的方法可以包括使冷却空气流过多个计算机单元并进入位于计算机单元的第一端的公共暖风增压室; 流动的空气从暖空气通风室通过一个或多个冷却单元，并进入位于计算机单元的第二端的区域; 以及控制空气流出热空气通风室的流量，以在计算机单元的第二端和计算机单元的第一端之间保持预定的压力差。