Abstract:
A perpendicular magnetic recording system has a write head with a main perpendicular write pole connected to a yoke with first and second electrical coils. The first coil is wrapped around the yoke on one side of the main pole, and the second coil is wrapped around the yoke on the other side of the main pole. The first end of each coil is connected to a respective terminal. The second ends of the two coils are connected together and connected to a common terminal. A lead-time circuit is connected between the common terminal and the first end of one of the coils. Immediately after the direction of write current is switched by the write driver, the lead-time circuit causes the current in one of the coils to lead the current in the other coil. The current displacement between the two coils creates a precession of the magnetic flux reversal, thereby reducing the switching time of the write head.
Abstract:
An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.
Abstract:
An apparatus and method for reducing solder pad size and forming an opening in a base-metal layer of an electrical lead suspension. The method provides a base-metal layer having at least one opening. A dielectric layer is provided above the base-metal layer the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the size of the solder pad portion and an amount of solder applied to the solder pad portion are reduced, the solder pad portion aligned above the dielectric layer covering at least one of the openings in the base-metal layer such that the solder pad to a ground capacitance is reduced thereby providing low signal reflection losses and a decrease in cross-talk.
Abstract:
A method and apparatus is provided for extending a read bandwidth and increasing a high-frequency signal-to-noise ratio (SNR) of a front-end of a read path of a hard disk drive (HDD) by introducing a high impedance section at the front-end of the read path. The high impedance section may mitigate capacitive effects found at the front-end of the read path, thereby improving signal transfer by extending the read bandwidth.
Abstract:
A perpendicular magnetic recording write head that a write pole, an electrically conductive coil coupled to the write pole for generating magnetic flux in the write pole in the presence of electrical write current, and a spin torque oscillator (STO) that injects auxiliary magnetic flux to the write pole in a direction generally orthogonal to the write pole to facilitate magnetization switching of the write pole. The STO comprises a stack of layers including electrodes, a pinned ferromagnetic layer having a fixed, a free ferromagnetic layer having a magnetization free to rotate, and a nonmagnetic spacer layer between the pinned and free layers. The free layer may be oriented either substantially orthogonal to the write pole or substantially parallel to the write pole, in which latter embodiment a flux guide may be located between the free layer and the write pole for directing the auxiliary magnetic flux from the free layer to the write pole.
Abstract:
A perpendicular magnetic recording write head that a write pole, an electrically conductive coil coupled to the write pole for generating magnetic flux in the write pole in the presence of electrical write current, and a spin torque oscillator (STO) that injects auxiliary magnetic flux to the write pole in a direction generally orthogonal to the write pole to facilitate magnetization switching of the write pole. The STO comprises a stack of layers including electrodes, a pinned ferromagnetic layer having a fixed, a free ferromagnetic layer having a magnetization free to rotate, and a nonmagnetic spacer layer between the pinned and free layers. The free layer may be oriented either substantially orthogonal to the write pole or substantially parallel to the write pole, in which latter embodiment a flux guide may be located between the free layer and the write pole for directing the auxiliary magnetic flux from the free layer to the write pole.
Abstract:
An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.
Abstract:
An apparatus and method for extending a cover layer formation with respect to a solder pad portion on an electrical lead suspension (ELS). The method provides a base-metal layer for the ELS. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion. A cover layer is also provided over the portions of the dielectric layer not having a solder pad portion thereon, the cover layer reducing the possibility of forming an unwanted electric bridge and reducing damage to the dielectric layer during a solder reflow process.