-
公开(公告)号：US20240316727A1
公开(公告)日：2024-09-26
申请号：US18124871
申请日：2023-03-22
Applicant: Yield Engineering Systems, Inc.
Inventor： M Ziaul Karim , Dragan Cekic
Abstract: A method of removing a coating from a substrate comprises positioning a nozzle of an apparatus such that a longitudinal axis of a distal end of the nozzle is inclined at an angle θ with a coated surface of the substrate. The nozzle including an inner conduit having an orifice and an outer conduit coaxially arranged about the inner conduit and defining an annular opening between the inner and outer conduits. Directing a liquid stream through the orifice toward the coated surface and directing a gas flow through the annular opening such that the gas flow surrounds the liquid stream, and impinging the liquid stream on the coated surface.
-
公开(公告)号：US12042827B1
公开(公告)日：2024-07-23
申请号：US18203401
申请日：2023-05-30
Applicant: Yield Engineering Systems, Inc.
Inventor： Louis Navarro , Venugopal Govindarajulu , Dragan Cekic , M Ziaul Karim
CPC classification number: B08B3/12 , H01L21/67057 , B08B2203/007
Abstract: A cleaning device includes a tank configured to contain a cleaning liquid and one or more substrates in the cleaning liquid. A megasonic transducer array is coupled to the tank and configured to direct megasonic frequency waves to surfaces of the substrates. Multiple pairs of ultrasonic transducers are also coupled to the tank and configured to direct ultrasonic frequency waves to surfaces of the substrates. The megasonic transducer array includes a support plate with a plurality of megasonic transducers and a central plane that extends perpendicular to the support plate. The multiple pairs of ultrasonic transducers are arranged in a mirror symmetric manner on opposite sides of the central plane.
-
13.发明授权公开(公告)号：US11919036B1
公开(公告)日：2024-03-05
申请号：US18232090
申请日：2023-08-09
Applicant: Yield Engineering Systems, Inc.
Inventor： Kenneth Sautter
CPC classification number: B05D1/60 , B05D3/102 , H05K3/386 , H05K3/389 , B05D2202/45 , B05D2518/00 , Y10T29/49155
Abstract: A method of improving the adhesion of a metal-organic interface in an electronic device includes providing a substrate with a metal structure, treating a surface of the metal structure to form a monolayer coating of a selected chemical composition on the surface, and coating the treated surface with an organic material.
-
公开(公告)号：US20190109022A1
公开(公告)日：2019-04-11
申请号：US16174260
申请日：2018-10-29
Applicant: YIELD ENGINEERING SYSTEMS, INC.
Inventor： WILLIAM MOFFAT
Abstract: A process for the drying, and subsequent imidization, of polyimide precursors which minimizes or eliminates voids and which minimizes or eliminates discoloration. The process uses a sequential set of descending pressure operations that allow for time efficient processing of wafers. The set of descending pressure operations are interspersed with evacuation processes using heated gasses, which combine heating and byproduct evacuation. The process results in layers with reduced or eliminated voiding, discoloration, and solvent retention.
-
公开(公告)号：US20180292122A1
公开(公告)日：2018-10-11
申请号：US15812753
申请日：2017-11-14
Applicant: YIELD ENGINEERING SYSTEMS, INC.
Inventor： WILLIAM MOFFAT , CRAIG WALTER MCCOY
Abstract: A trap system adapted to trap polyimide or other vapors exiting from a process chamber. The vapors are routed from the process chamber through a heated exit line at low pressure and then cooled, resulting in condensation at a selected location. The condensed vapors accumulate in a liquid trap. A method of condensing polymer vapors in vacuum exit lines of process chambers, where the flow which may have vaporized polymer vapor is cooled to enhance condensation at a chosen location. The liquid trap can be emptied and replaced, resulting in the removal of the condensed liquid. The chamber exit lines are protected from condensation build up.
-
Patent Agency Ranking
公开(公告)号：US20250105036A1
公开(公告)日：2025-03-27
申请号：US18373394
申请日：2023-09-27
Applicant: Yield Engineering Systems, Inc.
Inventor： Venugopal Govindarajulu , M Ziaul Karim , Coby Tao
IPC: H01L21/67 , H01L21/3213
Abstract: A system and a method of wet processing includes receiving real-time signals indicative of one or more of a pH, a temperature, and an electrical conductivity of a liquid chemical in a wet processing tank, and determining values of one or more of a composition, a flow rate, and the temperature of the liquid chemical that will improve or maintain an etch rate of the liquid chemical in the wet processing tank. One or more of the composition, the flow rate, and the temperature of the liquid chemical in the wet processing tank may then be adjusted to the determined values.
-
公开(公告)号：US20250025987A1
公开(公告)日：2025-01-23
申请号：US18908316
申请日：2024-10-07
Applicant: Yield Engineering Systems, Inc.
Inventor： M Ziaul Karim , Dragan Cekic
Abstract: An apparatus for removing a coating from a substrate comprises a nozzle with an inner conduit having an orifice and an outer conduit coaxially arranged about the inner conduit and defining an annular opening between the inner and outer conduits. The nozzle is configured to direct a liquid stream through the orifice toward the coated surface and direct a gas flow through the annular opening such that the gas flow surrounds the liquid stream as the liquid stream moves towards the coated surface.
-
公开(公告)号：US11850672B2
公开(公告)日：2023-12-26
申请号：US17872320
申请日：2022-07-25
Applicant: Yield Engineering Systems, Inc.
Inventor： Lei Jing , M Ziaul Karim , Kenneth Sautter , Kang Song
IPC: B23K1/015 , B23K1/008 , B23K3/08 , H01L23/00 , B23K101/42 , B23K101/40 , B23K1/012 , H01L21/60 , B23K1/00
CPC classification number: B23K1/015 , B23K1/008 , B23K3/085 , H01L24/742 , H01L24/75 , B23K1/0016 , B23K1/012 , B23K2101/40 , B23K2101/42 , H01L2021/60007 , H01L2021/6027 , H01L2021/60135 , H01L2224/75272 , H01L2224/75283
Abstract: A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.
-
公开(公告)号：US20230117184A1
公开(公告)日：2023-04-20
申请号：US17505930
申请日：2021-10-20
Applicant: Yield Engineering Systems, Inc.
Inventor： M. Ziaul Karim , Christopher Lane
IPC: H01L21/67 , H01L21/677
Abstract: A batch processing oven includes a processing chamber, a magnet, and a rack. The processing chamber includes a gas inlet on a first side and a gas outlet on a second side opposite the first side, the gas inlet is configured to direct a hot gas into the processing chamber and the gas outlet is configured to exhaust the convective energy in parallel with the radiative energy from the walls. The magnet is arranged such that its north pole will be formed on the first side of the processing chamber and its south pole will be formed on the second side of the processing chamber. The rack is configured to be positioned between the first and second ends of the processing chamber and is configured to support a plurality of vertically spaced-apart substrates.
-
公开(公告)号：US20210398937A1
公开(公告)日：2021-12-23
申请号：US17464863
申请日：2021-09-02
Applicant: Yield Engineering Systems, Inc.
Inventor： M Ziaul Karim , Randy Hall , Peter Krotov
Abstract: A solder reflow oven may include a reflow chamber and a plurality of vertically spaced apart wafer-support plates positioned in the reflow chamber. A plurality of semiconductor wafers each including a solder are configured to be disposed in the reflow chamber such that each semiconductor wafer is disposed proximate to, and vertically spaced apart from, a wafer-support plate. Each wafer-support plate may include at least one of liquid-flow channels or resistive heating elements. A control system control the flow of a hot liquid through the channels or activate the heating elements to heat a wafer to a temperature above the solder reflow temperature.
-
-
-
-
-
-
-
-
-
Search Results
44
records
(took 0.131 seconds)
