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公开(公告)号:US07432213B2
公开(公告)日:2008-10-07
申请号:US11198117
申请日:2005-08-04
Applicant: Wen-Hui Peng , Chien-Chung Chen , Yu-Ching Chen
Inventor: Wen-Hui Peng , Chien-Chung Chen , Yu-Ching Chen
IPC: H01L23/48
CPC classification number: G02F1/13452 , G02F1/13458 , G09G3/3648 , G09G2300/0426 , H01L2224/73204 , H05K1/111 , H05K3/323 , H05K2201/09409 , H05K2201/09709 , H05K2201/10674 , Y02P70/611
Abstract: A connector layout for arranging a plurality of parallel electrical connectors between two electronic devices. Each connector has a strip connected to a bump pad. Each strip has a certain required strip width and each bump pad has a certain required pad width. Each bump pad on one electronic device is electrically connected to a corresponding bump pad on the other device by superimposition. The connectors are grouped into a group of three or more. Within each group, a strip is connected to a bump pad along one side edge thereof, and the bump pads are offset in two directions such that after the bump pads are superimposed, the pattern of the connected connectors in each group of connectors resembles a plurality of zigzag paths offset to maintain a constant gap between two strips. As such, the gap between two connectors can be minimized.
Abstract translation: 一种用于在两个电子设备之间布置多个并联电连接器的连接器布局。 每个连接器具有连接到凸块垫的条。 每个条具有一定要求的条宽度,并且每个焊盘具有一定的所需焊盘宽度。 一个电子设备上的每个凸块焊盘通过叠加电连接到另一个设备上的相应的凸块焊盘。 连接器分为三组或更多组。 在每个组中,条带沿其一个侧边缘连接到凸块焊盘,并且凸块焊盘在两个方向上偏移,使得在凸块焊盘重叠之后,每组连接器中连接的连接器的图案类似于多个 之字形路径偏移以保持两条之间的恒定间隙。 因此,两个连接器之间的间隙可以最小化。
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公开(公告)号:US20140007709A1
公开(公告)日:2014-01-09
申请号:US13544019
申请日:2012-07-09
Applicant: Yong-Fen HSIEH , Chih-Hsun CHU , Pradeep SHARMA , Yu-Feng KO , Chung-Shi YANG , Lin-Ai TAI , Yu-Ching CHEN
Inventor: Yong-Fen HSIEH , Chih-Hsun CHU , Pradeep SHARMA , Yu-Feng KO , Chung-Shi YANG , Lin-Ai TAI , Yu-Ching CHEN
CPC classification number: H01J37/261 , B01L3/508 , B01L2200/0678 , B01L2300/0822 , G01N1/28 , G01N1/4022 , G01N23/02 , G01N2001/4027 , H01J37/16 , H01J37/20 , H01J37/222 , H01J37/3178 , H01J2237/2007 , H01J2237/2602 , H01J2237/2802
Abstract: A specimen kit having a tiny chamber is disclosed for a specimen preparation for TEM. The space height of the chamber is far smaller than dimensions of blood cells and therefore is adapted to sort nanoparticles from the blood cells. The specimen prepared under this invention is suitable for TEM observation over a true distribution status of nanoparticles in blood. The extremely tiny space height in Z direction eliminates the possibility of aggregation of the nanoparticles and/or agglomeration in Z direction during drying; therefore, a specimen prepared under this invention is suitable for TEM observation over the dispersion and/or agglomeration of nanoparticles in a blood.
Abstract translation: 公开了一种用于TEM的样品制备的具有微小室的标本试剂盒。 室的空间高度远小于血细胞的尺寸,因此适于从血细胞分选纳米颗粒。 根据本发明制备的样品适用于在血液中纳米颗粒的真实分布状态的TEM观察。 在Z方向极微小的空间高度消除了在干燥过程中纳米颗粒聚集和/或Z方向附聚的可能性; 因此,根据本发明制备的样品适用于在血液中纳米颗粒的分散和/或附聚的TEM观察。
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公开(公告)号:US11931867B2
公开(公告)日:2024-03-19
申请号:US16711949
申请日:2019-12-12
Applicant: Yu-Ching Chen
Inventor: Chih-Min Chang , Chia-Hui Peng
CPC classification number: B25B13/06 , B25B23/0035
Abstract: The present invention relates to a socket used in coordination with a wrench. The socket includes a socket main body which has a head portion and a body portion connected to the head portion. The head portion is adapted for being coupled with the wrench. The body portion has a polygonal hole for being coupled with a head portion of a bolt or a nut, so that the wrench is adapted for screwing on or off the bolt or nut through the socket main body. Besides, a pipe made of composite material is sleeved onto the external peripheral surface of the body portion. The pipe is freely detachable, and the external peripheral surface of the pipe can be provided with a print, pattern, color or character according to the practical demands, thereby attaining the effects of high variability in appearance, great durability and great recognizability.
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公开(公告)号:US20070029658A1
公开(公告)日:2007-02-08
申请号:US11445966
申请日:2006-06-01
Applicant: Wen-Hui Peng , Yu-Ching Chen
Inventor: Wen-Hui Peng , Yu-Ching Chen
IPC: H01L23/02
CPC classification number: G02F1/13452 , G02F1/13458 , G09G3/3648 , G09G2300/0426 , H01L2224/73204 , H05K1/111 , H05K3/323 , H05K2201/09409 , H05K2201/09709 , H05K2201/10674 , Y02P70/611
Abstract: A connector layout for arranging a plurality of parallel electrical connectors between two electronic devices. In one device, each connector has a strip connected to a bump pad. The bump pad is superimposed on and electrically connected to a bump pad on the other device. Each strip has a certain required strip width and each bump pad has a certain required pad width. The connectors are grouped into a group of three or more. Within each group, a strip is connected to a bump pad along one side edge thereof, and the bump pads are offset in two directions such that after the bump pads are superimposed, the pattern of the connected connectors in each group of connectors resembles a plurality of zigzag paths offset to maintain a constant gap between two strips. As such, the gap between two connectors can be minimized.
Abstract translation: 一种用于在两个电子设备之间布置多个并联电连接器的连接器布局。 在一个设备中,每个连接器具有连接到凸块焊盘的条带。 凸块焊盘叠加在另一个装置上并与其连接。 每个条具有一定要求的条宽度,并且每个焊盘具有一定的所需焊盘宽度。 连接器分为三组或更多组。 在每个组中,条带沿其一个侧边缘连接到凸块焊盘,并且凸块焊盘在两个方向上偏移,使得在凸块焊盘重叠之后,每组连接器中连接的连接器的图案类似于多个 之字形路径偏移以保持两条之间的恒定间隙。 因此,两个连接器之间的间隙可以最小化。
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