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Patent Agency Ranking
公开(公告)号：US20190143461A9
公开(公告)日：2019-05-16
申请号：US15562195
申请日：2016-03-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
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公开(公告)号：US11090768B2
公开(公告)日：2021-08-17
申请号：US14698450
申请日：2015-04-28
Applicant: ALPHA ASSEMBLY SOLUTIONS INC.
Inventor： Pritha Choudhury , Morgana De Avila Ribas , Sutapa Mukherjee , Anil Kumar , Siuli Sarkar , Ranjit Pandher , Ravi Bhatkal , Bawa Singh
IPC: B23K1/00 , B23K1/19 , C22C13/00 , C22C13/02 , B23K35/26 , H05K3/34 , B23K35/02 , B23K1/012 , B23K1/08 , B23K1/002 , B23K1/005 , B23K1/20 , B23K103/12
Abstract: A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.
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公开(公告)号：US10259980B2
公开(公告)日：2019-04-16
申请号：US14438888
申请日：2013-10-29
Applicant: Alpha Assembly Solutions Inc.
Inventor： Shamik Ghosal , Ranjit Pandher , Oscar Khaselev , Ravi Bhatkal , Rahul Raut , Bawa Singh , Morgana Ribas , Siuli Sarkar , Sutapa Mukherjee , Sathish Kumar , Remya Chandran , Pavan Vishwanath , Ashok Pachamuthu , Monnir Boureghda , Nitin Desai , Anna Lifton , Nirmalya Kumar Chaki
Abstract: A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
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公开(公告)号：US10130995B2
公开(公告)日：2018-11-20
申请号：US15302712
申请日：2015-04-10
Applicant: Alpha Assembly Solutions Inc.
Inventor： Nirmalya Kumar Chaki , Poulami Sengupta Roy , Siuli Sarkar , Sutapa Mukherjee
IPC: B22F9/24 , B22F1/00 , B22F1/02 , C09C1/62 , B22F9/04 , C09J1/00 , C09J9/02 , C09J11/04 , H01L23/00
Abstract: A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.
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公开(公告)号：US20180056455A1
公开(公告)日：2018-03-01
申请号：US15562195
申请日：2016-03-31
Applicant: Alpha Assembly Solutions Inc.
Inventor： Ramakrishna Hosur Venkatagiriyappa , Morgana De Avila Ribas , Barun Das , Harish Hanchina Siddappa , Sutapa Mukherjee , Siuli Sarkar , Bawa Singh , Rahul Raut , Ranjit Pandher
Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
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