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    CAPACITOR ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    11.
    发明申请
    CAPACITOR ASSEMBLY STRUCTURE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210175023A1

    公开(公告)日：2021-06-10

    申请号：US16920803

    申请日：2020-07-06

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHIEH LIN

    IPC: H01G9/048 ,  H01G9/042 ,  H01G9/15 ,  H01G9/08 ,  H01G4/38 ,  H01G4/002

    Abstract: A capacitor assembly structure and a method of manufacturing the same are provided. The capacitor assembly structure includes a capacitor unit, an insulative package body, a plurality of positive composite material layers, a conductive connection layer and an electrode unit. The capacitor unit includes a plurality of capacitors each having a positive portion and a negative portion. The insulative package body partially covers the capacitors. A lateral side of the positive portion is exposed from a first lateral surface of the insulative package body. Each positive composite material layer is disposed on the first lateral surface and the lateral side so as to electrically connect to the positive portion. The conductive connection layer is electrically connected to the negative portion. The electrode unit includes a first electrode structure electrically contacting the positive composite material layer and a second electrode structure electrically contacting the conductive connection layer.

    WOUND CAPACITOR PACKAGE STRUCTURE
    14.
    发明公开
    WOUND CAPACITOR PACKAGE STRUCTURE 审中-公开

    公开(公告)号：US20240153708A1

    公开(公告)日：2024-05-09

    申请号：US18170536

    申请日：2023-02-17

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHIEH LIN ,  CHUNG-JUI SU ,  CHENG-HAO LU

    IPC: H01G4/224 ,  H01G4/242 ,  H01G4/32

    CPC classification number: H01G4/224 ,  H01G4/242 ,  H01G4/32

    Abstract: A wound capacitor package structure includes a wound assembly, a conductive assembly, a package assembly, a bottom seat plate and a pin protection assembly. The conductive assembly includes a first and a second conductive pin. The package assembly is configured for enclosing the wound assembly. The bottom seat plate is disposed on a bottom side of the package assembly. The pin protection assembly includes a first pin protection layer configured to partially cover the first conductive pin, and a second pin protection layer configured to partially cover the second conductive pin. The first conductive pin includes a first exposed portion exposed outside the package assembly, and the second conductive pin includes a second exposed portion exposed outside the package assembly. The first and the second pin protection layer are disposed on the first and the second exposed portion for protecting the first and the second conductive pin, respectively.

    METHOD FOR MANUFACTURING ELECTROLYTIC CAPACITOR
    15.
    发明申请
    METHOD FOR MANUFACTURING ELECTROLYTIC CAPACITOR 有权

    公开(公告)号：US20220130619A1

    公开(公告)日：2022-04-28

    申请号：US17201233

    申请日：2021-03-15

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHIEH LIN

    IPC: H01G9/028 ,  H01G9/15 ,  H01G9/00 ,  H01G9/042 ,  C08G61/12

    Abstract: A method for manufacturing an electrolytic capacitor is provided. A crosslinking agent is applied onto a capacitor body. A solution containing a conjugated polymer is applied onto the capacitor body after applying the crosslinking agent. A part of a solvent of the solution is removed, so as to form a polymer outer layer onto the capacitor body. The capacitor body includes an electrode body, an electrode material, a dielectric layer, and a solid electrolyte. The electrode material is formed on the electrode body. A surface of the electrode material is covered by the dielectric layer. The dielectric layer is covered by the solid electrolyte. The electrode body or the solid electrolyte is formed from at least one of polythiophene having at least one sulfonic acid group and polyselenophene having at least one sulfonic acid group.

    WINDING CAPACITOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    16.
    发明申请
    WINDING CAPACITOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210391118A1

    公开(公告)日：2021-12-16

    申请号：US17022286

    申请日：2020-09-16

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHIEH LIN ,  CHUNG-JUI SU

    IPC: H01G4/32 ,  H01G4/224 ,  H01G4/005

    Abstract: A winding capacitor package structure and a method of manufactured the same are provided. The winding capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a winding positive foil and a winding negative foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure includes a main casing for enclosing the filling body and a retaining body inwardly bent from a bottom side of the main casing. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be retained and limited inside the casing structure through the retaining body.

    METHOD FOR FORMING POLYMER COMPOSITE MATERIAL ONTO CAPACITOR ELEMENT
    17.
    发明申请
    METHOD FOR FORMING POLYMER COMPOSITE MATERIAL ONTO CAPACITOR ELEMENT 有权

    公开(公告)号：US20210012971A1

    公开(公告)日：2021-01-14

    申请号：US16922016

    申请日：2020-07-07

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHIEH LIN ,  Hao-Pu Chang

    IPC: H01G9/00 ,  H01G9/028 ,  C08J3/205

    Abstract: A method for forming the polymer composite material onto the capacitor element is provided. The method includes a preparing step, a resting step, an immersing step, and a polymerization step. The preparing step includes forming a homogeneous reaction solution containing 3,4-ethylenedioxythiophene, an emulsifier, polystyrene sulfonic acid or salts thereof, an oxidant, and a solvent. The resting step includes resting the homogeneous reaction solution to generate microparticles so that a nonhomogeneous reaction solution containing the microparticles is formed. The immersing step includes immersing the capacitor element into the nonhomogeneous reaction solution so that the nonhomogeneous reaction solution is coated onto the capacitor element and a reaction layer is formed on the capacitor element. The polymerization step includes heating the reaction layer to form a polymer composite layer containing the polymer composite material, and the polymer composite material is polymerized from 3,4-ethylenedioxythiophene and polystyrene sulfonic acid and salts thereof.

    CAPACITOR ASSEMBLY PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
    19.
    发明申请
    CAPACITOR ASSEMBLY PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE 有权

    公开(公告)号：US20250087420A1

    公开(公告)日：2025-03-13

    申请号：US18610362

    申请日：2024-03-20

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHIEH LIN ,  YI-YING WANG

    IPC: H01G4/224 ,  H01G4/005 ,  H01G4/30

    Abstract: A capacitor assembly package structure and a method of manufacturing the same, and an electronic device are provided. The capacitor assembly package structure includes a capacitor assembly, a plurality of first insulating package bodies, a second insulating package body and an electrode assembly. The capacitor assembly includes a plurality of capacitor structures. The capacitor assembly has a plurality of stacking gaps. The first insulating package bodies are respectively received in the stacking gaps of the capacitor assembly. The second insulating package body is configured to cover the first insulating package bodies and the capacitor structures. The electrode assembly includes a first electrode structure and a second electrode structure. A solid content of each first insulating package body is less than a solid content of the second insulating package body so as to reduce the percentage of multiple pores formed in each stacking gap of the capacitor assembly.

    STACKED CAPACITOR ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, AND STACKED CAPACITOR PACKAGE STRUCTURE
    20.
    发明申请
    STACKED CAPACITOR ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, AND STACKED CAPACITOR PACKAGE STRUCTURE 有权

    公开(公告)号：US20240428991A1

    公开(公告)日：2024-12-26

    申请号：US18417037

    申请日：2024-01-19

    Applicant: APAQ TECHNOLOGY CO., LTD.

    Inventor： CHIEH LIN ,  CHENG-JHE SIE ,  YI-YING WANG

    IPC: H01G4/012 ,  H01G4/008 ,  H01G4/30

    Abstract: A stacked capacitor assembly and a method of manufacturing the same, and a stacked capacitor package structure are provided. The stacked capacitor assembly includes a plurality of conductive substrates, an inner conductive structure and an outermost covering structure. Each of the conductive substrates has a first portion and a second portion opposite to the first portion. The inner conductive structure is configured to cover the first portion of each of the conductive substrates and be disposed between any two adjacent ones of the conductive substrates. The outermost covering structure is configured to cover the inner conductive structure. The inner conductive structure is provided without carbon-containing materials or silver-containing materials, and a space is formed between any two adjacent ones of the conductive substrates without carbon-containing materials or silver-containing materials.

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