公开(公告)号：US20240191014A1

公开(公告)日：2024-06-13

申请号：US18282456

申请日：2022-03-18

Applicant: UNIMATEC CO., LTD.

Inventor： Daichi TOGE ,  Daiki WATANABE ,  Kazunari ABE ,  Ikuo SOUTOME

IPC: C08F234/02

CPC classification number: C08F234/02

Abstract: An ethylene-(meth)acrylate-based elastomer having a structure in which 40 to 79.9 mol % of ethylene, 20.0 to 50.0 mol % of an alkyl (meth)acrylate containing an alkyl group having 1 to 8 carbon atoms and/or an alkoxy (meth)acrylate containing an alkoxyalkyl group having 2 to 8 carbon atoms, 0.05 to 20.0 mol % of an unsaturated dicarboxylic acid monosaturated ester, and 0 to 20.0 mol % of an unsaturated dicarboxylic anhydride are copolymerized, and having a monosaturated esterification rate of the acid anhydride of 70% or more as measured by IR. The ethylene-(meth)acrylate-based elastomer gives a vulcanizate having excellent heat resistance, and molding processability.

公开(公告)号：US09212241B2

公开(公告)日：2015-12-15

申请号：US13728971

申请日：2012-12-27

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  CHEIL INDUSTRIES INC.

Inventor： Hyung Jun Kim ,  Moon Yeon Lee ,  Kyu Yeol In ,  Woo Joong Kim ,  Jong Hoon Won ,  Myung Sup Jung ,  Won Cheol Jung

IPC: C08F134/02 ,  C08F212/08 ,  C08F234/02

CPC classification number: C08J5/18 ,  B29D11/00788 ,  B29K2025/08 ,  B29K2055/00 ,  B29K2079/08 ,  B29K2995/0032 ,  C08F134/02 ,  C08F212/08 ,  C08F234/02 ,  C08J2325/08 ,  C08J2365/00 ,  C08J2379/08 ,  G02B1/04 ,  G02B5/3083

Abstract: An optical film including a polymer including a repeating unit A including a repeating unit represented by the following Chemical Formulas 1 to 3, or a combination thereof; and a repeating unit B derived from a monomer having an unsaturated bond copolymerizable with the repeating unit A, wherein the optical film has a short wavelength dispersion of an in-plane phase-difference value (Re) (450 nm/550 nm) ranging from about 0.81 to about 1.20, and a long wavelength dispersion of an in-plane phase-difference value (Re) (650 nm/550 nm) ranging from about 0.90 to about 1.18: wherein, in Chemical Formulas 1 to 3, the variables R1 to R21 are defined herein.

Abstract translation: 一种光学膜，其包含含有由以下化学式1〜3表示的重复单元的重复单元A的聚合物或其组合; 以及衍生自具有与重复单元A可共聚的不饱和键的单体的重复单元B，其中该光学膜具有面内相位差值（Re）（450nm / 550nm）的短波长色散，范围从 约0.81至约1.20，以及在约0.90至约1.18范围内的面内相位差值（Re）（650nm / 550nm）的长波长色散：其中在化学式1至3中，变量R1 至R21。

公开(公告)号：US20140275347A1

公开(公告)日：2014-09-18

申请号：US13836300

申请日：2013-03-15

Applicant: NANOSCIENCE ENGINEERING CORPORATION

Inventor： Pranav Nawani ,  David E. Burnett ,  Roy G. Crawford

IPC: C09C1/42 ,  C08F134/02 ,  C08F234/02 ,  C08K5/56 ,  C08L23/06 ,  C08L23/12 ,  C08L45/00 ,  C08K3/34 ,  C07F19/00

CPC classification number: C09C1/42 ,  B82Y30/00 ,  C01P2002/77 ,  C08F134/02 ,  C08F234/02 ,  C08F292/00 ,  C08K9/08 ,  C08L45/00 ,  C08L51/06 ,  C08L23/02

Abstract: A nano-clay material that exhibits improved compatibility with polymers is described. The nano-clay material may be mixed with polymers to produce a nano-clay polymer nanocomposite material including reduced levels of clay loading. Methods for making the nano-clay nanocomposite material and articles of manufacture from the nanocomposite material are also described.

Abstract translation: 描述了与聚合物相容性提高的纳米粘土材料。 纳米粘土材料可以与聚合物混合以产生纳米粘土聚合物纳米复合材料，其包括降低的粘土载量水平。 还描述了从纳米复合材料制备纳米粘土纳米复合材料和制造方法的方法。

公开(公告)号：US20130109798A1

公开(公告)日：2013-05-02

申请号：US13717009

申请日：2012-12-17

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Hikaru OKUBO ,  Nobuki TANAKA ,  Itaru WATANABE

IPC: C09J179/08

CPC classification number: C08F220/58 ,  C08F234/02 ,  C08G73/12 ,  C08K3/08 ,  C08K3/26 ,  C08K5/0025 ,  C08K5/14 ,  C08L79/085 ,  C09J179/08 ,  C09J201/025 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015

Abstract: A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property.A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

Abstract translation: 用于快速固化并可用于常规使用的烘箱中的固化的树脂组合物，以及当树脂组合物用作半导体芯片附着材料时，具有优异的可焊性抗裂性等可靠性的半导体器件 。 进一步优选具有足够的低应力性，良好的粘合性和优异的渗出性的树脂组合物。 一种树脂组合物，其包含填料（A），包含由式（1）表示的结构的化合物（B）和由式（2）表示的官能团和热自由基引发剂（C），并且基本上不含 光聚合引发剂。

公开(公告)号：US20130084528A1

公开(公告)日：2013-04-04

申请号：US13599398

申请日：2012-08-30

Applicant: Jun Hatakeyama ,  Koji Hasegawa

Inventor： Jun Hatakeyama ,  Koji Hasegawa

IPC: C08F220/68 ,  G03F7/004 ,  C08F228/06 ,  C08F232/08 ,  C08F234/02 ,  C08F228/04 ,  G03F7/20

CPC classification number: C08F220/68 ,  C08F220/22 ,  C08F228/04 ,  C08F228/06 ,  C08F232/08 ,  C08F234/02 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0392 ,  G03F7/0397 ,  Y10S430/111

Abstract: A positive resist composition comprising a polymer having carboxyl groups substituted with an acid labile group having formula (1) exhibits a high contrast of alkaline dissolution rate before and after exposure, a high resolution, a reduced acid diffusion rate, and forms a pattern with good profile, minimal edge roughness, and etch resistance. In formula (1), R1 is methylene or ethylene, R2 is alkyl, aryl, or alkenyl, which may contain oxygen or sulfur, R3 is fluorine or trifluoromethyl, and m is an integer of 1 to 4.

Abstract translation: 包含具有由具有式（1）的酸不稳定基团取代的羧基的聚合物的正型抗蚀剂组合物在曝光前后显示出高的对比度的碱溶解速率，高分辨率，降低的酸扩散速率，并形成良好的图案 轮廓，最小边缘粗糙度和耐蚀刻性。 在式（1）中，R 1是亚甲基或亚乙基，R 2是可以含有氧或硫的烷基，芳基或烯基，R 3是氟或三氟甲基，m是1至4的整数。

公开(公告)号：US08153741B2

公开(公告)日：2012-04-10

申请号：US13190927

申请日：2011-07-26

Applicant: Joshua B. Stopek

Inventor： Joshua B. Stopek

IPC: C08F224/00

CPC classification number: A61L17/005 ,  A01N43/08 ,  A61L15/44 ,  A61L17/145 ,  A61L27/34 ,  A61L27/54 ,  A61L29/085 ,  A61L29/16 ,  A61L31/10 ,  A61L31/16 ,  A61L2300/404 ,  C08F230/02 ,  C08F234/02 ,  C08F234/04 ,  Y10T428/1393 ,  Y10T442/20 ,  Y10T442/2762 ,  Y10T442/2861 ,  Y10T442/2893 ,  Y10T442/291 ,  A01N57/12 ,  A01N2300/00

Abstract: The present disclosure provides copolymers including a first monomer including at least one phospholipid possessing at least one vinyl group and a second monomer including a furanone possessing vinyl and/or acrylate groups. Compositions, medical devices, and coatings including such copolymers are also provided.

Abstract translation: 本公开内容提供了共聚物，其包括包含至少一种具有至少一个乙烯基的磷脂的第一单体和包含具有乙烯基和/或丙烯酸酯基团的呋喃酮的第二单体。 还提供了组合物，医疗装置和包括这些共聚物的涂层。

公开(公告)号：US20120068106A1

公开(公告)日：2012-03-22

申请号：US13307289

申请日：2011-11-30

Applicant: Hikaru OKUBO ,  Nobuki Tanaka ,  Itaru Watanabe

Inventor： Hikaru OKUBO ,  Nobuki Tanaka ,  Itaru Watanabe

IPC: C09J4/06 ,  C09J9/02 ,  C09J9/00

CPC classification number: C08F220/58 ,  C08F234/02 ,  C08G73/12 ,  C08K3/08 ,  C08K3/26 ,  C08K5/0025 ,  C08K5/14 ,  C08L79/085 ,  C09J179/08 ,  C09J201/025 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015

Abstract: A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property.A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

Abstract translation: 用于快速固化并可用于常规使用的烘箱中的固化的树脂组合物，以及当树脂组合物用作半导体芯片附着材料时，具有优异的可焊性抗裂性等可靠性的半导体器件 。 进一步优选具有足够的低应力性，良好的粘合性和优异的渗出性的树脂组合物。 一种树脂组合物，其包含填料（A），包含由式（1）表示的结构的化合物（B）和由式（2）表示的官能团和热自由基引发剂（C），并且基本上不含 光聚合引发剂。

公开(公告)号：US20070213467A1

公开(公告)日：2007-09-13

申请号：US10593137

申请日：2005-03-16

Applicant: Hikaru Okubo ,  Nobuki Tanaka ,  Itaru Watanabe

Inventor： Hikaru Okubo ,  Nobuki Tanaka ,  Itaru Watanabe

IPC: C08L23/04

CPC classification number: C08F220/58 ,  C08F234/02 ,  C08G73/12 ,  C08K3/08 ,  C08K3/26 ,  C08K5/0025 ,  C08K5/14 ,  C08L79/085 ,  C09J179/08 ,  C09J201/025 ,  H01L23/145 ,  H01L23/3737 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015

Abstract: A resin composition which is excellent in quick curing and can be used for curing in conventionally used ovens, and a semiconductor device which is excellent in reliability such as solder crack resistance or the like when the resin composition is used as a die attach material for semiconductor. Further preferably, a resin composition which has a sufficient low stress property, good adhesion and excellent bleeding property. A resin composition comprising a filler (A), the compound (B) comprising a structure represented by the formula (1) and a functional group represented by the formula (2) and a thermal radical initiator (C), and substantially not containing a photo polymerization initiator.

Abstract translation: 用于快速固化并可用于常规使用的烘箱中的固化的树脂组合物，以及当树脂组合物用作半导体芯片附着材料时，具有优异的可焊性抗裂性等可靠性的半导体器件 。 进一步优选具有足够的低应力性，良好的粘合性和优异的渗出性的树脂组合物。 一种树脂组合物，其包含填料（A），包含由式（1）表示的结构的化合物（B）和由式（2）表示的官能团和热自由基引发剂（C），并且基本上不含 光聚合引发剂。

公开(公告)号：US20020103317A1

公开(公告)日：2002-08-01

申请号：US09916449

申请日：2001-07-27

Inventor： Xiao-Mei Zhao ,  Ramakrishna Ravikiran ,  Phillip S. Neal ,  Robert A. Shick ,  Larry F. Rhodes ,  Andrew Bell

IPC: C08F134/02

CPC classification number: G02B6/1221 ,  C08F32/08 ,  C08F34/00 ,  C08F230/08 ,  C08F232/02 ,  C08F232/08 ,  C08F234/02 ,  C08F234/04 ,  G02B6/132 ,  G02B6/138 ,  G02B2006/12069 ,  G02B2006/12097

Abstract: The present invention relates to polymer compositions and methods of polymerizing such compositions. Furthermore, the present invention relates to polymer compositions that are useful in forming waveguides and to methods for making waveguides using such polymer compositions.

Abstract translation: 本发明涉及聚合物组合物和聚合这种组合物的方法。 此外，本发明涉及可用于形成波导的聚合物组合物以及使用这种聚合物组合物制造波导的方法。

公开(公告)号：US20020064896A1

公开(公告)日：2002-05-30

申请号：US09916463

申请日：2001-07-27

Inventor： Xiao-Mei Zhao ,  Ramakrishna Ravikiran ,  Phillip S. Neal ,  Robert A. Shick ,  James E. Watson ,  Thomas M. Kafka ,  Davy Chum ,  Raymond P. Johnston

IPC: H01L021/00

CPC classification number: G02B6/1221 ,  C08F32/08 ,  C08F34/00 ,  C08F230/08 ,  C08F232/02 ,  C08F232/08 ,  C08F234/02 ,  C08F234/04 ,  G02B6/132 ,  G02B6/138 ,  G02B2006/12069 ,  G02B2006/12097

Abstract: The invention provides a method for producing an optical waveguide that includes the steps of: (a) forming a core structure, the core structure including an at least partially cured core composition, on a master defining a waveguide pattern; (b) applying over the top of the core structure and the master a cladding layer including a liquid cladding composition; (c) curing the cladding layer to form a core/cladding combination; and removing the core/cladding combination from the master so as to expose at least a portion of the core structure, wherein the refractive index of the core material is at least about 0.05 percent higher than the refractive index of the cladding material. In another embodiment, the invention relates to a method for producing an optical waveguide core structure that includes the steps of: (a) applying a core composition to a substrate defining a waveguide core pattern; (b) removing a portion of the core composition from an exposed surface of the filled waveguide core pattern; and (c) at least partially curing the core composition to form a core structure. In another embodiment, the invention relates to a composition for forming either the core or cladding portion of an optical waveguide comprising at least one norbornene-type monomer and/or at least one crosslinking monomer and at least one co-catalyst or pro-catalyst, wherein polymerization is achieved by the addition of at least one pro-catalyst (when a co-catalyst is present in the composition) or at least one co-catalyst (when a pro-catalyst is present in the composition). Optical waveguides made by the methods of the invention are also disclosed.

Abstract translation: 本发明提供了一种制造光波导的方法，包括以下步骤：（a）在限定波导图案的母板上形成芯结构，芯结构包括至少部分固化的芯组合物; （b）在芯结构的顶部和主体上施加包括液体包层组合物的包层; （c）固化包覆层以形成芯/包层组合; 以及从所述主体移除所述芯/包层组合以暴露所述芯结构的至少一部分，其中所述芯材料的折射率比所述包层材料的折射率高至少约0.05％。 在另一个实施例中，本发明涉及一种用于制造光波导芯结构的方法，其包括以下步骤：（a）将芯组合物施加到限定波导芯图案的衬底上; （b）从所述填充的波导芯图案的暴露表面去除所述芯组合物的一部分; 和（c）至少部分固化所述芯组合物以形成芯结构。 在另一个实施方案中，本发明涉及用于形成光波导的芯或包层部分的组合物，其包含至少一种降冰片烯型单体和/或至少一种交联单体和至少一种助催化剂或催化剂， 其中通过加入至少一种前催化剂（当组合物中存在助催化剂时）或至少一种助催化剂（当组合物中存在促进催化剂时）来实现聚合。 还公开了通过本发明的方法制造的光波导。