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公开(公告)号：US10447324B2
公开(公告)日：2019-10-15
申请号：US15844369
申请日：2017-12-15
Applicant: Apple Inc.
Inventor： Scott A. Myers , Erik L Wang , Jason S. Sloey
IPC: H04B1/3818 , H04M1/02 , G06K13/08 , H04B1/3816 , H05K5/02
Abstract: Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.
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公开(公告)号：US09601882B2
公开(公告)日：2017-03-21
申请号：US15079777
申请日：2016-03-24
Applicant: APPLE INC.
Inventor： Charles B. Woodhull , Jason S. Sloey
IPC: H05K5/00 , H01R24/58 , H01R13/50 , H04M1/02 , H01R105/00 , H01R107/00
CPC classification number: H01R24/58 , H01R13/50 , H01R2105/00 , H01R2107/00 , H04M1/0274 , H05K5/0004
Abstract: Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.
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公开(公告)号：US20160204558A1
公开(公告)日：2016-07-14
申请号：US15079777
申请日：2016-03-24
Applicant: APPLE INC.
Inventor： Charles B. Woodhull , Jason S. Sloey
CPC classification number: H01R24/58 , H01R13/50 , H01R2105/00 , H01R2107/00 , H04M1/0274 , H05K5/0004
Abstract: Enclosures for electronic devices are provided. These enclosures can be integrally formed with a full or partial receptacle connector shell for receiving electrical connectors such as audio connectors or plugs. For example, an enclosure made from a polymer can be integrally formed with an audio jack shell in an injection molding process. As another example, an enclosure can be integrally formed with one or more full or partial walls of an audio jack shell to form a single piece of polymer or metal and the remaining walls of the audio jack shell can be overmolded or assembled to the polymer or metal walls of the audio jack and proximate portions of the enclosure to form a full or complete audio jack shell.
Abstract translation: 提供电子设备外壳。 这些外壳可以与完全或部分的插座连接器外壳整体形成，用于接收诸如音频连接器或插头的电连接器。 例如，由聚合物制成的外壳可以在注射成型工艺中与音频插座外壳一体形成。 作为另一示例，外壳可以与音频插座外壳的一个或多个全部或部分壁整体形成，以形成单片聚合物或金属，并且音频插座外壳的其余壁可以包覆成型或组装到聚合物或 音频插座的金属壁和外壳的最近部分，以形成完整或完整的音频插孔外壳。
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公开(公告)号：US20160044800A1
公开(公告)日：2016-02-11
申请号：US14456955
申请日：2014-08-11
Applicant: Apple Inc.
Inventor： Daniel W. Jarvis , Benjamin J. Pope , Jason S. Sloey , Jonathan C. Denby , Ian A. Spraggs , Shayan Malek
CPC classification number: H05K7/14 , H01H23/04 , H01H23/148 , H01R43/205 , H04M1/026 , H04M1/0274 , H04M1/0277 , H05K7/026 , H05K7/06
Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.
Abstract translation: 本申请涉及在便携式计算设备的壳体内固定和定位内部部件。 在一个实施例中，许多插入模制的保持构件用于在跌落事件期间抑制壳体的侧壁的向外变形。 在另一个实施例中，利用整流罩将多个板对板连接器保持在印刷电路板（PCB）上的通信槽内。 在另一个实施例中，使用具有直径相对的突起的C形垫圈来调节内部部件的对准。
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公开(公告)号：US20200099166A1
公开(公告)日：2020-03-26
申请号：US16538755
申请日：2019-08-12
Applicant: Apple Inc.
Inventor： Hani Esmaeili , Holly M. Ubellacker , Daniel C. Wagman , Jason S. Sloey , Eric S. Jol
IPC: H01R13/533 , H01R13/03 , H01R13/504 , H01R13/66 , H01R43/02 , H01R43/16 , H01B1/02
Abstract: Connectors having contacts that can be highly corrosion resistant, can conserve precious materials, and can be readily manufactured. Examples can provide connector contacts that are highly corrosion resistant. These contacts can be formed of a precious metal or a precious-metal alloy. The precious-metal alloy can be a high-entropy alloy. To conserve the precious materials, a contact can be formed by a stamping a structure that becomes the contact, instead of stamping the contact from a structure. The structure can be a rod. To conserve the precious materials, only contacts that convey high voltages, such as power supplies, might be formed of the precious materials.
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Patent Agency Ranking
公开(公告)号：US10591430B2
公开(公告)日：2020-03-17
申请号：US15699987
申请日：2017-09-08
Applicant: Apple Inc.
Inventor： Eric S. Jol , Jason S. Sloey , Craig C. Birrell , Samuel B. Schaevitz , Ching Yu John Tam , Nagendra Bage Jayaraj
Abstract: An electronic device comprising a connector including a plurality of contacts and a liquid detection module coupled to at least one contact in the plurality of contacts. The liquid detection module can be configured to generate and apply a time varying voltage or current to the at least one contact over a range of frequencies, measure complex impedance including phase and magnitude at the at least one contact, and determine whether liquid intrusion has occurred on the contacts based on previously measured signatures of phase and magnitude versus frequency.
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公开(公告)号：US20190272453A1
公开(公告)日：2019-09-05
申请号：US16123696
申请日：2018-09-06
Applicant: Apple Inc.
Inventor： Brian A. Argyres , Sherry Cao , Sawyer I. Cohen , Ibuki Kamei , Kenn I. Peterson , Jason S. Sloey , Daniel C. Wagman , Benjamin J. Pope , Tang Y. Tan , Richard Hung Minh Dinh
Abstract: A dual subscriber identity module (SIM) card connector is provided that includes a lower connector housing portion having a bottom surface and an upper connector housing portion having a top surface. The upper connector housing portion is coupled to the lower connector housing portion to define an opening for a receiving space between the upper and lower connector housing portions. The opening and receiving space are sized and shaped to slidably receive a SIM card tray. The connector includes a first plurality of electrical contacts disposed at the bottom surface of the lower connector housing portion and configured to make contact with a first SIM card disposed on a first side of the SIM card tray when the tray is received within the receiving space. The connector includes a second plurality of electrical contacts disposed at the top surface of the upper connector housing portion and configured to make contact with a second SIM card disposed on a second side of the SIM card tray opposite the first side when the tray is received within the receiving space.
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公开(公告)号：US20190079037A1
公开(公告)日：2019-03-14
申请号：US15699987
申请日：2017-09-08
Applicant: Apple Inc.
Inventor： Eric S. Jol , Jason S. Sloey , Craig C. Birrell , Samuel B. Schaevitz , Ching Yu John Tam , Nagendra Bage Jayaraj
CPC classification number: G01N27/048 , G01M3/16 , G01R31/04 , H01R13/6683
Abstract: An electronic device comprising a connector including a plurality of contacts and a liquid detection module coupled to at least one contact in the plurality of contacts. The liquid detection module can be configured to generate and apply a time varying voltage or current to the at least one contact over a range of frequencies, measure complex impedance including phase and magnitude at the at least one contact, and determine whether liquid intrusion has occurred on the contacts based on previously measured signatures of phase and magnitude versus frequency.
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公开(公告)号：US09853671B2
公开(公告)日：2017-12-26
申请号：US14618568
申请日：2015-02-10
Applicant: Apple Inc.
Inventor： Scott A. Myers , Erik L. Wang , Jason S. Sloey
IPC: H04B1/3818 , H04M1/02 , G06K13/08 , H04B1/3816 , H05K5/02
CPC classification number: H04B1/3818 , G06K13/08 , G06K13/0831 , H04B1/3816 , H04M1/0235 , H04M1/026 , H04M1/0274 , H04M1/0283 , H04M2250/14 , H05K5/0295
Abstract: Electronic devices are provided with ejectable component assemblies. The ejectable component assembly may include a tray that can be loaded with one or more removable modules, wafers coupled to circuit boards, cages and retaining plates to assist in retaining the tray within the assembly. The ejectable component assembly may include springs operative to engage detents in the tray to retain the tray in the assembly. The ejectable component assembly may include a tray ejector mechanism for ejecting the tray from the assembly.
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公开(公告)号：US20160044816A1
公开(公告)日：2016-02-11
申请号：US14456943
申请日：2014-08-11
Applicant: Apple Inc.
Inventor： Daniel W. Jarvis , Benjamin J. Pope , Jason S. Sloey , Jonathan C. Denby , Ian A. Spraggs , Shayan Malek
CPC classification number: H05K7/14 , H01H23/04 , H01H23/148 , H01R43/205 , H04M1/026 , H04M1/0274 , H04M1/0277 , H05K7/026 , H05K7/06
Abstract: This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment a number of insert molded retaining members are utilized to prevent outward deformation of sidewalls of the portable computing device during a drop event. In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.
Abstract translation: 本申请涉及在便携式计算设备的壳体内固定和定位内部部件。 在一个实施例中，使用整流罩将多个板对板连接器保持在印刷电路板（PCB）上的通信槽内。 在另一个实施例中，使用许多插入模制的保持构件来防止在丢弃事件期间便携式计算设备的侧壁向外变形。 在另一个实施例中，使用具有直径相对的突起的C形垫圈来调节内部部件的对准。
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