公开(公告)号：US20180120893A1

公开(公告)日：2018-05-03

申请号：US15844162

申请日：2017-12-15

Applicant: Apple Inc.

Inventor： Lucy Elizabeth BROWNING ,  Benjamin J. POPE ,  Paul U. LEUTHEUSER ,  Scott A. MYERS ,  Richard Hung Minh DINH ,  Edward S. Huo

IPC: G06F1/16 ,  G06K9/00 ,  G06F3/16 ,  G06F3/01 ,  G06F3/044

CPC classification number: G06F1/169 ,  G06F1/1626 ,  G06F1/1671 ,  G06F1/1684 ,  G06F1/1688 ,  G06F3/016 ,  G06F3/044 ,  G06F3/165 ,  G06F3/167 ,  G06F2203/0338 ,  G06K9/0002 ,  H03K17/962 ,  H03K17/964 ,  H03K17/975

Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.

公开(公告)号：US20150218425A1

公开(公告)日：2015-08-06

申请号：US14502913

申请日：2014-09-30

Applicant: Apple Inc.

Inventor： Julian MALINSKI ,  Richard Hung Minh DINH ,  Daniel W. JARVIS

IPC: C09J9/02 ,  B32B37/26 ,  B32B37/12 ,  H05K1/02 ,  B32B37/18

CPC classification number: C09J9/02 ,  C08K2003/0806 ,  C08K2003/0812 ,  C08K2003/0818 ,  C08K2003/0831 ,  C08K2003/085 ,  C08K2003/0856 ,  C08K2003/0862 ,  C08K2003/0887 ,  C08K2003/0893 ,  C08K2201/001 ,  C09J5/00 ,  C09J7/10 ,  C09J11/04 ,  C09J2201/602 ,  C09J2201/618 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/302 ,  H05K1/0215 ,  H05K3/0058 ,  H05K3/321 ,  H05K2201/0314 ,  H05K2203/0271 ,  H05K2203/176 ,  Y10T156/10 ,  Y10T428/24752 ,  Y10T428/31678

Abstract: This application relates to adhesives for use in electronic devices. Specifically, the embodiments discussed herein set forth stretch release conductive adhesives for adhering an electrical component to the surface of a housing of a computing device while also allowing current to flow through the electrical component. A stretch release conductive adhesive can include a graspable portion for providing a means to stretch and remove the stretch release conductive adhesive from an electronic device.

Abstract translation: 本申请涉及用于电子设备的粘合剂。 具体来说，本文所讨论的实施例提出了用于将电气部件粘附到计算装置的壳体的表面的拉伸释放导电粘合剂，同时还允许电流流过电气部件。 拉伸释放导电粘合剂可以包括用于提供从电子设备拉伸和去除拉伸释放导电粘合剂的装置的可抓握部分。

公开(公告)号：US20140361935A1

公开(公告)日：2014-12-11

申请号：US14020676

申请日：2013-09-06

Applicant: Apple Inc.

Inventor： Daniel W. JARVIS ,  Richard Hung Minh DINH ,  Miguel C. CHRISTOPHY ,  Hao XU ,  Jayesh NATH ,  Jared M. KOLE ,  Mattia PASCOLINI ,  Ruben CABALLERO ,  Jennifer M. EDWARDS ,  Peter I. BEVELACQUA ,  Robert W. SCHLUB

IPC: H01Q1/24

CPC classification number: H01Q1/24 ,  G06F1/1613 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/1656 ,  H04M1/0202 ,  H04M1/0249 ,  H04M1/185 ,  Y10T29/49002 ,  Y10T29/49861

Abstract: A housing for a personal electronic device is described herein. The housing may include at least one modular subassembly configured to be arranged within an internal cavity of the housing. The at least one modular subassembly is aligned with a feature external to the housing, is affixed to an interior surface of the internal cavity, and is configured to function both as an antenna and as an internal support member of the housing.

Abstract translation: 本文描述了用于个人电子设备的外壳。 壳体可以包括至少一个模块化子组件，其被配置为布置在壳体的内部空腔内。 所述至少一个模块化子组件与外壳外部的特征对准，固定到所述内部空腔的内表面，并且被配置为同时用作天线和作为所述壳体的内部支撑构件。