公开(公告)号：US09873180B2

公开(公告)日：2018-01-23

申请号：US14695299

申请日：2015-04-24

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Kasiraman Krishnan ,  Mahendra C. Orilall ,  Daniel Redfield ,  Fred C. Redeker ,  Nag B. Patibandla ,  Gregory E. Menk ,  Jason G. Fung ,  Russell Edward Perry ,  Robert E. Davenport

IPC: B24B37/26 ,  B24B37/24 ,  B33Y80/00 ,  B24B37/20 ,  B24B37/22 ,  B24D18/00 ,  B29C64/112

CPC classification number: B24B37/26 ,  B24B37/205 ,  B24B37/22 ,  B24B37/24 ,  B24D18/0045 ,  B29C64/112 ,  B33Y80/00

Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US20140242881A1

公开(公告)日：2014-08-28

申请号：US13779686

申请日：2013-02-27

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Gregory E. Menk ,  Doyle E. Bennett ,  Jun Qian ,  Sivakumar Dhandapani ,  Benjamin Cherian ,  Thomas H. Osterheld ,  Boguslaw A. Swedek

IPC: B24B37/013 ,  B24B49/12

CPC classification number: B24B37/013 ,  B24B49/12

Abstract: A method of controlling a polishing operation is described. A controller stores an optical model for a layer stack having a plurality of layers and a plurality of input parameters including a first parameter and a second parameter. The controller stores data defining a plurality of default values for the first parameter and measures an optical property of a substrate and generates a second value. Using the optical model and the second value and iterating over the first values, a number of reference spectra are calculated. A spectrum is measured and the measured spectrum is matched to the reference spectra and the best matched reference spectrum is determined. The first value of the best matched reference spectrum is determined and is used to adjust a polishing endpoint or a polishing parameter of a polishing apparatus.

Abstract translation: 描述了一种控制抛光操作的方法。 控制器存储具有多个层的层堆叠的光学模型和包括第一参数和第二参数的多个输入参数。 控制器存储为第一参数定义多个默认值的数据，并测量衬底的光学特性并产生第二值。 使用光学模型和第二个值并迭代第一个值，计算多个参考光谱。 测量光谱，并测量光谱与参考光谱相匹配，并确定最佳匹配参考光谱。 确定最佳匹配参考光谱的第一个值，并用于调整抛光装置的抛光终点或抛光参数。

公开(公告)号：US10537974B2

公开(公告)日：2020-01-21

申请号：US15876436

申请日：2018-01-22

Applicant: Applied Materials, Inc.

Inventor： Rajeev Bajaj ,  Kasiraman Krishnan ,  Mahendra C. Orilall ,  Daniel Redfield ,  Fred C. Redeker ,  Nag B. Patibandla ,  Gregory E. Menk ,  Jason G. Fung ,  Russell Edward Perry ,  Robert E. Davenport

IPC: B24D18/00 ,  B24B37/26 ,  B24B37/24 ,  B33Y80/00 ,  B24B37/20 ,  B24B37/22 ,  B29C64/112

Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.

公开(公告)号：US20140323017A1

公开(公告)日：2014-10-30

申请号：US13869307

申请日：2013-04-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Jianshe Tang ,  Thomas H. Osterheld ,  Fred C. Redeker ,  Gregory E. Menk

IPC: B24B53/017

CPC classification number: B24B53/017

Abstract: Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the polishing pad on a platen; energizing a fluid within the energized fluid delivery assembly; applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and removing the dislodged slurry residue and debris using a vacuum suction unit. Systems and apparatus for carrying out the methods are provided, as are numerous additional aspects.

Abstract translation: 公开了适用于清洁化学机械抛光（CMP）垫的方法。 所述方法包括将激活的流体输送组件定位在CMP抛光垫上; 将抛光垫旋转在压板上; 激励通电流体输送组件内的流体; 将激活的流体施加到抛光垫以移除浆料残渣和碎屑; 并使用真空抽吸单元去除移出的浆料残渣和碎屑。 提供了用于执行方法的系统和装置，以及许多其它方面。

公开(公告)号：US20140237905A1

公开(公告)日：2014-08-28

申请号：US14269534

申请日：2014-05-05

Applicant: Applied Materials, Inc.

Inventor： Benjamin A. Bonner ,  Gopalakrishna B. Prabhu ,  Erik S. Rondum ,  Gregory E. Menk ,  Anand N. Iyer ,  Peter McReynolds ,  Garlen C. Leung

IPC: B24D11/00

Abstract: A chemical mechanical polishing article can be a single contiguous layer having a polishing surface, the layer being an elongated substantially rectangular sheet having a width and a length at least four times greater than the width. Forming a polishing article can include depositing a liquid precursor on a moving belt, at least partially curing the liquid precursor while on the moving belt to form a polishing layer, and detaching the polishing layer from the belt.

Abstract translation: 化学机械抛光制品可以是具有抛光表面的单个邻接层，该层是具有宽度和长度至少比宽度大至少四倍的长度的基本上矩形的片材。 形成抛光制品可以包括在移动的带上沉积液体前体，在移动的带上至少部分地固化液体前体以形成抛光层，并且将抛光层与带分离。