公开(公告)号：US20220281059A1

公开(公告)日：2022-09-08

申请号：US17677893

申请日：2022-02-22

Applicant: Applied Materials, Inc.

Inventor： Thomas Li ,  Benjamin Cherian

IPC: B24B37/013 ,  B24B37/04 ,  H01L21/66

Abstract: A method of polishing includes holding a substrate with a carrier head against a polishing surface of a polishing pad, generating relative motion between the substrate and polishing pad, applying a first pressure modulated by a first modulation function to a first region of the substrate, applying a second pressure modulated by a second modulation function that is orthogonal to the first modulation function to a second region of the substrate, during polishing of the substrate monitoring the substrate with an in-situ friction monitoring system to generate a sequence of measured values, and determining a relative contribution to the sequence of measured value from the first region and second region based on distinguishing the first frequency from the second frequency.

公开(公告)号：US20240176334A1

公开(公告)日：2024-05-30

申请号：US18070453

申请日：2022-11-28

Applicant: Applied Materials, Inc.

Inventor： Sidharth Bhatia ,  Roger Lindley ,  Upendra Ummethala ,  Thomas Li ,  Michael Howells ,  Steven Babayan ,  Mimi-Diemmy Dao

IPC: G05B19/418

CPC classification number: G05B19/41865 ,  G05B19/4188 ,  G05B19/41885 ,  G05B2219/45031

Abstract: A method includes receiving, by a processing device, first trace data associated with a first processing chamber, wherein the first processing chamber satisfies one or more performance metrics. The method further includes generating target trace data based on the first trace data associated with the first processing chamber. The method further includes receiving second trace data associated with a second processing chamber, wherein the second processing chamber does not satisfy the one or more performance metrics. The method further includes generating, based on the target trace data and the second trace data, a first recommended corrective action associated with the second processing chamber, wherein the first recommended corrective action includes updating one or more equipment constants of the second processing chamber. The method further includes performing the first recommended corrective action.

公开(公告)号：US20230316502A1

公开(公告)日：2023-10-05

申请号：US18206353

申请日：2023-06-06

Applicant: Applied Materials, Inc.

Inventor： Sidney P. Huey ,  Thomas Li ,  Benjamin Cherian

IPC: G06T7/00 ,  G06T7/20 ,  H04N7/18 ,  H04N5/272 ,  B24B37/005

CPC classification number: G06T7/001 ,  G06T7/20 ,  H04N7/18 ,  H04N5/272 ,  B24B37/005 ,  H01L21/30625

Abstract: Monitoring operations of a polishing system includes obtaining a time-based sequence of reference images of a component of the polishing system performing operations during a test operation of the polishing system, receiving from a camera a time-based sequence of monitoring images of an equivalent component of an equivalent polishing system performing operations during polishing of a substrate, determining a difference value for the time-based sequence of monitoring images by comparing the time-based sequence of reference images to the time-based sequence of monitoring image using an image processing algorithm, determining whether the difference value exceeds a threshold, and in response to determining the difference value exceeds the threshold, indicating an excursion.

公开(公告)号：US20220284560A1

公开(公告)日：2022-09-08

申请号：US17678936

申请日：2022-02-23

Applicant: Applied Materials, Inc.

Inventor： Sidney P. Huey ,  Thomas Li ,  Benjamin Cherian

IPC: G06T7/00 ,  G06T7/20 ,  H04N7/18 ,  H04N5/272 ,  B24B37/005

Abstract: Monitoring operations of a polishing system includes obtaining a time-based sequence of reference images of a component of the polishing system performing operations during a test operation of the polishing system, receiving from a camera a time-based sequence of monitoring images of an equivalent component of an equivalent polishing system performing operations during polishing of a substrate, determining a difference value for the time-based sequence of monitoring images by comparing the time-based sequence of reference images to the time-based sequence of monitoring image using an image processing algorithm, determining whether the difference value exceeds a threshold, and in response to determining the difference value exceeds the threshold, indicating an excursion.

公开(公告)号：US20220281060A1

公开(公告)日：2022-09-08

申请号：US17677895

申请日：2022-02-22

Applicant: Applied Materials, Inc.

Inventor： Thomas Li ,  Benjamin Cherian

IPC: B24B37/013 ,  B24B37/04 ,  H01L21/66

Abstract: A method of polishing includes holding a substrate with a carrier head against a polishing surface of a polishing pad, generating relative motion between the substrate and polishing pad, applying a first pressure in a first cyclic waveform having a first frequency to a first region of the substrate, applying a second pressure in a second cyclic waveform having a different second frequency to a different second region of the substrate, during polishing of the substrate, monitoring the substrate with an in-situ motor torque monitoring system to generate a sequence of measured values, and determining a relative contribution to the sequence of measured values from the first region and second region based on distinguishing the first frequency from the second frequency.

公开(公告)号：US09056383B2

公开(公告)日：2015-06-16

申请号：US13777829

申请日：2013-02-26

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Jun Qian ,  Thomas Li ,  Doyle E. Bennett ,  David J. Lischka ,  Steven M. Zuniga

IPC: B24B49/00 ,  B24B49/12 ,  B24B37/013

CPC classification number: B24B49/12 ,  B24B37/013

Abstract: A method of operating a polishing system includes polishing a substrate at a polishing station, the substrate held by a carrier head during polishing, transporting the substrate to an in-sequence optical metrology system positioned between the polishing station and another polishing station or a transfer station, measuring a plurality of spectra reflected from the substrate with a probe of the optical metrology system while moving the carrier head to cause the probe to traverse a path across the substrate and while the probe remains stationary, the path across the substrate comprising either a plurality of concentric circles or a plurality of substantially radially aligned arcuate segments, and adjusting a polishing endpoint or a polishing parameter of the polishing system based on one or more characterizing values generated based on at least some of the plurality of spectra.

Abstract translation: 一种操作抛光系统的方法包括在抛光台处抛光衬底，在抛光期间由衬底保持的衬底，将衬底传送到定位在抛光站与另一抛光站或转移站之间的顺序光学测量系统 测量由光学计量系统的探针从衬底反射的多个光谱，同时移动载体头以使探针横穿穿过衬底的路径，并且当探针保持静止时，穿过衬底的路径包括多个 同心圆或多个基本上径向对齐的弧形段，以及基于基于多个光谱中的至少一些生成的一个或多个特征值来调整抛光系统的抛光端点或抛光参数。

公开(公告)号：US20140242879A1

公开(公告)日：2014-08-28

申请号：US13777829

申请日：2013-02-26

Applicant: Applied Materials, Inc.

Inventor： Jeffrey Drue David ,  Benjamin Cherian ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Thomas H. Osterheld ,  Jun Qian ,  Thomas Li ,  Doyle E. Bennett ,  David J. Lischka ,  Steven M. Zuniga

IPC: B24B49/12

CPC classification number: B24B49/12 ,  B24B37/013

Abstract: A method of operating a polishing system includes polishing a substrate at a polishing station, the substrate held by a carrier head during polishing, transporting the substrate to an in-sequence optical metrology system positioned between the polishing station and another polishing station or a transfer station, measuring a plurality of spectra reflected from the substrate with a probe of the optical metrology system while moving the carrier head to cause the probe to traverse a path across the substrate and while the probe remains stationary, the path across the substrate comprising either a plurality of concentric circles or a plurality of substantially radially aligned arcuate segments, and adjusting a polishing endpoint or a polishing parameter of the polishing system based on one or more characterizing values generated based on at least some of the plurality of spectra.

Abstract translation: 一种操作抛光系统的方法包括在抛光台处抛光衬底，在抛光期间由衬底保持的衬底，将衬底传送到定位在抛光站与另一抛光站或转移站之间的顺序光学测量系统 测量由光学计量系统的探针从衬底反射的多个光谱，同时移动载体头以使探针横穿穿过衬底的路径，并且当探针保持静止时，穿过衬底的路径包括多个 同心圆或多个基本上径向对齐的弧形段，以及基于基于多个光谱中的至少一些生成的一个或多个特征值来调整抛光系统的抛光端点或抛光参数。

公开(公告)号：US20240176312A1

公开(公告)日：2024-05-30

申请号：US18070448

申请日：2022-11-28

Applicant: Applied Materials, Inc.

Inventor： Sidharth Bhatia ,  Roger Lindley ,  Upendra Ummethala ,  Thomas Li ,  Michael Howells ,  Steven Babayan ,  Mimi-Diemmy Dao

IPC: G05B13/02 ,  G05B13/04

CPC classification number: G05B13/027 ,  G05B13/048

Abstract: A method includes providing, as input to a first trained machine learning model, trace data associated with one or more substrate processing procedures. The input further includes equipment constants associated with the one or more substrate processing procedures. The input further includes trace data of a first processing chamber. The input further includes equipment constants of the first processing chamber. The method further includes obtaining, as output from the first trained machine learning model, a recommended update to a first equipment constant of the first processing chamber. The method further includes updated the first equipment constant of the first processing chamber responsive to obtaining the output from the first trained machine learning model.

公开(公告)号：US11989492B2

公开(公告)日：2024-05-21

申请号：US16554486

申请日：2019-08-28

Applicant: Applied Materials, Inc.

Inventor： Sivakumar Dhandapani ,  Thomas Li ,  Jun Qian

IPC: B24B49/10 ,  B24B37/04 ,  G06F30/17 ,  G06F30/333 ,  G06F115/10

CPC classification number: G06F30/17 ,  B24B37/042 ,  B24B49/10 ,  G06F30/333 ,  G06F2115/10

Abstract: A method of generating a matrix to relate a plurality of controllable parameters of a chemical mechanical polishing system to a polishing rate profile includes polishing a test substrate. The test substrate is polished for a first period of time using baseline parameter values with a first parameter set to a first value, and the test substrate is polished for a second period of time using first modified parameter values with the first parameter set to a modified second value. A thickness of the test substrate is monitored during polishing, and a baseline polishing rate profile is determined for the first period of time and a first modified polishing rate profile is determined for the second period of time. The matrix is calculated based on the baseline parameter values, the first modified parameters, the baseline polishing rate profile and the first modified polishing rate profile.

公开(公告)号：US11673226B2

公开(公告)日：2023-06-13

申请号：US16435302

申请日：2019-06-07

Applicant: Applied Materials, Inc.

Inventor： Andrew J. Nagengast ,  Christopher Heung-Gyun Lee ,  Thomas Li ,  Anand N. Iyer ,  Jie Diao ,  Huanbo Zhang ,  Erik S. Rondum ,  Wei-Cheng Lee ,  Jeonghoon Oh

IPC: B24B37/32 ,  H01L21/306 ,  H01L21/67 ,  H01L21/687

CPC classification number: B24B37/32 ,  H01L21/30625 ,  H01L21/67063 ,  H01L21/67092 ,  H01L21/68735

Abstract: A retaining ring includes a generally annular body having an inner surface to constrain a substrate, an outer surface, and a bottom surface. The bottom surface has a plurality of channels extending from the outer surface to the inner surface and a plurality of islands separated by the channels and providing a contact area to contact a polishing pad. Each channel includes a recessed region adjacent the outer surface such that the channel is deeper in the recessed region than in a remainder of the channel. The recessed region and the remainder of the channel each have substantially uniform depth.