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    Transmission corrected plasma emission using in-situ optical reflectometry
    13.
    发明授权
    Transmission corrected plasma emission using in-situ optical reflectometry 有权

    公开(公告)号：US12031910B2

    公开(公告)日：2024-07-09

    申请号：US17447745

    申请日：2021-09-15

    Applicant: Applied Materials, Inc.

    Inventor： Patrick Tae ,  Zhaozhao Zhu ,  Blake W. Erickson ,  Chunlei Zhang

    IPC: G01N21/55

    CPC classification number: G01N21/55 ,  G01N2021/558

    Abstract: Implementations disclosed describe a system including a light source, an optical sensor, and a processing device. The light source directs, during a first time, a probe light into a processing chamber through a window. The light source ceases, during a second time, directing the probe light into the processing chamber through the window. The optical sensor detects, during the first time, a first intensity of a first light. The first light includes a portion of the probe light reflected from the window and a light transmitted from an environment of the processing chamber through the window. The optical sensor detects, during the second time, a second intensity of a second light. The second light includes the light transmitted from the environment of the processing chamber through the window. The processing device determines, using the first intensity and the second intensity, a transmission coefficient of the window.

    INTEGRATED SUBSTRATE MEASUREMENT SYSTEM TO IMPROVE MANUFACTURING PROCESS PERFORMANCE
    15.
    发明申请
    INTEGRATED SUBSTRATE MEASUREMENT SYSTEM TO IMPROVE MANUFACTURING PROCESS PERFORMANCE 有权

    公开(公告)号：US20220028713A1

    公开(公告)日：2022-01-27

    申请号：US17379653

    申请日：2021-07-19

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Upendra V. Ummethala ,  Blake Erickson ,  Prashanth Kumar ,  Michael Kutney ,  Steven Trey Tindel ,  Zhaozhao Zhu

    IPC: H01L21/67 ,  H01L21/66

    Abstract: A method for determining whether to modify a manufacturing process recipe is provided. A substrate to be processed at a manufacturing system according to the first process recipe is identified. An instruction to transfer the substrate to a substrate measurement subsystem to obtain a first set of measurements for the substrate is generated. The first set of measurements for the substrate is received from the substrate measurement subsystem. An instruction to transfer the substrate from the substrate measurement subsystem to a processing chamber is generated. A second set of measurements for the substrate is received from one or more sensors of the processing chamber. A first mapping between the first set of measurements and the second set of measurements for the substrate is generated. The first set of measurements mapped to the second set of measurements for the substrate is stored. A determination is made based on the first set of measurements mapped to the second set of measurements for the substrate of whether to modify the first process recipe or a second process recipe for the substrate.

    THIN FILM, IN-SITU MEASUREMENT THROUGH TRANSPARENT CRYSTAL AND TRANSPARENT SUBSTRATE WITHIN PROCESSING CHAMBER WALL
    16.
    发明申请
    THIN FILM, IN-SITU MEASUREMENT THROUGH TRANSPARENT CRYSTAL AND TRANSPARENT SUBSTRATE WITHIN PROCESSING CHAMBER WALL 有权

    公开(公告)号：US20210391157A1

    公开(公告)日：2021-12-16

    申请号：US16946263

    申请日：2020-06-12

    Applicant: Applied Materials, Inc.

    Inventor： Patrick Tae ,  Blake W. Erickson ,  Zhaozhao Zhu ,  Michael David Willwerth ,  Barry Paul Craver

    IPC: H01J37/32 ,  H01L21/66 ,  G01B11/06

    Abstract: A system includes a transparent crystal, at least part of which is embedded within a wall and a liner of a processing chamber. The transparent crystal has a proximal end and a distal end, the distal end having a distal surface exposed to an interior of the processing chamber. A transparent thin film is deposited on the distal surface and has chemical properties substantially matching those of the liner. A light coupling device is to: transmit light, from a light source, through the proximal end of the transparent crystal, and focus, into a spectrometer, light received reflected back from a combination of the distal surface, a surface of the transparent thin film, and a surface of a process film layer deposited on the transparent thin film. The spectrometer is to detect a first spectrum within the focused light that is representative of the process film layer.

    Chamber component condition estimation using substrate measurements
    17.
    发明授权
    Chamber component condition estimation using substrate measurements 有权

    公开(公告)号：US12216455B2

    公开(公告)日：2025-02-04

    申请号：US17584318

    申请日：2022-01-25

    Applicant: Applied Materials, Inc.

    Inventor： Chunlei Zhang ,  Zhaozhao Zhu ,  Michael Kutney

    IPC: G05B19/418 ,  H01L21/66 ,  H01L21/67

    Abstract: A substrate processing system includes a process chamber, one or more robot, a substrate measurement system, and a computing device. The process chamber may process a substrate that will comprise a film and/or feature after the processing. The one or more robot, to move the substrate from the process chamber to a substrate measurement system. The substrate measurement system may measure the film and/or feature on the substrate and generate a profile map of the film and/or feature. The computing device may process data from the profile map using a first trained machine learning model, wherein the first trained machine learning model outputs a first chamber component condition estimation for a first chamber component of the process chamber. The computing device may then determine whether to perform maintenance on the first chamber component of the process chamber based at least in part on the first chamber component condition estimation.

    MACHINE LEARNING MODEL TRAINING
    19.
    发明申请
    MACHINE LEARNING MODEL TRAINING 有权

    公开(公告)号：US20240393262A1

    公开(公告)日：2024-11-28

    申请号：US18201927

    申请日：2023-05-25

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Jeong Jin Hong ,  Sejune Cheon ,  Sang Hong Kim ,  Thomas Ho Fai Li ,  Anders Andelman Nottrott ,  Zhaozhao Zhu ,  MiHyun Jang

    IPC: G01N21/95 ,  G06T7/00

    Abstract: A method includes receiving spectral data of a substrate and metrology data corresponding to the spectral data of the substrate. The method further includes determining a plurality of feature model configurations for each of a plurality of feature models, each of the plurality of feature model configurations including one or more feature model conditions. The method further includes determining a plurality of feature model combinations, where each feature model combination of the plurality of feature model combinations includes a subset of the plurality of feature model configurations. The method further includes generating a plurality of input datasets, where each input dataset of the plurality of input datasets is generated based on application of the spectral data to a respective feature model combination of the plurality of feature model combinations. The method further includes training a plurality of machine learning models, where each machine learning model is trained to generate an output using an input dataset of the plurality of input datasets and the metrology data. The method further includes selecting a trained machine learning model from the plurality of trained machine learning models satisfying one or more selection criteria.

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