公开(公告)号：US06782337B2

公开(公告)日：2004-08-24

申请号：US09956848

申请日：2001-09-20

申请人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

发明人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

IPC分类号： G06F1900

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and a presence of defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和缺陷的存在。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US07139083B2

公开(公告)日：2006-11-21

申请号：US09956834

申请日：2001-09-20

申请人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

发明人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

IPC分类号： G01B11/28

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a composition and a thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

公开(公告)号：US07106425B1

公开(公告)日：2006-09-12

申请号：US09956845

申请日：2001-09-20

申请人： Gary Bultman ,  Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

发明人： Gary Bultman ,  Ady Levy ,  Kyle A. Brown ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden

IPC分类号： G01N21/88

CPC分类号： G01N21/9501 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N2021/646 ,  G01N2021/8825

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of defects on the specimen and a thin film characteristic of the specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于在样本上存在缺陷和样本的薄膜特性。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US06950196B2

公开(公告)日：2005-09-27

申请号：US09956841

申请日：2001-09-20

申请人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

发明人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

IPC分类号： G01N21/21 ,  G01N21/47 ,  G01N21/55 ,  G01N21/63 ,  G01N21/64 ,  G01N21/95 ,  G03F7/20 ,  H01J37/317 ,  H01L21/02 ,  H01L21/265 ,  H01L21/66 ,  G01B11/28 ,  G01N21/00

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a thickness of a structure on a specimen and at least one additional property of the specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于样本上的结构的厚度和样本的至少一个附加特性。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US06946394B2

公开(公告)日：2005-09-20

申请号：US09956840

申请日：2001-09-20

申请人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

发明人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

IPC分类号： G01N21/21 ,  G01N21/47 ,  G01N21/55 ,  G01N21/63 ,  G01N21/64 ,  G01N21/95 ,  G03F7/20 ,  H01J37/317 ,  H01L21/02 ,  H01L21/265 ,  H01L21/66 ,  H01L21/44

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a characteristic of a layer formed on a specimen by a deposition process. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个性质，包括但不限于通过沉积工艺在样品上形成的层的特性。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US06919957B2

公开(公告)日：2005-07-19

申请号：US09957468

申请日：2001-09-20

申请人： Mehrdad Nikoonahad ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Dan Wack ,  John Fielden

发明人： Mehrdad Nikoonahad ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Dan Wack ,  John Fielden

IPC分类号： G01N21/21 ,  G01N21/47 ,  G01N21/63 ,  G01N21/64 ,  G01N21/95 ,  G03F7/20 ,  H01L21/66 ,  G01N21/00

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/4788 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸，缺陷的存在和薄膜特性。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US06917419B2

公开(公告)日：2005-07-12

申请号：US09956837

申请日：2001-09-20

申请人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

发明人： John Fielden ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack

IPC分类号： G01N21/21 ,  G01N21/47 ,  G01N21/55 ,  G01N21/63 ,  G01N21/64 ,  G01N21/95 ,  G03F7/20 ,  H01J37/317 ,  H01L21/02 ,  H01L21/265 ,  H01L21/66 ,  G01N21/00

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/55 ,  G01N21/636 ,  G01N21/64 ,  G01N21/94 ,  G01N21/9501 ,  G01N21/9503 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  Y10T117/1004 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, flatness, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于平坦度，缺陷的存在和薄膜特性。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US06673637B2

公开(公告)日：2004-01-06

申请号：US09956851

申请日：2001-09-20

申请人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

发明人： Dan Wack ,  Ady Levy ,  Kyle A. Brown ,  Gary Bultman ,  Mehrdad Nikoonahad ,  John Fielden

IPC分类号： H01L2166

CPC分类号： G03F7/70708 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of macro defects and overlay of a specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

公开(公告)号：US08502979B2

公开(公告)日：2013-08-06

申请号：US13467042

申请日：2012-05-09

申请人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

发明人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

IPC分类号： G01B11/00 ,  G01B11/30 ,  G01B11/14 ,  G01B11/28

CPC分类号： G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位; 缺陷和薄膜特性; 临界尺寸和缺陷; 临界尺寸和薄膜特性; 临界尺寸，薄膜特性和缺陷; 宏观缺陷和微缺陷; 平整度，薄膜特性和缺陷; 重叠错位和平整度; 植入物特征和缺陷; 附着力和厚度。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US07751046B2

公开(公告)日：2010-07-06

申请号：US10401242

申请日：2003-03-27

申请人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdulhalim

发明人： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdulhalim

IPC分类号： G01B11/00 ,  G01N21/00 ,  G01B11/30 ,  G01B11/14 ,  G01B11/02

CPC分类号： G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

摘要翻译： 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。