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    Communications jacks with compensation for differential to differential and differential to common mode crosstalk
    14.
    发明授权
    Communications jacks with compensation for differential to differential and differential to common mode crosstalk 有权
    通信插座具有差分到差分和差分至共模串扰的补偿

    公开(公告)号：US07320624B2

    公开(公告)日：2008-01-22

    申请号：US11688458

    申请日：2007-03-20

    Applicant: Amid Hashim ,  Robert Ray Goodrich

    Inventor： Amid Hashim ,  Robert Ray Goodrich

    IPC: H01R24/00

    CPC classification number: H01R13/6469 ,  H01R24/64 ,  Y10S439/941

    Abstract: A communications jack assembly includes: a jack frame having a plug aperture; a dielectric mounting substrate attached to the jack frame; and a plurality of conductors engaged with the mounting substrate, each of the conductors including a fixed end portion mounted with the mounting substrate and a free end portion extending into the plug aperture for electrical contact with a mating plug, each of the free end portions having substantially the same profile and being substantially transversely aligned in side-by-side relationship. A first pair of conductors is sandwiched inside a second pair of conductors. The second pair of conductors includes a crossover, the positioning of crossover being selected to provide differential to common mode crosstalk compensation.

    Abstract translation: 通信插座组件包括：具有插头孔的插座框架; 安装在所述插座框架上的电介质安装基板; 以及与安装基板接合的多个导体，每个导体包括安装有安装基板的固定端部和延伸到插头孔中的自由端部，用于与匹配插头电接触，每个自由端部具有 基本上相同的轮廓并且以并排关系基本上横向对齐。 第一对导体被夹在第二对导体内。 第二对导体包括交叉，选择交叉的定位以提供对共模串扰补偿的差分。

    Communications connectors with floating wiring board for imparting crosstalk compensation between conductors
    15.
    发明授权
    Communications connectors with floating wiring board for imparting crosstalk compensation between conductors 有权
    具有浮动布线板的通信连接器，用于在导体之间进行串扰补偿

    公开(公告)号：US07314393B2

    公开(公告)日：2008-01-01

    申请号：US11610125

    申请日：2006-12-13

    Applicant: Amid Hashim

    Inventor： Amid Hashim

    IPC: H01R24/00

    CPC classification number: H01R13/6469 ,  H01R4/2429

    Abstract: A communications connector includes: a dielectric mounting substrate; a plurality of conductors mounted in the mounting substrate; and a wiring board. Each of the conductors includes a fixed end portion mounted in the mounting substrate and a free end portion, each of the free end portions being positioned in side-by-side and generally parallel relationship, and each of the fixed end portions being positioned in side-by side and generally parallel relationship. The wiring board is positioned between the fixed and free end portions of the conductors, the wiring board being generally perpendicular to the conductors, the wiring board including first and second conductive traces that are electrically insulated from each other. First and second conductors are electrically connected with the first and second traces. The first and second conductive traces are arranged on the wiring board to create a crossover between the first and second conductors.

    Abstract translation: 通信连接器包括：电介质安装基板; 安装在安装基板上的多个导体; 和接线板。 每个导体包括安装在安装基板中的固定端部和自由端部，每个自由端部并排并且大致平行的关系，并且每个固定端部位于侧面 - 侧面和一般平行关系。 布线板位于导体的固定端和自由端之间，布线板大致垂直于导体，布线板包括彼此电绝缘的第一和第二导电迹线。 第一和第二导体与第一和第二迹线电连接。 第一和第二导电迹线布置在布线板上以在第一和第二导体之间产生交叉。

    Next high frequency improvement by using frequency dependent effective capacitance
    16.
    发明申请
    Next high frequency improvement by using frequency dependent effective capacitance 有权
    通过使用频率依赖的有效电容，进一步提高频率

    公开(公告)号：US20070133185A1

    公开(公告)日：2007-06-14

    申请号：US11657024

    申请日：2007-01-24

    Applicant: Amid Hashim ,  Julian Pharney

    Inventor： Amid Hashim ,  Julian Pharney

    IPC: H05K7/00

    CPC classification number: H05K1/0228 ,  H01R13/6469 ,  H01R24/64 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/09236 ,  H05K2201/10189 ,  Y10S439/941

    Abstract: A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.

    Abstract translation: 提供连接器，用于当使用低串扰插头时同时提高NEXT高频性能，并且当使用高串扰插头时NEXT低频性能。 连接器包括在PCB的第一级区域设置在PCB的内部金属化层上的第一补偿结构和设置在PCB的第二级区域的第二补偿结构，用于以增加的频率增加补偿电容。

    Cross-connect systems with connector blocks having balanced insulation displacement contacts
    17.
    发明授权
    Cross-connect systems with connector blocks having balanced insulation displacement contacts 有权
    具有连接器块的交叉连接系统具有平衡的绝缘位移触点

    公开(公告)号：US07223115B2

    公开(公告)日：2007-05-29

    申请号：US11154836

    申请日：2005-06-16

    Applicant: Amid Hashim ,  Scott M. Keith

    Inventor： Amid Hashim ,  Scott M. Keith

    IPC: H01R4/24

    CPC classification number: H01R4/245 ,  H01R13/6467 ,  Y10S439/942

    Abstract: An insulation displacement contact (IDC) includes: upper and lower ends, each of the upper and lower ends including a slot configured to receive a conductor therein, the slots being generally parallel and non-collinear; and a transitional area merging with the upper and lower ends. An IDC of this configuration can be employed, for example, in 110-style connectors, and can enable such connectors to compensate for differential to common mode crosstalk between adjacent IDC pairs.

    Abstract translation: 绝缘位移触点（IDC）包括：上端和下端，每个上端和下端包括被配置为在其中接纳导体的槽，所述槽大致平行和非共线; 以及与上下两端并流的过渡区。 这种配置的IDC可以用于例如110型连接器，并且可以使这种连接器能够补偿相邻IDC对之间的差模到共模串扰。

    Communications jack with compensation for differential to differential and differential to common mode crosstalk
    18.
    发明授权
    Communications jack with compensation for differential to differential and differential to common mode crosstalk 有权
    通信插孔，具有差分到差分和差分至共模串扰的补偿

    公开(公告)号：US07204722B2

    公开(公告)日：2007-04-17

    申请号：US11088044

    申请日：2005-03-23

    Applicant: Amid Hashim ,  Robert Ray Goodrich

    Inventor： Amid Hashim ,  Robert Ray Goodrich

    IPC: H01R24/00 ,  H01R13/625

    CPC classification number: H05K1/0228 ,  H01R4/242 ,  H01R13/6467 ,  H01R13/6658 ,  H01R24/64 ,  H05K2201/09245 ,  H05K2201/10189 ,  Y10S439/941

    Abstract: A communications jack assembly includes: a jack frame having a plug aperture; a dielectric mounting substrate attached to the jack frame; and a plurality of conductors engaged with the mounting substrate, each of the conductors including a fixed end portion mounted with the mounting substrate and a free end portion extending into the plug aperture for electrical contact with a mating plug, each of the free end portions having substantially the same profile and being substantially transversely aligned in side-by-side relationship. A first pair of conductors is sandwiched inside a second pair of conductors. The second pair of conductors includes a crossover, the positioning of crossover being selected to provide differential to common mode crosstalk compensation.

    Abstract translation: 通信插座组件包括：具有插头孔的插座框架; 安装在所述插座框架上的电介质安装基板; 以及与安装基板接合的多个导体，每个导体包括安装有安装基板的固定端部和延伸到插头孔中的自由端部，用于与匹配插头电接触，每个自由端部具有 基本上相同的轮廓并且以并排关系基本上横向对齐。 第一对导体被夹在第二对导体内。 第二对导体包括交叉，选择交叉的定位以提供对共模串扰补偿的差分。

    110-style connecting block with balanced insulation displacment contacts
    19.
    发明申请
    110-style connecting block with balanced insulation displacment contacts 有权
    110型连接块，平衡绝缘位移触点

    公开(公告)号：US20060292920A1

    公开(公告)日：2006-12-28

    申请号：US11154836

    申请日：2005-06-16

    Applicant: Amid Hashim ,  Scott Keith

    Inventor： Amid Hashim ,  Scott Keith

    IPC: H01R4/24

    CPC classification number: H01R4/245 ,  H01R13/6467 ,  Y10S439/942

    Abstract: An insulation displacement contact (IDC) includes: upper and lower ends, each of the upper and lower ends including a slot configured to receive a conductor therein, the slots being generally parallel and non-collinear; and a transitional area merging with the upper and lower ends. An IDC of this configuration can be employed, for example, in 110-style connectors, and can enable such connectors to compensate for differential to common mode crosstalk between adjacent IDC pairs.

    Abstract translation: 绝缘位移触点（IDC）包括：上端和下端，每个上端和下端包括被配置为在其中接纳导体的槽，所述槽大致平行和非共线; 以及与上下两端并流的过渡区。 这种配置的IDC可以用于例如110型连接器，并且可以使这种连接器能够补偿相邻IDC对之间的差模到共模串扰。

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