SHIELDED INTEGRATED DEVICE PACKAGES
    11.
    发明申请

    公开(公告)号:US20200185450A1

    公开(公告)日:2020-06-11

    申请号:US16705105

    申请日:2019-12-05

    Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.

    Compact sensor module
    12.
    发明授权

    公开(公告)号:US10340302B2

    公开(公告)日:2019-07-02

    申请号:US14805835

    申请日:2015-07-22

    Abstract: Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate wrapped around a side of the stiffener. A sensor die may mounted on the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.

    ELECTRIC COIL STRUCTURE
    13.
    发明申请

    公开(公告)号:US20190139695A1

    公开(公告)日:2019-05-09

    申请号:US16162660

    申请日:2018-10-17

    Abstract: In one aspect, an electric coil structure is disclosed. The electric coil structure includes a magnetic core and a substrate. The substrate comprises a conductive material that is embedded in an insulating material. The substrate has a first portion and a second portion and the first portion of the substrate is wrapped around the core. The substrate can have a first portion having a plurality of contacts and a second portion having a corresponding plurality of edge contacts. The coil structure includes an alignment structure. The alignment structure can facilitate attachment of the first portion to the second portion to define a coil about the magnetic core. The alignment structure can comprise a redistribution substrate. The redistribution substrate can be disposed between the first portion and the second portion with the conductive material of the first portion electrically connected to the conductive material of the second portion through the redistribution substrate to define at least one winding. The alignment structure can include an adhesive. The adhesive can be disposed in the recess electrically connecting the first and second portions to define at least one winding. The coil structure can include a solder joint. The solder joint can be disposed between the plurality of contacts and the corresponding plurality of edge contacts making electrical connections between the first and second portions to define at least one winding such that the solder joint is exposed on the first portion.

    NEGATIVE FILLET FOR MOUNTING AN INTEGRATED DEVICE DIE TO A CARRIER

    公开(公告)号:US20190043823A1

    公开(公告)日:2019-02-07

    申请号:US16017986

    申请日:2018-06-25

    Abstract: In some embodiments, an electronic module is disclosed. The electronic module can include a carrier and an integrated device die having an upper surface, a lower surface, and an outer side edge. The integrated device die can include a first surface recessed from the lower surface and a second surface extending between the lower surface and the first surface. The second surface can be laterally inset from the outer side edge. The electronic module can include a mounting compound comprising a first portion disposed between the lower surface of the integrated device die and the carrier and a second portion disposed along at least a portion of the second surface of the integrated device die.

    Flex-based surface mount transformer

    公开(公告)号:US10090094B2

    公开(公告)日:2018-10-02

    申请号:US15174477

    申请日:2016-06-06

    Abstract: A transformer can include a flexible substrate having at least a first conductive layer and a dielectric layer. The transformer can further include an unbroken toroidal core of a magnetic material. The magnetic material can include material with a relative magnetic permeability greater than unity. The substrate can include a plurality of planar extensions arranged to provide respective windings encircling the core when the planar extensions are folded and attached back to another region of the substrate. Adjacent windings can be conductively isolated from each other. The flexible substrate can further include a second conductive layer separated from the first conductive layer by the dielectric layer. The first conductive layer and the second conductive layer can be coupled via a plurality of interconnects so that the respective windings are formed when the planar extensions are folded and attached back to the another region of the substrate.

    Multi-port device package
    16.
    发明授权
    Multi-port device package 有权
    多端口设备包

    公开(公告)号:US09254995B2

    公开(公告)日:2016-02-09

    申请号:US14028856

    申请日:2013-09-17

    Abstract: An integrated device package includes a housing having a first opening and a second opening in fluid communication with an interior volume of the housing. A package substrate(s) has a first port and a second port. A first device die is mounted to the substrate(s) over the first port. A second device die is mounted to the substrate(s) over the second port. The substrate(s) is coupled to the housing to cover the first and second openings such that the first device die is disposed within the interior volume through the first opening and the second device die is disposed within the interior volume through the second opening.

    Abstract translation: 集成器件封装包括具有第一开口的壳体和与壳体的内部体积流体连通的第二开口。 封装衬底具有第一端口和第二端口。 第一器件裸片安装到第一端口上的衬底上。 第二器件裸片通过第二端口安装到衬底上。 衬底被耦合到壳体以覆盖第一和第二开口,使得第一器件管芯通过第一开口设置在内部容积内,并且第二器件管芯通过第二开口设置在内部容积内。

    SENSOR MODULE
    17.
    发明公开
    SENSOR MODULE 审中-公开

    公开(公告)号:US20230384137A1

    公开(公告)日:2023-11-30

    申请号:US18247987

    申请日:2021-10-27

    CPC classification number: G01F11/027 A61M5/31511

    Abstract: A sensor module is disclosed. The sensor module can include a housing body that is disposed about a cavity that is sized and shaped to receive a container in which a substance is disposed in an operational configuration of the sensor module. The sensor module can include a first electrode that is coupled to or formed with the housing body. The first electrode is disposed at a first peripheral position on the housing body. The sensor module can include a second electrode that is coupled to or formed with the housing body. The second electrode is disposed at a second peripheral position on the housing body that is opposite the first peripheral position. The cavity is disposed between the first and second electrodes in the operational configuration of the housing body.

    Fluid control system
    18.
    发明授权

    公开(公告)号:US11796367B2

    公开(公告)日:2023-10-24

    申请号:US17315050

    申请日:2021-05-07

    CPC classification number: G01F3/226 G01F1/06 G01F3/20 G01F3/227

    Abstract: A flow meter is disclosed. The flow meter can include a housing that has a cavity. The flow meter can also include a deformable tube that is disposed in the cavity. The deformable tube can comprise a portion of a flow path of a fluid substance. The flow meter can further include a cam that is rotatably coupled to the housing. A portion of the cam is configured to press against a portion of the collapsible tube so as to deform the portion of the collapsible tube. The cam can be configured to rotate in response to a flow of the fluid substance in the flow path.

    Electronic devices
    19.
    发明授权

    公开(公告)号:US11628275B2

    公开(公告)日:2023-04-18

    申请号:US16261333

    申请日:2019-01-29

    Abstract: An electronic device is disclosed. The electronic device comprise an elongate electrical connector that is configured to connect to an integrated device package. The elongate electrical connector can comprise an elongate flexible substrate. The elongate flexible substrate has a proximal portion and a distal portion spaced from the proximal portion by a length along a longitudinal axis. The elongate flexible substrate has a width along an axis transverse to the longitudinal axis. The elongate flexible substrate defines an elongation ratio of the length to the width. The elongation ratio is at least 100:1. The elongate electrical connector can be connected to a bobbin. The elongate electrical connector can be configured to unspool from the bobbin.

    FLUID CONTROL SYSTEM
    20.
    发明申请

    公开(公告)号:US20220357192A1

    公开(公告)日:2022-11-10

    申请号:US17315050

    申请日:2021-05-07

    Abstract: A flow meter is disclosed. The flow meter can include a housing that has a cavity. The flow meter can also include a deformable tube that is disposed in the cavity. The deformable tube can comprise a portion of a flow path of a fluid substance. The flow meter can further include a cam that is rotatably coupled to the housing. A portion of the cam is configured to press against a portion of the collapsible tube so as to deform the portion of the collapsible tube. The cam can be configured to rotate in response to a flow of the fluid substance in the flow path.

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