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公开(公告)号：US20200185450A1
公开(公告)日：2020-06-11
申请号：US16705105
申请日：2019-12-05
Applicant: Analog Devices, Inc.
Inventor： Vikram Venkatadri , Mark Downey , Santosh Anil Kudtarkar
IPC: H01L27/146 , G01T1/24
Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.
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公开(公告)号：US10340302B2
公开(公告)日：2019-07-02
申请号：US14805835
申请日：2015-07-22
Applicant: ANALOG DEVICES, INC.
Inventor： David Frank Bolognia , Vikram Venkatadri
IPC: H01L27/146 , H01L31/0203 , H01L31/024
Abstract: Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate wrapped around a side of the stiffener. A sensor die may mounted on the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.
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公开(公告)号：US20190139695A1
公开(公告)日：2019-05-09
申请号：US16162660
申请日：2018-10-17
Applicant: ANALOG DEVICES, INC.
Inventor： Vikram Venkatadri , David Frank Bolognia , Kelvin Po Leung Pun , Chee Wah Cheung
Abstract: In one aspect, an electric coil structure is disclosed. The electric coil structure includes a magnetic core and a substrate. The substrate comprises a conductive material that is embedded in an insulating material. The substrate has a first portion and a second portion and the first portion of the substrate is wrapped around the core. The substrate can have a first portion having a plurality of contacts and a second portion having a corresponding plurality of edge contacts. The coil structure includes an alignment structure. The alignment structure can facilitate attachment of the first portion to the second portion to define a coil about the magnetic core. The alignment structure can comprise a redistribution substrate. The redistribution substrate can be disposed between the first portion and the second portion with the conductive material of the first portion electrically connected to the conductive material of the second portion through the redistribution substrate to define at least one winding. The alignment structure can include an adhesive. The adhesive can be disposed in the recess electrically connecting the first and second portions to define at least one winding. The coil structure can include a solder joint. The solder joint can be disposed between the plurality of contacts and the corresponding plurality of edge contacts making electrical connections between the first and second portions to define at least one winding such that the solder joint is exposed on the first portion.
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公开(公告)号：US20190043823A1
公开(公告)日：2019-02-07
申请号：US16017986
申请日：2018-06-25
Applicant: ANALOG DEVICES, INC.
Inventor： Vikram Venkatadri , David Frank Bolognia
IPC: H01L23/00 , H01L21/56 , H01L27/146
Abstract: In some embodiments, an electronic module is disclosed. The electronic module can include a carrier and an integrated device die having an upper surface, a lower surface, and an outer side edge. The integrated device die can include a first surface recessed from the lower surface and a second surface extending between the lower surface and the first surface. The second surface can be laterally inset from the outer side edge. The electronic module can include a mounting compound comprising a first portion disposed between the lower surface of the integrated device die and the carrier and a second portion disposed along at least a portion of the second surface of the integrated device die.
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公开(公告)号：US10090094B2
公开(公告)日：2018-10-02
申请号：US15174477
申请日：2016-06-06
Applicant: Analog Devices, Inc.
Inventor： David Bolognia , Vikram Venkatadri
Abstract: A transformer can include a flexible substrate having at least a first conductive layer and a dielectric layer. The transformer can further include an unbroken toroidal core of a magnetic material. The magnetic material can include material with a relative magnetic permeability greater than unity. The substrate can include a plurality of planar extensions arranged to provide respective windings encircling the core when the planar extensions are folded and attached back to another region of the substrate. Adjacent windings can be conductively isolated from each other. The flexible substrate can further include a second conductive layer separated from the first conductive layer by the dielectric layer. The first conductive layer and the second conductive layer can be coupled via a plurality of interconnects so that the respective windings are formed when the planar extensions are folded and attached back to the another region of the substrate.
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Patent Agency Ranking
公开(公告)号：US09254995B2
公开(公告)日：2016-02-09
申请号：US14028856
申请日：2013-09-17
Applicant: Analog Devices, Inc.
Inventor： David Bolognia , Vikram Venkatadri
CPC classification number: B81B7/0074 , B81B7/0058 , B81B7/008 , B81B2201/0257 , B81C1/00309 , H01L2224/48091 , H01L2224/73265 , H01L2924/15151 , H01L2924/16152 , H04R1/04 , H04R1/406 , H04R25/405 , H01L2924/00014
Abstract: An integrated device package includes a housing having a first opening and a second opening in fluid communication with an interior volume of the housing. A package substrate(s) has a first port and a second port. A first device die is mounted to the substrate(s) over the first port. A second device die is mounted to the substrate(s) over the second port. The substrate(s) is coupled to the housing to cover the first and second openings such that the first device die is disposed within the interior volume through the first opening and the second device die is disposed within the interior volume through the second opening.
Abstract translation: 集成器件封装包括具有第一开口的壳体和与壳体的内部体积流体连通的第二开口。 封装衬底具有第一端口和第二端口。 第一器件裸片安装到第一端口上的衬底上。 第二器件裸片通过第二端口安装到衬底上。 衬底被耦合到壳体以覆盖第一和第二开口，使得第一器件管芯通过第一开口设置在内部容积内，并且第二器件管芯通过第二开口设置在内部容积内。
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公开(公告)号：US20230384137A1
公开(公告)日：2023-11-30
申请号：US18247987
申请日：2021-10-27
Applicant: ANALOG DEVICES, INC.
Inventor： Vikram Venkatadri , David Frank Bolognia
CPC classification number: G01F11/027 , A61M5/31511
Abstract: A sensor module is disclosed. The sensor module can include a housing body that is disposed about a cavity that is sized and shaped to receive a container in which a substance is disposed in an operational configuration of the sensor module. The sensor module can include a first electrode that is coupled to or formed with the housing body. The first electrode is disposed at a first peripheral position on the housing body. The sensor module can include a second electrode that is coupled to or formed with the housing body. The second electrode is disposed at a second peripheral position on the housing body that is opposite the first peripheral position. The cavity is disposed between the first and second electrodes in the operational configuration of the housing body.
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公开(公告)号：US11796367B2
公开(公告)日：2023-10-24
申请号：US17315050
申请日：2021-05-07
Applicant: Analog Devices, Inc.
Inventor： Vikram Venkatadri , David Frank Bolognia
Abstract: A flow meter is disclosed. The flow meter can include a housing that has a cavity. The flow meter can also include a deformable tube that is disposed in the cavity. The deformable tube can comprise a portion of a flow path of a fluid substance. The flow meter can further include a cam that is rotatably coupled to the housing. A portion of the cam is configured to press against a portion of the collapsible tube so as to deform the portion of the collapsible tube. The cam can be configured to rotate in response to a flow of the fluid substance in the flow path.
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公开(公告)号：US11628275B2
公开(公告)日：2023-04-18
申请号：US16261333
申请日：2019-01-29
Applicant: ANALOG DEVICES, INC.
Inventor： Vikram Venkatadri , David Frank Bolognia
Abstract: An electronic device is disclosed. The electronic device comprise an elongate electrical connector that is configured to connect to an integrated device package. The elongate electrical connector can comprise an elongate flexible substrate. The elongate flexible substrate has a proximal portion and a distal portion spaced from the proximal portion by a length along a longitudinal axis. The elongate flexible substrate has a width along an axis transverse to the longitudinal axis. The elongate flexible substrate defines an elongation ratio of the length to the width. The elongation ratio is at least 100:1. The elongate electrical connector can be connected to a bobbin. The elongate electrical connector can be configured to unspool from the bobbin.
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公开(公告)号：US20220357192A1
公开(公告)日：2022-11-10
申请号：US17315050
申请日：2021-05-07
Applicant: Analog Devices, Inc.
Inventor： Vikram Venkatadri , David Frank Bolognia
Abstract: A flow meter is disclosed. The flow meter can include a housing that has a cavity. The flow meter can also include a deformable tube that is disposed in the cavity. The deformable tube can comprise a portion of a flow path of a fluid substance. The flow meter can further include a cam that is rotatably coupled to the housing. A portion of the cam is configured to press against a portion of the collapsible tube so as to deform the portion of the collapsible tube. The cam can be configured to rotate in response to a flow of the fluid substance in the flow path.
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