公开(公告)号：US20210090908A1

公开(公告)日：2021-03-25

申请号：US16911153

申请日：2020-06-24

Applicant: Apple Inc.

Inventor： Kishore N. Renjan ,  Bilal Mohamed Ibrahim Kani ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Prashanth S. Holenarsipur ,  Praveesh Chandran ,  Vinodh Babu ,  Yuta Kuboyama

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065

Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

公开(公告)号：US20240074066A1

公开(公告)日：2024-02-29

申请号：US18144031

申请日：2023-05-05

Applicant: Apple Inc.

Inventor： Nitesh KUMBHAT ,  Yanfeng Chen ,  Mandar S. Painaik ,  Shankar S. Pennathur ,  Pierpaolo Lupo

IPC: H05K3/28 ,  H01L21/56

CPC classification number: H05K3/284 ,  H01L21/565 ,  H05K2203/1316

Abstract: Various embodiments of a mold cavity structure of a transfer molding system are disclosed. The transfer molding system includes a first mold-forming structure and a second mold-forming structure. The second mold-forming structure includes a mold cavity. The mold cavity includes a gate region, a component region, and a vent region. The component region is configured to enclose an electrical component. A volume of the vent region is adjustable. The transfer molding system further includes an inlet port coupled to the gate region and configured to direct a flow of a molding compound into the mold cavity during an operation of the transfer molding system.

公开(公告)号：US20230386865A1

公开(公告)日：2023-11-30

申请号：US18316962

申请日：2023-05-12

Applicant: Apple Inc.

Inventor： Kishore N. Renjan ,  Bilal Mohamed Ibrahim Kani ,  Kyusang Kim ,  Manoj Vadeentavida ,  Pierpaolo Lupo ,  Prashanth S. Holenarsipur ,  Praveesh Chandran ,  Vinodh Babu ,  Yuta Kuboyama

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/538 ,  H01L23/498 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L21/565 ,  H01L24/13 ,  H01L21/568 ,  H01L23/5389 ,  H01L23/5383 ,  H01L23/49827 ,  H01L23/49811 ,  H01L23/3121 ,  H01L24/97 ,  H01L21/561 ,  H01L25/0655 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/13099 ,  H01L2224/02373 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/02372 ,  H01L2224/48135

Abstract: Optical packages and methods of fabrication are described. In an embodiment, a controller chip is embedded along with optical components, including a photodetector (PD) and one or more emitters, in a single package.

公开(公告)号：US20230189445A1

公开(公告)日：2023-06-15

申请号：US18164180

申请日：2023-02-03

Applicant: Apple Inc.

Inventor： Bilal Mohamed Ibrahim Kani ,  Benjamin J. Grena ,  Kyusang Kim ,  David M. Kindlon ,  Pierpaolo Lupo ,  Kishore N. Renjan ,  Manoj Vadeentavida

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/186 ,  H05K1/189 ,  H05K1/0298 ,  H05K1/0274 ,  H05K2201/10083 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2201/10159

Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.

公开(公告)号：US20220270955A1

公开(公告)日：2022-08-25

申请号：US17685630

申请日：2022-03-03

Applicant: Apple Inc.

Inventor： Pierpaolo Lupo ,  Bilal Mohamed Ibrahim Kani ,  Kishore N. Renjan ,  Kyusang Kim ,  Manoj Vadeentavida

IPC: H01L23/498 ,  G01K13/20 ,  G01K1/08 ,  G01K7/02 ,  G01K7/16 ,  H01L23/00 ,  H01L23/28 ,  H01L23/538

Abstract: Temperature sensor packages and methods of fabrication are described. The temperature sensor packages in accordance with embodiments may be rigid or flexible. In some embodiments the temperature sensor packages are configured for touch sensing, and include an electrically conductive sensor pattern such as a thermocouple or resistance temperature detector (RTD) pattern. In some embodiments, the temperature sensor packages are configured for non-contact sensing an include an embedded transducer.

公开(公告)号：US20210337671A1

公开(公告)日：2021-10-28

申请号：US17212983

申请日：2021-03-25

Applicant: Apple Inc.

Inventor： Bilal Mohamed Ibrahim Kani ,  Benjamin J. Grena ,  Kyusang Kim ,  David M. Kindlon ,  Pierpaolo Lupo ,  Kishore N. Renjan ,  Manoj Vadeentavida

IPC: H05K1/18 ,  H05K1/02

Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.