Photo-oxidation removal of organic contamination for environmental sensor integration

    公开(公告)号:US11141498B2

    公开(公告)日:2021-10-12

    申请号:US16258431

    申请日:2019-01-25

    Applicant: Apple Inc.

    Abstract: A portable communication device includes an apparatus for environmental sensing. The apparatus includes a housing, one or more environmental sensors and an optical source. The housing includes one or more ports for allowing air flow between the surrounding environment and a cavity of the housing. The environmental sensors are coupled to the housing and can sense an environmental agent included in the air flow. The optical source can illuminate the cavity of the housing to decompose unwanted organic compounds inside the port.

    Low heat transfer encapsulation for high sensitivity and low power environmental sensing applications

    公开(公告)号:US10436731B2

    公开(公告)日:2019-10-08

    申请号:US16048139

    申请日:2018-07-27

    Applicant: Apple Inc.

    Abstract: A miniature gas sensing device includes a silicon-based substrate including an opening. A first membrane is formed over the silicon-based substrate and a first portion of the first membrane covers the opening. A gas sensing layer is formed over a number of electrodes disposed over a first surface of the first portion of the first membrane and one or more heating elements. A permeable enclosure encapsulating the gas sensing layer can maintain thermal energy density over the gas sensing layer at a level sufficient to destroy a target gas to allow measuring a zero baseline.

    Microelectromechanical systems devices with improved reliability

    公开(公告)号:US09796578B2

    公开(公告)日:2017-10-24

    申请号:US14502835

    申请日:2014-09-30

    Applicant: Apple Inc.

    CPC classification number: B81B3/0086

    Abstract: An electronic device may include components that are formed using microelectromechanical systems (MEMS) technology. A MEMS device may include a MEMS structure bonded to a semiconductor substrate. The MEMS structure may be formed from a silicon substrate having a cavity and a moveable member suspended over the cavity and free to oscillate within the cavity. The semiconductor substrate may be a complementary metal-oxide semiconductor substrate having circuitry such as sensing electrodes. The sensing electrodes may be used to gather signals that are produced by movement of the suspended member. One or more of the electrodes on the semiconductor substrate may be covered by a dielectric film to prevent electrical shorts between adjacent electrodes on the semiconductor substrate.

    Method and system for CMOS based MEMS bump stop contact damage prevention

    公开(公告)号:US09751756B2

    公开(公告)日:2017-09-05

    申请号:US14451092

    申请日:2014-08-04

    Applicant: Apple Inc.

    CPC classification number: B81C1/00825 B81B2203/0118 B81B2207/115

    Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

    Microelectromechanical Systems Devices with Improved Reliability
    17.
    发明申请
    Microelectromechanical Systems Devices with Improved Reliability 有权
    具有改进可靠性的微机电系统设备

    公开(公告)号:US20160159638A1

    公开(公告)日:2016-06-09

    申请号:US14502835

    申请日:2014-09-30

    Applicant: Apple Inc.

    CPC classification number: B81B3/0086

    Abstract: An electronic device may include components that are formed using microelectromechanical systems (MEMS) technology. A MEMS device may include a MEMS structure bonded to a semiconductor substrate. The MEMS structure may be formed from a silicon substrate having a cavity and a moveable member suspended over the cavity and free to oscillate within the cavity. The semiconductor substrate may be a complementary metal-oxide semiconductor substrate having circuitry such as sensing electrodes. The sensing electrodes may be used to gather signals that are produced by movement of the suspended member. One or more of the electrodes on the semiconductor substrate may be covered by a dielectric film to prevent electrical shorts between adjacent electrodes on the semiconductor substrate.

    Abstract translation: 电子设备可以包括使用微机电系统(MEMS)技术形成的组件。 MEMS器件可以包括结合到半导体衬底的MEMS结构。 MEMS结构可以由具有空腔的硅衬底和悬挂在空腔上的可移动构件形成并且在空腔内自由振荡。 半导体衬底可以是具有诸如感测电极的电路的互补金属氧化物半导体衬底。 感测电极可用于收集通过悬挂构件的运动产生的信号。 半导体衬底上的一个或多个电极可被绝缘膜覆盖,以防止半导体衬底上的相邻电极之间的电短路。

    METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREVENTION
    18.
    发明申请
    METHOD AND SYSTEM FOR CMOS BASED MEMS BUMP STOP CONTACT DAMAGE PREVENTION 有权
    基于CMOS的MEMS BUMP停止触点损伤预防方法与系统

    公开(公告)号:US20150291413A1

    公开(公告)日:2015-10-15

    申请号:US14451092

    申请日:2014-08-04

    Applicant: Apple Inc.

    CPC classification number: B81C1/00825 B81B2203/0118 B81B2207/115

    Abstract: In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.

    Abstract translation: 在一些实施例中,微机电系统可以包括半导体衬底,多个布线层和停止件。 多个布线层可以耦合到半导体基板的第一表面。 止动件可以联接到多个布线层。 在一些实施例中,多个布线层的至少部分在基片的止挡件和第一表面之间包括绝缘材料。 在一些实施例中,至少该部分排除其内的布线。 在一些实施例中,该部分的体积可以通过使用微机电系统来确定。 在一些实施例中,该部分在使用期间可以阻止与停止相邻的电气故障。

    Enhanced location detection using sensors integrated in electronic devices

    公开(公告)号:US11280774B2

    公开(公告)日:2022-03-22

    申请号:US16115478

    申请日:2018-08-28

    Applicant: Apple Inc.

    Abstract: A portable communication device includes one or more miniature sensors to sense one or more environmental gases. A processor is coupled to the miniature sensors and is configured to enhance location detection by determining a sensor signal transition. The sensor signal transition is caused by subsequent exposures of at least one of the miniature sensors to environmental gases of a first air composition and a second air composition. The first air composition and the second air composition are respectively associated with a first location and a second location.

    Self-mixing particulate matter sensors using VCSELs with extrinsic photodiodes

    公开(公告)号:US11112233B2

    公开(公告)日:2021-09-07

    申请号:US16569586

    申请日:2019-09-12

    Applicant: Apple Inc.

    Abstract: Aspects of the subject technology relate to an apparatus for self-mixing particulate-matter sensing using a vertical-cavity surface-emitting laser (VCSEL) with extrinsic photodiodes. The apparatus includes a dual-emitting light source disposed on a first chip and to generate a first light beam and a second light beam. The first light beam illuminates a particulate matter (PM), and a light detector extrinsic to the first chip measures the second light beam and variations of the second light beam and generates a self-mixing signal. The variations of the second light beam are caused by a back-scattered light resulting from back-scattering of the first light beam from the PM. The light detector is coupled to the dual-emitting light source. The direction of the second light beam is opposite to the direction of the first light beam, and the second light beam is directed to a sensitive area of the light detector.

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