Abstract:
Various sensors, including particulate matter sensors, are described. One particulate matter sensor includes a self-mixing interferometry sensor and a set of one or more optical elements. The set of one or more optical elements is positioned to receive an optical emission of the self-mixing interferometry sensor, split the optical emission into multiple beams, and direct each beam of the multiple beams in a different direction. The self-mixing interferometry sensor is configured to generate particle speed information for particles passing through respective measurement regions of the multiple beams.
Abstract:
A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage.
Abstract:
A portable communication device includes an apparatus for environmental sensing. The apparatus includes a housing, one or more environmental sensors and an optical source. The housing includes one or more ports for allowing air flow between the surrounding environment and a cavity of the housing. The environmental sensors are coupled to the housing and can sense an environmental agent included in the air flow. The optical source can illuminate the cavity of the housing to decompose unwanted organic compounds inside the port.
Abstract:
A miniature gas sensing device includes a silicon-based substrate including an opening. A first membrane is formed over the silicon-based substrate and a first portion of the first membrane covers the opening. A gas sensing layer is formed over a number of electrodes disposed over a first surface of the first portion of the first membrane and one or more heating elements. A permeable enclosure encapsulating the gas sensing layer can maintain thermal energy density over the gas sensing layer at a level sufficient to destroy a target gas to allow measuring a zero baseline.
Abstract:
An electronic device may include components that are formed using microelectromechanical systems (MEMS) technology. A MEMS device may include a MEMS structure bonded to a semiconductor substrate. The MEMS structure may be formed from a silicon substrate having a cavity and a moveable member suspended over the cavity and free to oscillate within the cavity. The semiconductor substrate may be a complementary metal-oxide semiconductor substrate having circuitry such as sensing electrodes. The sensing electrodes may be used to gather signals that are produced by movement of the suspended member. One or more of the electrodes on the semiconductor substrate may be covered by a dielectric film to prevent electrical shorts between adjacent electrodes on the semiconductor substrate.
Abstract:
In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.
Abstract:
An electronic device may include components that are formed using microelectromechanical systems (MEMS) technology. A MEMS device may include a MEMS structure bonded to a semiconductor substrate. The MEMS structure may be formed from a silicon substrate having a cavity and a moveable member suspended over the cavity and free to oscillate within the cavity. The semiconductor substrate may be a complementary metal-oxide semiconductor substrate having circuitry such as sensing electrodes. The sensing electrodes may be used to gather signals that are produced by movement of the suspended member. One or more of the electrodes on the semiconductor substrate may be covered by a dielectric film to prevent electrical shorts between adjacent electrodes on the semiconductor substrate.
Abstract:
In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop.
Abstract:
A portable communication device includes one or more miniature sensors to sense one or more environmental gases. A processor is coupled to the miniature sensors and is configured to enhance location detection by determining a sensor signal transition. The sensor signal transition is caused by subsequent exposures of at least one of the miniature sensors to environmental gases of a first air composition and a second air composition. The first air composition and the second air composition are respectively associated with a first location and a second location.
Abstract:
Aspects of the subject technology relate to an apparatus for self-mixing particulate-matter sensing using a vertical-cavity surface-emitting laser (VCSEL) with extrinsic photodiodes. The apparatus includes a dual-emitting light source disposed on a first chip and to generate a first light beam and a second light beam. The first light beam illuminates a particulate matter (PM), and a light detector extrinsic to the first chip measures the second light beam and variations of the second light beam and generates a self-mixing signal. The variations of the second light beam are caused by a back-scattered light resulting from back-scattering of the first light beam from the PM. The light detector is coupled to the dual-emitting light source. The direction of the second light beam is opposite to the direction of the first light beam, and the second light beam is directed to a sensitive area of the light detector.