公开(公告)号：US09618564B2

公开(公告)日：2017-04-11

申请号：US14164769

申请日：2014-01-27

Applicant: Apple Inc.

Inventor： Sean A. Mayo ,  Shankar S. Pennathur

IPC: B05D1/02 ,  B05D1/28 ,  G01R31/28 ,  H05K1/02 ,  H05K1/14

CPC classification number: G01R31/2818 ,  H05K1/0268 ,  H05K1/147 ,  H05K2201/09036 ,  H05K2201/09163

Abstract: Electrical components may be soldered to a printed circuit. The printed circuit may have an edge with an opening. Printed circuit contacts in the opening may be configured to form electrical connections with mating contacts on a flexible printed circuit or other external structure. A tester may test the electrical components by conveying signals through the contacts. Following testing, the external structure may be removed from the opening. The opening may then be filled with dielectric to isolate the printed circuit contacts. A printed circuit may have traces that extend under a ground on a surface of the printed circuit, may have edge test points formed from contacts that are cut in half when removing portions of the printed circuit, or may have through-mold vias that are formed through encapsulant over the electrical components.

公开(公告)号：US09485870B2

公开(公告)日：2016-11-01

申请号：US13935250

申请日：2013-07-03

Applicant: Apple Inc.

Inventor： Sean A. Mayo ,  James H. Foster ,  Trevor J. Ness ,  Shankar S. Pennathur

IPC: H01B13/00 ,  H05K3/28 ,  H05K1/02

CPC classification number: H05K3/284 ,  H05K1/0209 ,  H05K3/288 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2203/107 ,  H05K2203/1316 ,  H05K2203/1476

Abstract: The described embodiments relate generally to electronic devices and more particularly to methods for selectively encapsulating circuit boards and other electronic components contained within electronic devices. A first encapsulation layer can be limited to specific regions of a circuit board using a variety of processes including molding, laser ablation, etching, milling, and the like. Secondary assembly steps can then take place in the regions where the encapsulation layer is removed. In some embodiments, secondary encapsulants having various thermal, electrical, and optical characteristics can fill openings left in the first encapsulation layer to aid in the operation of underlying components.

Abstract translation: 所描述的实施例一般涉及电子设备，更具体地涉及用于选择性地封装电子设备中包含的电路板和其它电子元件的方法。 第一封装层可以使用包括模制，激光烧蚀，蚀刻，研磨等在内的各种工艺限于电路板的特定区域。 然后可以在去除封装层的区域中进行二次组装步骤。 在一些实施例中，具有各种热，电和光特性的次级密封剂可以填充留在第一封装层中的开口以帮助底层部件的操作。

公开(公告)号：US20150212114A1

公开(公告)日：2015-07-30

申请号：US14164769

申请日：2014-01-27

Applicant: Apple Inc.

Inventor： Sean A. Mayo ,  Shankar S. Penathur

IPC: G01R1/18 ,  G01R1/067 ,  G01R31/28

CPC classification number: G01R31/2818 ,  H05K1/0268 ,  H05K1/147 ,  H05K2201/09036 ,  H05K2201/09163

Abstract: Electrical components may be soldered to a printed circuit. The printed circuit may have an edge with an opening. Printed circuit contacts in the opening may be configured to form electrical connections with mating contacts on a flexible printed circuit or other external structure. A tester may test the electrical components by conveying signals through the contacts. Following testing, the external structure may be removed from the opening. The opening may then be filled with dielectric to isolate the printed circuit contacts. A printed circuit may have traces that extend under a ground on a surface of the printed circuit, may have edge test points formed from contacts that are cut in half when removing portions of the printed circuit, or may have through-mold vias that are formed through encapsulant over the electrical components.

Abstract translation: 电气部件可以焊接到印刷电路。 印刷电路可以具有带开口的边缘。 开口中的印刷电路触点可以被配置为与柔性印刷电路或其它外部结构上的配合触点形成电连接。 测试人员可以通过传送信号通过触点来测试电气元件。 在测试之后，外部结构可以从开口移除。 然后可以用绝缘体填充开口以隔离印刷电路触点。 印刷电路可以具有在印刷电路表面上在地下延伸的迹线，可以具有由去除印刷电路的部分时切成两半的接触形成的边缘测试点，或者可以具有形成的通孔模具 通过电气元件上的密封剂。