公开(公告)号：US12238882B2

公开(公告)日：2025-02-25

申请号：US18438822

申请日：2024-02-12

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23C5/00 ,  B23C5/10 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/12 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H04M1/11 ,  H05K5/02 ,  H05K5/03 ,  H05K13/00 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20180091892A1

公开(公告)日：2018-03-29

申请号：US15499775

申请日：2017-04-27

Applicant: Apple Inc.

Inventor： Martin D. Taylor ,  Hongdan Tao ,  Claudio Notarangelo ,  Suzanne C. Brown ,  Benjamin J. Pope ,  Scott P. Porter ,  Tang Y. Tan ,  Christopher Wilk

IPC: H04R1/28 ,  H04R3/00 ,  H04R29/00

CPC classification number: H04R1/2826 ,  H04R1/2811 ,  H04R3/00 ,  H04R29/001 ,  H04R2499/11

Abstract: A portable electronic device including an enclosure having an enclosure wall that forms an interior chamber. A speaker module is positioned within the interior chamber and includes a speaker and a module wall forming a back volume chamber of the speaker. The back volume chamber includes an acoustic vent port formed through the module wall to acoustically couple the back volume chamber to the interior chamber. The device further including an electromechanical valve for regulating the acoustic coupling of the back volume chamber to the interior chamber. The electromechanical valve is operable to transition between an open configuration in which the acoustic vent port is open to the interior chamber and a closed configuration in which the acoustic vent port is closed off from the interior chamber.

公开(公告)号：US09854694B2

公开(公告)日：2017-12-26

申请号：US14821620

申请日：2015-08-07

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  C25D11/34 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11 ,  C25D11/24

CPC classification number: H05K5/04 ,  B23C5/00 ,  B23C5/1081 ,  B23C2220/04 ,  B23C2220/16 ,  B23C2220/20 ,  B23C2220/28 ,  B23C2220/48 ,  B23C2226/31 ,  B23C2226/315 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D7/00 ,  C25D11/02 ,  C25D11/022 ,  C25D11/12 ,  C25D11/246 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/243 ,  H01Q1/42 ,  H04M1/0249 ,  H04M1/0254 ,  H04M1/11 ,  H05K5/02 ,  H05K5/0217 ,  H05K5/0243 ,  H05K5/0247 ,  H05K5/03 ,  H05K13/00 ,  Y10T29/47 ,  Y10T29/49002 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T407/1906 ,  Y10T409/300896 ,  Y10T409/303752 ,  Y10T409/30952

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US12137529B2

公开(公告)日：2024-11-05

申请号：US18183825

申请日：2023-03-14

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23C5/00 ,  B23C5/10 ,  B23P11/00 ,  B23P17/00 ,  B23P17/02 ,  C25D11/02 ,  C25D11/12 ,  C25D11/34 ,  G03F1/38 ,  H01Q1/24 ,  H01Q1/42 ,  H04M1/02 ,  H04M1/11 ,  H05K5/02 ,  H05K5/03 ,  H05K13/00 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US11036327B2

公开(公告)日：2021-06-15

申请号：US16708350

申请日：2019-12-09

Applicant: Apple Inc.

Inventor： Xiao Ying Zhao ,  Ian A. Spraggs ,  David A. Pakula ,  Tang Y. Tan

IPC: G06F3/041 ,  G06F3/044

Abstract: An electronic device can include a housing and an interface component. The interface component can at least partially define an interface surface, and the interface component and the housing can define an internal volume. A force sensor assembly can be disposed in the internal volume to detect an amount of force applied to the interface surface. The force sensor assembly can include a pressure decay sensor and a gap distance sensor disposed opposite a surface of the interface component.

公开(公告)号：US10667418B2

公开(公告)日：2020-05-26

申请号：US15958915

申请日：2018-04-20

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan ,  Michael P. Coleman ,  Thomas Johannessen ,  Richard W. Heley

IPC: G06F1/16 ,  H05K5/04 ,  B23P11/00 ,  B23P17/00 ,  G03F1/38 ,  H01Q1/24 ,  H04M1/02 ,  C25D11/34 ,  H05K5/02 ,  H05K13/00 ,  C25D11/02 ,  C25D7/00 ,  C25D11/12 ,  H05K5/03 ,  H01Q1/42 ,  B23C5/10 ,  B23C5/00 ,  B23P17/02 ,  H04M1/11 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US10469940B2

公开(公告)日：2019-11-05

申请号：US15499775

申请日：2017-04-27

Applicant: Apple Inc.

Inventor： Martin D. Taylor ,  Hongdan Tao ,  Claudio Notarangelo ,  Suzanne C. Brown ,  Benjamin J. Pope ,  Scott P. Porter ,  Tang Y. Tan ,  Christopher Wilk

IPC: H04R29/00 ,  H04R1/28 ,  H04R3/00

Abstract: A portable electronic device including an enclosure having an enclosure wall that forms an interior chamber. A speaker module is positioned within the interior chamber and includes a speaker and a module wall forming a back volume chamber of the speaker. The back volume chamber includes an acoustic vent port formed through the module wall to acoustically couple the back volume chamber to the interior chamber. The device further including an electromechanical valve for regulating the acoustic coupling of the back volume chamber to the interior chamber. The electromechanical valve is operable to transition between an open configuration in which the acoustic vent port is open to the interior chamber and a closed configuration in which the acoustic vent port is closed off from the interior chamber.

公开(公告)号：US10285295B2

公开(公告)日：2019-05-07

申请号：US16042992

申请日：2018-07-23

Applicant: Apple Inc.

Inventor： Bryan P. Kiple ,  Charles B. Woodhull ,  David A. Pakula ,  Tang Y. Tan

IPC: H05K5/04 ,  B23P17/00 ,  B23P11/00 ,  G03F1/38 ,  H04M1/02 ,  H01Q1/24 ,  H05K5/02 ,  B23C5/10 ,  H04M1/11 ,  B23C5/00 ,  B23P17/02 ,  C25D11/34 ,  C25D11/12 ,  C25D11/02 ,  H01Q1/42 ,  H05K5/03 ,  C25D7/00 ,  H05K13/00 ,  C25D11/24

Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.

公开(公告)号：US20160261023A1

公开(公告)日：2016-09-08

申请号：US14640902

申请日：2015-03-06

Applicant: Apple Inc.

Inventor： Carlo Di Nallo ,  Erik G. de Jong ,  Jayesh Nath ,  Mattia Pascolini ,  Tang Y. Tan ,  Yiren Wang ,  Zheyu Wang

IPC: H01Q1/24

CPC classification number: H01Q1/243 ,  H01Q5/321 ,  H01Q5/328 ,  H01Q5/335 ,  H01Q9/42

Abstract: An electronic device may have components mounted in a housing. The device may include wireless transceiver circuitry and antenna structures. A display may be mounted in the housing. The display may have a cover layer having an inner surface with a recess. The recess may run along a peripheral edge of the cover layer. An antenna structure such as an inverted-F antenna resonating element may be formed from a metal trace on a dielectric antenna carrier. The resonating element may be mounted in the recess without adhesive. Conductive vias may pass through the dielectric carrier. Metal members with dimples may be soldered to a flexible printed circuit and may be used to ground metal traces on the carrier and the flexible printed circuit to the housing when the carrier is attached to the housing with fasteners.

Abstract translation: 电子设备可以具有安装在壳体中的部件。 该设备可以包括无线收发器电路和天线结构。 显示器可以安装在外壳中。 显示器可以具有带有凹部的内表面的覆盖层。 凹部可以沿着覆盖层的周边边缘延伸。 诸如倒F天线谐振元件的天线结构可以由电介质天线载体上的金属迹线形成。 谐振元件可以安装在凹槽中而不粘合。 导电孔可以通过电介质载体。 具有凹坑的金属构件可以焊接到柔性印刷电路，并且当载体用紧固件附接到壳体时，可以将载体上的金属迹线和柔性印刷电路接地到壳体。