公开(公告)号：US20210381101A1

公开(公告)日：2021-12-09

申请号：US16892173

申请日：2020-06-03

Applicant: Applied Materials, Inc.

Inventor： Nagabhushana NANJUNDAPPA ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY ,  Bhaskar PRASAD

IPC: C23C14/54 ,  H01L21/683 ,  C23C14/34

Abstract: Embodiments disclosed herein generally relate to a system and, more specifically, a substrate processing system. The substrate processing system includes one or more cooling systems. The cooling systems are configured to lower and/or control the temperature of a body of the substrate processing system. The cooling systems include features to cool the body disposed in the substrate processing system using gas and/or liquid cooling systems. The cooling systems disclosed herein can be used when the body is disposed at any height.

公开(公告)号：US20210358797A1

公开(公告)日：2021-11-18

申请号：US16875750

申请日：2020-05-15

Applicant: Applied Materials, Inc.

Inventor： Sreenath SOVENAHALLI ,  Kirankumar Neelasandra SAVANDAIAH ,  Bhaskar PRASAD ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY

IPC: H01L21/687

Abstract: A floating pin for positioning a substrate relative to a substrate support includes a shaft configured to move through a guide hole in a substrate support, and a pin head including a top surface and a flat shoulder surface disposed between the top surface and the shaft. The flat shoulder surface is configured to be seated on a recessed surface of the substrate support and seal the guide hole of the substrate support.

公开(公告)号：US20240153800A1

公开(公告)日：2024-05-09

申请号：US18141920

申请日：2023-05-01

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

IPC: H01L21/677

CPC classification number: H01L21/67706 ,  H01L21/67709 ,  H01L21/6773

Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

公开(公告)号：US20240150888A1

公开(公告)日：2024-05-09

申请号：US18141923

申请日：2023-05-01

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Lakshmikanth Krishnamurthy SHIRAHATTI

IPC: C23C14/56 ,  C23C14/35 ,  H01F7/20 ,  H01J37/32 ,  H01L21/677

CPC classification number: C23C14/568 ,  C23C14/35 ,  H01F7/206 ,  H01J37/32733 ,  H01L21/677 ,  H01L21/67748 ,  H01L21/68742

Abstract: A substrate process station includes a housing including a transport region and process region. The process station further includes a magnetic levitation assembly disposed in the transport region configured to levitate and propel a substrate carrier. The magnetic levitation assembly includes a first track segment including first rails disposed in the transport region and below the process region, wherein the first rails each include a first plurality of magnets. The process station further includes a pedestal assembly comprising a pedestal disposed within the housing. The pedestal is moveable between a pedestal transfer position and a process position, wherein the pedestal is disposed between the first rails in the pedestal transfer position to receive a substrate from the substrate carrier, and wherein the pedestal is moveable between the first rails to position the received substrate in the process region in the process position.

公开(公告)号：US20230212735A1

公开(公告)日：2023-07-06

申请号：US17928709

申请日：2021-04-14

Applicant: Applied Materials, Inc.

Inventor： Nagabhushana NANJUNDAPPA ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Thomas BREZOCZKY ,  Bhaskar PRASAD

IPC: C23C14/54 ,  H01J37/32 ,  C23C14/34 ,  C23C14/50 ,  C23C14/56 ,  C23C14/35

CPC classification number: C23C14/541 ,  H01J37/32724 ,  H01J37/3244 ,  H01J37/32816 ,  C23C14/345 ,  C23C14/50 ,  C23C14/568 ,  C23C14/35 ,  H01J2237/002 ,  H01J2237/20235 ,  H01J2237/334 ,  H01J2237/2005 ,  H01J2237/20278 ,  H01J2237/2007 ,  H01J37/32899 ,  H01J37/32733

Abstract: Embodiments disclosed herein generally relate to a system and, more specifically, a substrate processing system. The substrate processing system includes one or more cooling systems. The cooling systems are configured to lower and/or control the temperature of a body of the substrate processing system. The cooling systems include features to cool the body disposed in the substrate processing system using gas and/or liquid cooling systems. The cooling systems disclosed herein can be used when the body is disposed at any height.

公开(公告)号：US20220406640A1

公开(公告)日：2022-12-22

申请号：US17354441

申请日：2021-06-22

Applicant: Applied Materials, Inc.

Inventor： Thomas BREZOCZKY ,  Kirankumar Neelasandra SAVANDAIAH ,  Bhaskar PRASAD ,  Nitin Bharadwaj SATYAVOLU

IPC: H01L21/68 ,  H01L21/683 ,  H01L21/677

Abstract: A method and apparatus for aligning components within a processing module are described herein. The components include a substrate transfer device, a plurality of support chuck assemblies, and adjustable bushings disposed in the processing module. The substrate transfer device includes support arms with heads configured to passively correct the location of a substrate therein. The orientation of each of the support arms of the substrate transfer device is adjusted to align with each of the support chuck assemblies. The location of a process station is then adjusted to align with one of the support chuck assemblies by calibrating the adjustable bushings which correspond to each process station.

公开(公告)号：US20220336258A1

公开(公告)日：2022-10-20

申请号：US17233213

申请日：2021-04-16

Applicant: Applied Materials, Inc.

Inventor： Anubhav SRIVASTAVA ,  Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Nitin Bharadwaj SATYAVOLU

IPC: H01L21/687

Abstract: Embodiments of the present disclosure generally relate to lift pins and to apparatus for controlling lift pin movement. In an embodiment, an apparatus for positioning a substrate in a chamber is provided. The apparatus includes a chamber component, a lift pin having a top surface for supporting the substrate and a lift pin shaft and a stopper. The apparatus further includes a compressible element positioned between the chamber component and the stopper, the compressible element further positioned around the lift pin shaft, the lift pin being moveable relative to a substrate transfer plane by movement of a substrate support in contact with the compressible element.

公开(公告)号：US20220242706A1

公开(公告)日：2022-08-04

申请号：US17165427

申请日：2021-02-02

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Thomas BREZOCZKY ,  Srinivasa Rao YEDLA

IPC: B66F3/36 ,  B66F3/24 ,  B66F13/00

Abstract: A method and apparatus for lifting a process station from a processing module is described herein. The apparatus includes a lift assembly disposed on the processing module, a lift cage, and one or more guide pins. The lift assembly is disposed to be capable of reaching each of the process stations disposed within the processing module. The lift assembly is used for replacement and maintenance of the process stations and further enables the automated removal and placement of the process stations within the processing module. Maintenance methods enabled by the lift assembly are additionally disclosed herein.

公开(公告)号：US20220216079A1

公开(公告)日：2022-07-07

申请号：US17143712

申请日：2021-01-07

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Thomas BREZOCZKY ,  Kirankumar Neelasandra SAVANDAIAH ,  Anubhav SRIVASTAVA

IPC: H01L21/67 ,  H01L21/683

Abstract: Embodiments described herein relate to methods and apparatus for detecting and/or monitoring, e.g., abnormalities in wafer transfer and handling. In an embodiment, a method for wafer dechucking verification is provided. The method includes initiating a wafer transfer operation to transfer a wafer between components of a semiconductor processing system, the semiconductor processing system comprising a motor coupled to a lift pin, the motor configured to adjust a height of the lift pin above a pedestal, the lift pin for raising or lowering the wafer. The method further includes measuring one or more first parameters during the wafer transfer operation, comparing the one or more first parameters to one or more first pre-determined parameter ranges, and changing a force applied to the lift pin based on the one or more first parameters. Apparatus for wafer dechucking verification and non-transitory computer-readable mediums storing instructions for wafer dechucking verification are also provided

公开(公告)号：US20220093439A1

公开(公告)日：2022-03-24

申请号：US17024802

申请日：2020-09-18

Applicant: Applied Materials, Inc.

Inventor： Bhaskar PRASAD ,  Kirankumar Neelasandra SAVANDAIAH ,  Srinivasa Rao YEDLA ,  Nitin Bharadwaj SATYAVOLU ,  Hari Prasath RAJENDRAN ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Thomas BREZOCZKY

IPC: H01L21/683 ,  H01L21/67

Abstract: In one example, an electrostatic chuck comprises a chuck body having a top surface configured to support a substrate and a bottom surface opposite the top surface. The chuck body comprises one or more chucking electrodes, and one or more heating elements. The chuck body further comprises first terminals disposed on the bottom surface of the chuck body and coupled with the one or more heating elements, second terminals disposed on the bottom surface of the chuck body and coupled with the one or more chucking electrodes, and third terminals disposed on the bottom first surface of the chuck body and coupled with the one or more chucking electrodes.