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    Reducing substrate surface scratching using machine learning
    11.
    发明授权
    Reducing substrate surface scratching using machine learning 有权

    公开(公告)号：US11586160B2

    公开(公告)日：2023-02-21

    申请号：US17360652

    申请日：2021-06-28

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Kartik B Shah ,  Satish Radhakrishnan ,  Karthik Ramanathan ,  Karthikeyan Balaraman ,  Adolph Miller Allen ,  Xinyuan Chong ,  Mitrabhanu Sahu ,  Wenjing Xu ,  Michael Sterling Jackson ,  Weize Hu ,  Feng Chen

    IPC: H05B3/68 ,  G05B13/02 ,  G05B13/04

    Abstract: Methods and systems for reducing substrate particle scratching using machine learning are provided. A machine learning model is trained to predict process recipe settings for a substrate temperature control process to be performed for a current substrate at a manufacturing system. First training data and second training data are generated for the machine learning model. The first training data includes historical data associated with prior process recipe settings for a prior substrate temperature control process performed for a prior substrate at a prior process chamber. The second training data is associated with a historical scratch profile of one or more surfaces of the prior substrate after performance of the prior substrate temperature control process according to the prior process recipe settings. The first training data and the second training data are provided to train the machine learning model to predict which process recipe settings for the substrate temperature control process to be performed for the current substrate correspond to a target scratch profile for one or more surfaces of the current substrate.

    THERMALLY CONTROLLED LID STACK COMPONENTS
    12.
    发明申请
    THERMALLY CONTROLLED LID STACK COMPONENTS 有权

    公开(公告)号：US20210320018A1

    公开(公告)日：2021-10-14

    申请号：US16847955

    申请日：2020-04-14

    Applicant: Applied Materials, Inc.

    Inventor： Siva Chandrasekar ,  Satish Radhakrishnan ,  Rajath Kumar Lakkenahalli Hiriyannaiah ,  Viren Kalsekar ,  Vinay Prabhakar

    IPC: H01L21/67

    Abstract: Exemplary substrate processing systems may include chamber body defining a transfer region. The systems may include a lid plate seated on the chamber body. The lid plate may define a first plurality of apertures through the lid plate and a second plurality of apertures through the lid plate. The systems may include a plurality of lid stacks equal to a number of apertures of the first plurality of apertures defined through the lid plate. Each lid stack of the plurality of lid stacks may include a choke plate seated on the lid plate along a first surface of the choke plate. The choke plate may define a first aperture axially aligned with an associated aperture of the first plurality of apertures. The choke plate may define a second aperture axially aligned with an associated aperture of the second plurality of apertures.

    METHODS AND SYSTEMS FOR FORMING FILMS ON SUBSTRATES
    13.
    发明申请
    METHODS AND SYSTEMS FOR FORMING FILMS ON SUBSTRATES 审中-公开

    公开(公告)号：US20200378000A1

    公开(公告)日：2020-12-03

    申请号：US16854893

    申请日：2020-04-21

    Applicant: Applied Materials, Inc.

    Inventor： Alexander N. Lerner ,  Roey Shaviv ,  Prashanth Kothnur ,  Satish Radhakrishnan ,  Xiaozhou Che

    IPC: C23C16/448 ,  C23C16/52 ,  C23C16/455 ,  C23C16/458

    Abstract: One or more embodiments described herein generally relate to methods and systems for forming films on substrates in semiconductor processes. In embodiments described herein, a process system includes different materials each contained in separate ampoules. Each material is flowed into a separate portion of a showerhead contained within a process chamber via a heated gas line. From the showerhead, each material is flowed on to a substrate that sits on the surface of a rotating pedestal. Controlling the mass flow rate out of the showerhead and the rotation rate of the pedestal helps result in films with desirable material domain sizes to be deposited on the substrate.

    Showerhead for providing multiple materials to a process chamber
    15.
    发明授权
    Showerhead for providing multiple materials to a process chamber 有权

    公开(公告)号：US11970775B2

    公开(公告)日：2024-04-30

    申请号：US16533357

    申请日：2019-08-06

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Prashanth Kothnur ,  Satish Radhakrishnan ,  Alexander Lerner ,  Sergei Klimovich ,  Roey Shaviv

    IPC: C23C16/455 ,  B05B1/18 ,  B05B1/20

    CPC classification number: C23C16/45548 ,  B05B1/185 ,  B05B1/20

    Abstract: Embodiments of a showerhead are described herein. In some embodiments, a showerhead assembly includes: a first gas delivery portion having a first body, a first inlet, and a plurality of first tubes extending from the first body and defining a first plenum, wherein each tube of the plurality of first tubes includes a plurality of first holes; and a second gas delivery portion having a second body, a second inlet, and a plurality of second tubes extending from the second body and defining a second plenum fluidly independent from the first plenum, wherein each tube of the plurality of second tubes includes a plurality of second holes, and wherein the plurality of first tubes are disposed in an alternating pattern with the plurality of second tubes across a width of the showerhead assembly and a heat sink disposed between the plurality of first tubes and the plurality of second tubes.

    REDUCING SUBSTRATE SURFACE SCRATCHING USING MACHINE LEARNING
    19.
    发明申请
    REDUCING SUBSTRATE SURFACE SCRATCHING USING MACHINE LEARNING 有权

    公开(公告)号：US20220413452A1

    公开(公告)日：2022-12-29

    申请号：US17360652

    申请日：2021-06-28

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Kartik B. Shah ,  Satish Radhakrishnan ,  Karthik Ramanathan ,  Karthikeyan Balaraman ,  Adolph Miller Allen ,  Xinyuan Chong ,  Mitrabhanu Sahu ,  Wenjing Xu ,  Michael Sterling Jackson ,  Weize Hu ,  Feng Chen

    IPC: G05B13/02 ,  G05B13/04

    Abstract: Methods and systems for reducing substrate particle scratching using machine learning are provided. A machine learning model is trained to predict process recipe settings for a substrate temperature control process to be performed for a current substrate at a manufacturing system. First training data and second training data are generated for the machine learning model. The first training data includes historical data associated with prior process recipe settings for a prior substrate temperature control process performed for a prior substrate at a prior process chamber. The second training data is associated with a historical scratch profile of one or more surfaces of the prior substrate after performance of the prior substrate temperature control process according to the prior process recipe settings. The first training data and the second training data are provided to train the machine learning model to predict which process recipe settings for the substrate temperature control process to be performed for the current substrate correspond to a target scratch profile for one or more surfaces of the current substrate.

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