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公开(公告)号：US20130219954A1
公开(公告)日：2013-08-29
申请号：US13882711
申请日：2011-10-31
CPC分类号： F28D15/02 , B23P15/26 , F28D15/0266 , F28D15/046 , F28F13/187 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, cooling performance adversely decreases if the evaporator includes projections activating convection heat transfer and the bubble nuclei are formed on the inner wall surface. A cooling device according to an exemplary embodiment includes an evaporator storing a refrigerant and a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat. The evaporator includes a base thermally contacting with an object to be cooled, and a container. The base includes a plurality of projections on a boiling surface of a surface at an inner wall side contacting with the refrigerant. The cross-sectional area cut along a plane parallel to the boiling surface at the top of the projection is smaller than that at the boiling surface. The evaporator includes a bubble nucleus forming surface only on a part of a refrigerant contacting surface.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，如果蒸发器包括启动对流热传递的突起并且气泡核形成在内壁表面上，则冷却性能不利地降低。 根据示例性实施例的冷却装置包括存储制冷剂的蒸发器和冷凝和液化在蒸发器中蒸发的蒸气状制冷剂并辐射热量的冷凝器。 蒸发器包括与要冷却的物体热接触的基座和容器。 基部包括在与制冷剂接触的内壁侧的表面的沸腾面上的多个突起。 沿着平行于突起顶部的沸腾表面的平面切割的横截面面积小于沸点表面处的截面积。 蒸发器仅在制冷剂接触表面的一部分上包括气泡核形成表面。
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公开(公告)号：US20130025826A1
公开(公告)日：2013-01-31
申请号：US13638474
申请日：2011-03-15
IPC分类号： F28D15/02
CPC分类号： F28D15/0266 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.
摘要翻译： 本发明的相变冷却器包括：多个热接收单元，其使得制冷剂通过从发热体接收的热量将液相变成气体; 一个散热单元，其通过向周围区域辐射热量使制冷剂从气体向液体变化; 多个蒸汽管，分别将来自每个热接收单元的蒸汽状态的制冷剂输送到散热单元; 液体管，其将从液体状态的制冷剂从散热单元分别循环到各个受热单元; 以及将每个所述热接收单元彼此连接的旁通管。
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公开(公告)号：US09605907B2
公开(公告)日：2017-03-28
申请号：US13638474
申请日：2011-03-15
IPC分类号： F28D15/02 , H01L23/427 , H01L23/467
CPC分类号： F28D15/0266 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.
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14.发明申请SEMICONDUCTOR DEVICE HAVING POWER SUPPLY-SIDE AND GROUND-SIDE METAL REINFORCING MEMBERS INSULATED FROM EACH OTHER 失效具有电源侧和地面金属增强件的半导体器件从每个其他绝缘体公开(公告)号：US20120126432A1
公开(公告)日：2012-05-24
申请号：US13388285
申请日：2010-08-20
申请人： Kenichi Inaba , Minoru Yoshikawa
发明人： Kenichi Inaba , Minoru Yoshikawa
IPC分类号： H01L23/48
CPC分类号： H01L23/50 , H01L23/49833 , H01L2224/16225
摘要： Provided is a semiconductor device which includes a wiring substrate; a semiconductor chip fixedly attached to a first surface of the wiring substrate; a power supply pad that is provided on a second surface opposite to the first surface of the wiring substrate, and supplies electric power to the wiring substrate; a ground pad that is provided on the second surface of the wiring substrate and grounds the wiring substrate; a power supply-side reinforcing member that is connected to the power supply pad and made of metal; a ground-side reinforcing member that is connected to the ground pad and made of metal; and an insulating part that insulates the power supply-side reinforcing member and the ground-side reinforcing member from each other.
摘要翻译： 提供一种包括布线基板的半导体器件; 固定在所述布线基板的第一面上的半导体芯片; 电源焊盘，其设置在与所述布线基板的所述第一面相反的第二表面上，并且向所述布线基板供电; 接地焊盘，其设置在所述布线基板的所述第二表面上并使所述布线基板接地; 电源侧加强构件，其连接到所述电源垫并由金属制成; 接地侧加强构件，其与接地垫连接并由金属制成; 以及将供电侧加强构件和接地侧加强构件彼此绝缘的绝缘部。
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公开(公告)号：US20130333414A1
公开(公告)日：2013-12-19
申请号：US13818091
申请日：2011-07-05
申请人： Kenichi Inaba , Minoru Yoshikawa
发明人： Kenichi Inaba , Minoru Yoshikawa
IPC分类号： H05K7/20
CPC分类号： H05K7/20 , F28D15/0266 , H05K7/20681
摘要： A system for cooling an electronic device of the present invention cools air warmed by exhaust heat of an electronic device, and includes an evaporator, a condenser, a gas flow channel, and a liquid flow channel. The evaporator is provided in a direction in which air is blown out by the electronic device, and causes a liquid coolant to undergo a phase transition to a gaseous coolant by absorbing heat of the air blown out from the electronic device. The condenser causes the gaseous coolant to undergo a phase transition to a liquid coolant by releasing heat of the gaseous coolant. The gas flow channel flows the gaseous coolant undergone the phase transition by the evaporator, into the condenser. The liquid flow channel flows the liquid coolant undergone the phase transition by the condenser, into the evaporator. The condenser is arranged above the evaporator.
摘要翻译： 本发明的电子设备的冷却系统冷却由电子设备的排热加热的空气，并且包括蒸发器，冷凝器，气体流路和液体流路。 蒸发器设置在空气被电子设备吹出的方向上，并且通过吸收从电子设备吹出的空气的热量使液体冷却剂经历与气态冷却剂的相变。 冷凝器使得气态冷却剂通过释放气态冷却剂的热而经历到液体冷却剂的相变。 气流通道使经过蒸发器的相变的气态冷却剂流入冷凝器。 液体流动通道使经冷凝器相转变的液体冷却剂流入蒸发器。 冷凝器布置在蒸发器的上方。
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16.发明授权Semiconductor device having power supply-side and ground-side metal reinforcing members insulated from each other 失效具有彼此绝缘的电源侧和接地侧金属加强构件的半导体装置公开(公告)号：US08547705B2
公开(公告)日：2013-10-01
申请号：US13388285
申请日：2010-08-20
申请人： Kenichi Inaba , Minoru Yoshikawa
发明人： Kenichi Inaba , Minoru Yoshikawa
IPC分类号： H05K7/00
CPC分类号： H01L23/50 , H01L23/49833 , H01L2224/16225
摘要： Provided is a semiconductor device which includes a wiring substrate; a semiconductor chip fixedly attached to a first surface of the wiring substrate; a power supply pad that is provided on a second surface opposite to the first surface of the wiring substrate, and supplies electric power to the wiring substrate; a ground pad that is provided on the second surface of the wiring substrate and grounds the wiring substrate; a power supply-side reinforcing member that is connected to the power supply pad and made of metal; a ground-side reinforcing member that is connected to the ground pad and made of metal; and an insulating part that insulates the power supply-side reinforcing member and the ground-side reinforcing member from each other.
摘要翻译： 提供一种包括布线基板的半导体器件; 固定在所述布线基板的第一面上的半导体芯片; 电源焊盘，其设置在与所述布线基板的所述第一面相反的第二表面上，并且向所述布线基板供电; 接地焊盘，其设置在所述布线基板的所述第二表面上并使所述布线基板接地; 电源侧加强构件，其连接到所述电源垫并由金属制成; 接地侧加强构件，其与接地垫连接并由金属制成; 以及将供电侧加强构件和接地侧加强构件彼此绝缘的绝缘部。
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公开(公告)号：US09727101B2
公开(公告)日：2017-08-08
申请号：US13638343
申请日：2011-03-01
申请人： Minoru Yoshikawa , Kenichi Inaba
发明人： Minoru Yoshikawa , Kenichi Inaba
CPC分类号： G06F1/20 , F28D15/0266 , H05K7/20818
摘要： The cooling apparatus (10) for electronic-device exhaustion includes an evaporator unit (201), a fluid piping (306) and a vapor piping (305). A plurality of evaporator units (201) is disposed in a rack (100) in the height direction, and have a dimension in height of any of 2U, 3U, and 4U with 1U being 44.45 mm. The evaporator unit causes a coolant fluid thereinside to vaporize and produce a coolant vapor by heat of the exhaust air from an electronic device loaded in the rack (100), and cools the exhaust air. The fluid piping (306) is a supply route of the coolant fluid to the evaporator units (201), the vapor piping (305) is a discharging route of the coolant vapor from the evaporator units (201), and both are commonly connected to the plurality of evaporator units (201).
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18.发明申请公开(公告)号：US20130019627A1
公开(公告)日：2013-01-24
申请号：US13638343
申请日：2011-03-01
申请人： Minoru Yoshikawa , Kenichi Inaba
发明人： Minoru Yoshikawa , Kenichi Inaba
CPC分类号： G06F1/20 , F28D15/0266 , H05K7/20818
摘要： The cooling apparatus (10) for electronic-device exhaustion includes an evaporator unit (201), a fluid piping (306) and a vapor piping (305). A plurality of evaporator units (201) is disposed in a rack (100) in the height direction, and have a dimension in height of any of 2 U, 3 U, and 4 U with 1 U being 44.45 mm. The evaporator unit causes a coolant fluid thereinside to vaporize and produce a coolant vapor by heat of the exhaust air from an electronic device loaded in the rack (100), and cools the exhaust air. The fluid piping (306) is a supply route of the coolant fluid to the evaporator units (201), the vapor piping (305) is a discharging route of the coolant vapor from the evaporator units (201), and both are commonly connected to the plurality of evaporator units (201).
摘要翻译： 用于电子设备排气的冷却装置（10）包括蒸发器单元（201），流体管道（306）和蒸汽管道（305）。 多个蒸发器单元（201）在高度方向上设置在齿条（100）中，并且具有2U，3U和4U中任何一个的高度尺寸，1U为44.45mm。 蒸发器单元使其内部的冷却剂流体通过来自装载在机架（100）中的电子设备的排气的热量蒸发并产生冷却剂蒸气，并且冷却排出的空气。 流体管道（306）是冷却剂流体到蒸发器单元（201）的供应路线，蒸汽管道（305）是来自蒸发器单元（201）的冷却剂蒸汽的排出路径，并且两者通常连接到 多个蒸发器单元（201）。
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19.发明申请CONNECTING STRUCTURE OF COOLING DEVICE, COOLING DEVICE, AND METHOD FOR CONNECTING COOLING DEVICE 有权冷却装置，冷却装置的连接结构和连接冷却装置的方法公开(公告)号：US20150131229A1
公开(公告)日：2015-05-14
申请号：US14401282
申请日：2013-05-10
申请人： NEC Corporation
发明人： Arihiro Matsunaga , Minoru Yoshikawa , Hitoshi Sakamoto , Akira Shoujiguchi , Masaki Chiba , Kenichi Inaba
CPC分类号： H05K7/20336 , B23P15/26 , F28D15/0266 , F28D15/0275 , F28F2275/08 , H01L23/4006 , H01L23/427 , H01L2023/4062 , H01L2924/0002 , H05K7/20309 , H05K7/20318 , H05K7/2039 , Y10T29/4913 , Y10T29/53174 , H01L2924/00
摘要： It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.
摘要翻译： 由于与要冷却的加热元件的热阻增加，因此使用相变系统的冷却装置，寻求高的热输送性能，以获得足够的冷却性能是不可能的，因此，冷却装置的连接结构 本发明的示例性方面包括具有开口的连接板; 薄板的压板可弹性变形; 第一固定装置，用于将压板固定到连接板上，其中压板设置成覆盖构成冷却装置的热接收装置; 以及第二固定装置，用于将所述连接板固定到基板上，所述热接收装置抵靠安装在所述基板上并设置在所述开口中的加热元件。
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公开(公告)号：US20140083652A1
公开(公告)日：2014-03-27
申请号：US14118556
申请日：2012-05-21
申请人： NEC Corporation
IPC分类号： F28D15/02
CPC分类号： F28D15/025 , F28D15/0266 , F28D15/0275 , H01L23/10 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A sealed casing includes a container provided with a plurality of opening and houses at least one heat-generating body, and a plurality of top boards sealing the openings respectively, and is characterized in that at least one of the openings is disposed in a heat-generating area where the heat-generating body is disposed, and that a cooling unit is disposed on the top board sealing the opening in the heat-generating area.
摘要翻译： 密封壳体包括设置有多个开口并容纳至少一个发热体的容器和分别密封开口的多个顶板，其特征在于，至少一个开口设置在热交换器中， 并且在顶板上设置冷却单元，该冷却单元密封发热区域中的开口。
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