公开(公告)号：US5288542A

公开(公告)日：1994-02-22

申请号：US913101

申请日：1992-07-14

申请人： Michael J. Cibulsky ,  Konstantinos I. Papathomas ,  William J. Summa ,  David W. Wang ,  Patrick R. Zippetelli

发明人： Michael J. Cibulsky ,  Konstantinos I. Papathomas ,  William J. Summa ,  David W. Wang ,  Patrick R. Zippetelli

IPC分类号： H05K1/03 ,  H05K3/00 ,  B32B03/00

CPC分类号： H05K3/4691 ,  H05K1/0366 ,  H05K2201/0355 ,  H05K2203/308 ,  Y10S428/901 ,  Y10T428/24851 ,  Y10T428/2486 ,  Y10T428/24917 ,  Y10T428/31522 ,  Y10T428/31678 ,  Y10T428/31721

摘要： A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.

摘要翻译： 用于提供刚性柔性电路板的复合材料包括至少一个包含电介质基底和至少一个导电层的芯; 至少一个亚复合材料，其包括聚酰亚胺和刚性电介质基片; 释放层; 至少一个刚性粘合层和第二导电层。 复合材料用于刚性柔性电路板的制造。

公开(公告)号：US4873123A

公开(公告)日：1989-10-10

申请号：US102447

申请日：1987-09-29

申请人： Michael J. Canestaro ,  William J. Summa

发明人： Michael J. Canestaro ,  William J. Summa

IPC分类号： H05K1/02 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K3/3442 ,  H05K1/0271 ,  H05K3/4092 ,  H05K2201/0394 ,  H05K2201/10727 ,  H05K2201/10757 ,  Y02P70/613

摘要： A flexible electrical connection, and method for making such a connection, for mounting an electronic device, such as a semiconductor chip made primarily of silicon, on an organic substrate, such as a printed circuit board made of a glass material impregnated with epoxy resin, are disclosed. The flexible electrical connection comprises a circuit line attached to the surface of the organic substrate and having a floating terminus in a relatively low adhesive area of the organic substrate where it is desired to mount the electronic device on the organic substrate. The floating terminus includes a stress relief bend, and the flexible electrical connection relieves stresses, such as thermal stresses, which may otherwise damage the physical and/or electrical connection between the electronic device and the floating terminus of the flexible electrical connection when the electronic device is mounted on the surface of the organic substrate.

摘要翻译： 用于将诸如由硅制成的半导体芯片的电子装置安装在诸如由浸渍有环氧树脂的玻璃材料制成的印刷电路板的有机基板上的柔性电连接和用于制造这种连接的方法， 被披露。 柔性电连接包括连接到有机衬底的表面上的电路线，并且在有机衬底的相对低的粘合区域中具有浮动端，其中希望将电子器件安装在有机衬底上。 浮动终端包括应力消除弯曲，并且柔性电连接减轻诸如热应力的应力，否则当电子设备（例如，电子设备）可能会损坏电子设备与柔性电连接的浮动终端之间的物理和/或电连接 安装在有机基板的表面上。

公开(公告)号：US4745215A

公开(公告)日：1988-05-17

申请号：US33557

申请日：1987-04-03

申请人： Robert J. Cox ,  William J. Summa ,  David W. Wang

发明人： Robert J. Cox ,  William J. Summa ,  David W. Wang

IPC分类号： C08G73/06 ,  C07C261/02 ,  C08G73/08 ,  H05K1/03 ,  C07C71/00 ,  B32B27/00 ,  C08G73/00

CPC分类号： C07C261/02 ,  H05K1/034 ,  Y10T428/31547

摘要： 4,4'-(Hexafluoroisopropylidene) bisphonol dicyanate and related compounds have reduced dielectric constant, reduced moisture absorption, and increase Tg making such compounds especially suitable for various electronic applications, such as circuit packaging or in forming prepregs and circuit boards.

公开(公告)号：US4728751A

公开(公告)日：1988-03-01

申请号：US915485

申请日：1986-10-06

申请人： Michael J. Canestaro ,  William J. Summa

发明人： Michael J. Canestaro ,  William J. Summa

IPC分类号： H01L21/60 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K3/4092 ,  H05K1/0271 ,  H05K3/3442 ,  H05K2201/0394 ,  H05K2201/10727 ,  H05K2201/10757 ,  Y02P70/613

摘要： A flexible electrical connection, and method for making such a connection, for mounting an electronic device, such as a semiconductor chip made primarily of silicon, on an organic substrate, such as a printed circuit board made of a glass material impregnated with epoxy resin, are disclosed. The flexible electrical connection comprises a circuit line attached to the surface of the organic substrate and having a floating terminus in a relatively low adhesive area of the organic substrate where it is desired to mount the electronic device on the organic substrate. The floating terminus includes a stress relief bend, and the flexible electrical connection relieves stresses, such as thermal stresses, which may otherwise damage the physical and/or electrical connection between the electronic device and the floating terminus of the flexible electrical connection when the electronic device is mounted on the surface of the organic substrate.

摘要翻译： 用于将诸如由硅制成的半导体芯片的电子装置安装在诸如由浸渍有环氧树脂的玻璃材料制成的印刷电路板的有机基板上的柔性电连接和用于制造这种连接的方法， 被披露。 柔性电连接包括连接到有机衬底的表面上的电路线，并且在有机衬底的相对低的粘合区域中具有浮动端，其中希望将电子器件安装在有机衬底上。 浮动终端包括应力消除弯曲，并且柔性电连接减轻诸如热应力的应力，否则当电子设备（例如，电子设备）可能会损坏电子设备与柔性电连接的浮动终端之间的物理和/或电连接 安装在有机基板的表面上。