公开(公告)号：US11711948B2

公开(公告)日：2023-07-25

申请号：US17319409

申请日：2021-05-13

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shipei Li ,  Sheng Xu ,  Wei He ,  Ying Zhao ,  Huili Wu ,  Fang He ,  Renquan Gu ,  Lizhen Zhang ,  Yi Zhou ,  Wusheng Li ,  Qi Yao ,  Yang Yue

IPC: H01L27/32 ,  H10K59/123 ,  H10K59/122 ,  H10K59/124 ,  H10K71/00 ,  H10K59/12

CPC classification number: H10K59/123 ,  H10K59/122 ,  H10K59/124 ,  H10K71/00 ,  H10K59/1201

Abstract: The present disclosure relates to the field of display technology, and proposes a display panel, a preparation method thereof, and a display apparatus. The display panel includes an array substrate, a planarization layer group, and a plurality of sub-pixels. The array substrate includes a switch array formed by a plurality of switch units. The planarization layer group is provided on the array substrate, and nano-scale grooves are provided on the planarization layer group. The sub-pixels are provided on a side of the planarization layer group away from the array substrate. The sub-pixel includes a plurality of first electrodes, wherein the first electrode is connected to the switch unit of the array substrate, a nano-scale second gap is provided between two adjacent first electrodes, and an orthographic projection of the second gap on the array substrate is located within an orthographic projection of the groove on the array substrate.

公开(公告)号：US11605239B2

公开(公告)日：2023-03-14

申请号：US17041516

申请日：2020-04-08

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shipei Li ,  Ying Zhao ,  Renquan Gu ,  Wei He ,  Huili Wu ,  Dongsheng Yin ,  Sheng Xu ,  Lizhen Zhang ,  Xuefei Zhao ,  Fang He ,  Yupeng Gao

IPC: G06V40/13 ,  H01L27/146

Abstract: Disclosed are a fingerprint recognition sensor, a manufacturing method, and a display device. The fingerprint recognition sensor includes a base substrate, a thin film transistor, on a side of the base substrate; and a photosensitive element, on a side of the base substrate away from the thin film transistor, the thin film transistor, the base substrate, and the photosensitive element are sequentially stacked in a thickness direction perpendicular to the base substrate, the base substrate includes a conductive structure penetrating through the base substrate in the thickness direction perpendicular to the base substrate, and the photosensitive element is connected with the thin film transistor through the conductive structure.

公开(公告)号：US20220302229A1

公开(公告)日：2022-09-22

申请号：US17428630

申请日：2020-10-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yang Yue ,  Shi Shu ,  Qi Yao ,  Wei Huang ,  Haitao Huang ,  Shipei Li ,  Yong Yu ,  Xiang Li ,  Chuanxiang Xu ,  Wenqu Liu

IPC: H01L27/32

Abstract: A counter substrate is provided. The counter substrate includes a bank layer on a base substrate and defining a plurality of bank apertures; a quantum dots material layer on the base substrate, the quantum dots material layer including a plurality of quantum dots blocks respectively in at least some of the plurality of bank apertures; and a support layer on a side of the quantum dots material layer and the bank layer away from the base substrate. The support layer includes one or more support portions, orthographic projections of which on the base substrate adjacent to a periphery of an orthographic projection of a respective one of the plurality of bank apertures on the base substrate. An orthographic projection of the bank layer on the base substrate at least partially overlaps with an orthographic projection of the support layer on the base substrate.

公开(公告)号：US11309452B2

公开(公告)日：2022-04-19

申请号：US16601472

申请日：2019-10-14

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Wei He ,  Xiang Li ,  Huili Wu ,  Shipei Li ,  Fang He ,  Renquan Gu ,  Sheng Xu ,  Dongsheng Yin ,  Xuefei Zhao ,  Lizhen Zhang ,  Wusheng Li ,  Qi Yao

IPC: H01L33/06 ,  H01L27/15 ,  H01L33/50 ,  B82Y20/00

Abstract: A patterning method of a quantum dot layer, a quantum dot layer pattern, a quantum dot device, a manufacturing method of the quantum dot device, and a display apparatus are provided. The patterning method of the quantum dot layer includes: forming a quantum dot layer, in which the quantum dot layer includes quantum dots and a photoinitiator; irradiating a preset portion of the quantum dot layer by light having a preset wavelength to quench the quantum dots in the preset portion and form a patterned quantum dot layer.

公开(公告)号：US10956700B2

公开(公告)日：2021-03-23

申请号：US16519045

申请日：2019-07-23

Applicant: Beijing BOE Display Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Ying Zhao ,  Shipei Li ,  Qingping Yin ,  Tao Li ,  Huili Wu ,  Chunming Cui ,  Zihao Zhao ,  Jie Jin ,  Weimeng Zhang

IPC: G06K9/00 ,  H01L51/56 ,  G06K9/20 ,  G06F21/32

Abstract: The disclosure relates to a display device including: an organic light-emitting diode display panel, a fingerprint recognition layer located below the organic light-emitting diode display panel, and a light filtering layer located between the organic light-emitting diode display panel and the fingerprint recognition layer, where the light filtering layer is configured to filter out light rays with an incidence angle greater than a filter angle among light rays carrying fingerprint line information, and to transmit light rays with an incidence angle smaller than or equal to the filter angle, where the incidence angle is the angle between the light rays carrying fingerprint line information, and the direction perpendicular to the fingerprint recognition layer.

公开(公告)号：US20190252456A1

公开(公告)日：2019-08-15

申请号：US16332932

申请日：2018-07-17

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Dongsheng Li ,  Huili Wu ,  Qingrong Ren ,  Shipei Li ,  Xuefei Sun ,  Dongsheng Yin

IPC: H01L27/146 ,  H01L31/02 ,  H01L31/0224 ,  H01L31/0216

CPC classification number: H01L27/14678 ,  G06K9/0004 ,  G06K9/00087 ,  H01L27/144 ,  H01L27/14614 ,  H01L27/14623 ,  H01L27/14685 ,  H01L27/14689 ,  H01L29/78633 ,  H01L29/7869 ,  H01L31/02019 ,  H01L31/02164 ,  H01L31/022408 ,  H01L31/105

Abstract: The present disclosure generally relates to the field of detection technology. A sensor includes a base substrate; a voltage dividing photodiode on the base substrate; and a detecting photodiode on the base substrate. The voltage dividing photodiode may include a first electrode and a second electrode arranged in a stack. The detecting photodiode may include a third electrode and a fourth electrode arranged in a stack. The voltage dividing photodiode is configured to operate substantially permanently in a dark state. The detecting photodiode is configured to operate with a reverse bias applied by the first power terminal and the second power terminal, so as to detect a light intensity.

公开(公告)号：US12191430B2

公开(公告)日：2025-01-07

申请号：US18043203

申请日：2022-03-31

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shipei Li ,  Wusheng Li ,  Ying Zhao ,  Huili Wu ,  Sheng Xu ,  Wei He ,  Renquan Gu ,  Wenqing Xue ,  Jianjun Zhao ,  Qi Yao

IPC: H01L33/58 ,  G02F1/1335 ,  G02F1/13357 ,  H01L25/075 ,  H01L33/62

Abstract: A light-emitting substrate includes a transparent substrate; a first metal light-shielding layer, a wiring layer and light-emitting devices. The first metal light-shielding layer is disposed on the transparent substrate. The wiring layer is disposed on a side of the first metal light-shielding layer away from the transparent substrate, and the wiring layer includes circuit traces and pads. Orthographic projections of the circuit traces and the pads on the transparent substrate are all located within an orthographic projection of the first metal light-shielding layer on the transparent substrate. The light-emitting devices are disposed on a side of the wiring layer away from the transparent substrate, and electrically connected to some of the pads; and orthographic projections of the light-emitting devices on the transparent substrate are located within the orthographic projection of the first metal light-shielding layer on the transparent substrate.

公开(公告)号：US12114535B2

公开(公告)日：2024-10-08

申请号：US17428630

申请日：2020-10-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yang Yue ,  Shi Shu ,  Qi Yao ,  Wei Huang ,  Haitao Huang ,  Shipei Li ,  Yong Yu ,  Xiang Li ,  Chuanxiang Xu ,  Wenqu Liu

IPC: H10K59/122 ,  G02B5/20

CPC classification number: H10K59/122 ,  G02B5/201

Abstract: A counter substrate is provided. The counter substrate includes a bank layer on a base substrate and defining a plurality of bank apertures; a quantum dots material layer on the base substrate, the quantum dots material layer including a plurality of quantum dots blocks respectively in at least some of the plurality of bank apertures; and a support layer on a side of the quantum dots material layer and the bank layer away from the base substrate. The support layer includes one or more support portions, orthographic projections of which on the base substrate adjacent to a periphery of an orthographic projection of a respective one of the plurality of bank apertures on the base substrate. An orthographic projection of the bank layer on the base substrate at least partially overlaps with an orthographic projection of the support layer on the base substrate.

公开(公告)号：US20240047363A1

公开(公告)日：2024-02-08

申请号：US17762239

申请日：2021-05-24

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yang Yue ,  Shi Shu ,  Qi Yao ,  Yong Yu ,  Shipei Li ,  Xiang Li ,  Chuanxiang Xu ,  Wenqu Liu ,  Renquan Gu ,  Haitao Huang

IPC: H01L23/538 ,  H01L25/075 ,  H01L21/48

CPC classification number: H01L23/5383 ,  H01L25/0753 ,  H01L21/4857

Abstract: A manufacturing method of a displaying base plate, a displaying base plate and a displaying apparatus. The displaying base plate includes an active area and a peripheral area located at a periphery of the active area. The displaying base plate includes: a substrate; a wiring functional layer disposed on one side of the substrate, wherein the wiring functional layer includes a metal wiring and bonding terminals connected to the metal wiring), the bonding terminals include a first bonding terminal, a second bonding terminal and a third bonding terminal, the first bonding terminal and the second bonding terminal are located at the active area, and the third bonding terminal is located at the peripheral area; a first passivation layer disposed on one side of the wiring functional layer that is away from the substrate; and a light shielding layer disposed on one side of the first passivation layer that is away from the substrate.

公开(公告)号：US11793030B2

公开(公告)日：2023-10-17

申请号：US17221912

申请日：2021-04-05

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Sheng Xu ,  Shipei Li

IPC: H10K50/858 ,  H01L27/15 ,  H10K59/122 ,  H10K71/00 ,  H10K59/12

CPC classification number: H10K50/858 ,  H01L27/156 ,  H10K59/122 ,  H10K71/00 ,  H10K59/1201

Abstract: The present disclosure relates to the field of display technology, and proposes a display panel, a manufacturing method thereof, and a display device. The display panel includes an array substrate, a plurality of sub-pixels, and a plurality of divergent lenses. The array substrate includes a plurality of switch units. The plurality of sub-pixels is arranged on the array substrate, where each sub-pixel includes a plurality of light-emitting components, each light-emitting component includes a driving electrode, the driving electrode is connected to the plurality of switch units, and a gap exists between the driving electrodes of two adjacent light-emitting components. Each divergent lens is arranged on a side of a respective gap away from the array substrate. An orthographic projection of the gap on the array substrate is located in an orthographic projection of the divergent lens on the array substrate.