-
公开(公告)号：US11024680B2
公开(公告)日：2021-06-01
申请号：US16489789
申请日：2019-03-25
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ming Yang , Minghua Xuan , Ning Cong , Han Yue , Can Zhang , Can Wang , Xiaochuan Chen , Shengji Yang , Liang Chen
Abstract: The present disclosure relates to a display panel and a method of fabricating the same. An organic light emitting diode (OLED) display panel, comprising: a plurality of touch electrodes configured to sense a touch; touch electrode leads electrically connected to the plurality of touch electrodes; and OLED devices each comprising a cathode and a functional layer having a via-hole; wherein, the plurality of touch electrodes function as cathodes of the OLED devices, and are electrically connected to the touch electrode leads through the via-holes.
-
公开(公告)号：US20210134755A1
公开(公告)日：2021-05-06
申请号：US17057351
申请日：2020-02-11
Applicant: BOE Technology Group Co., Ltd.
Inventor： Liang Chen , Lei Wang , Minghua Xuan , Li Xiao , Dongni Liu , Detao Zhao , Hao Chen
Abstract: A chip transfer method including: disposing a target substrate closed cavity, the target substrate including a first alignment bonding structure and a second alignment bonding structure; applying a charge of a first polarity to the first alignment bonding structure of the target substrate; applying a charge of a second polarity to a first chip bonding structure of a chip injecting an insulating fluid into the closed cavity to suspend the chip in the insulating fluid.
-
公开(公告)号：US10985320B2
公开(公告)日：2021-04-20
申请号：US16484150
申请日：2018-12-26
Inventor： Ji Zhang , Weiwei Hu , Liang Chen , Jincheng Gao , Guanbao Hui
Abstract: The present disclosure provides an organic transistor and a manufacturing method thereof, an array substrate, and a display device. The method for manufacturing the organic transistor includes: applying a photoresist on a side of an organic insulating layer; patterning the photoresist to form a confinement well; adding a solution of an organic semiconductor material and an orthogonal solvent to the confinement well; volatilizing the orthogonal solvent by an annealing process to induce directional growth of single crystal of the organic semiconductor material in the confinement well, thereby obtaining an organic single crystal layer; and removing remaining photoresist and using the organic single crystal layer as an active layer. The embodiment of the present disclosure produces an organic single crystal in a flexible display device at a low temperature, and the organic single crystal can be used as an active layer, resulting in an organic transistor having high mobility and stability.
-
公开(公告)号：US12213354B2
公开(公告)日：2025-01-28
申请号：US17585026
申请日：2022-01-26
Applicant: BOE Technology Group Co., Ltd.
Inventor： Hao Chen , Jinxiang Xue , Liang Chen , Jiao Zhao , Li Xiao , Dongni Liu , Seungwoo Han , Haoliang Zheng , Minghua Xuan
IPC: H10K59/131 , G09F9/30 , H10K50/844 , H10K59/121 , H10K102/00
Abstract: A display panel is provided. The display panel includes a base substrate and a plurality of display units disposed on the base substrate. The display unit includes a signal line, a light-emitting device and a drive unit. The light-emitting device is disposed in a flexible display region of the base substrate, the drive unit is disposed in a pixel circuit region of the base substrate, and the signal line is connected with the light-emitting device and the drive unit.
-
公开(公告)号：US12198608B2
公开(公告)日：2025-01-14
申请号：US18005373
申请日：2021-11-24
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Li Xiao , Seungwoo Han , Dongni Liu , Haoliang Zheng , Minghua Xuan , Jiao Zhao , Liang Chen , Xiaorong Cui
IPC: G09G3/32
Abstract: A display substrate includes a plurality of data lines extending in a first direction, and a plurality of sub-pixels. A sub-pixel includes a pixel driving circuit and a light-emitting device. The pixel driving circuit includes a current control circuit, and a duration control circuit electrically connected to the current control circuit and the light-emitting device. The current control circuit is configured to generate a driving signal to drive the light-emitting device to emit light; and the duration control circuit is configured to generate a duration control signal to control a duration of a connection between the current control circuit and the light-emitting device. The current control circuit and the duration control circuit are electrically connected to a same data line.
-
Patent Agency Ranking
公开(公告)号：US12112707B2
公开(公告)日：2024-10-08
申请号：US18308385
申请日：2023-04-27
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Li Xiao , Haoliang Zheng , Hao Chen , Minghua Xuan , Dongni Liu , Seungwoo Han , Liang Chen , Jiao Zhao , Xue Dong
IPC: G09G3/3258 , G09G3/3291
CPC classification number: G09G3/3258 , G09G3/3291
Abstract: A pixel circuit includes a driving circuit, a first control circuit and a second control circuit. The driving circuit is configured to receive a data signal in response to a scan signal, and generate, in response to a first enable signal, a driving signal according to a first voltage and the data signal. The first control circuit is configured to: receive a first input signal in response to a first control signal, and transmit a third input signal in response to the first input signal; and receive a second input signal in response to a second control signal, and transmit a second enable signal in response to the second input signal. The second control circuit is configured to transmit the driving signal to an element to be driven in response to one of the third input signal and the second enable signal.
-
公开(公告)号：US20240276687A1
公开(公告)日：2024-08-15
申请号：US18023269
申请日：2022-06-17
Inventor： Xin Qing , Li Zeng , Qiang Tang , Linhuan Yan , Liang Chen , Jinglei Wang
IPC: H05K7/20
CPC classification number: H05K7/20963
Abstract: A display module and an electronic device are provided. The display module includes a display film layer, a heat dissipation film layer, a support plate and an elastic thermal conductive sheet. The display film layer and the heat dissipation film layer include a flat area and bending areas, and an angle exists between a tangent of a curved surface formed by the bending areas and a plane where the flat area is located. The display film layer is stacked on a first surface of the heat dissipation film layer. The support plate is connected to a position where the flat area of a second surface of the heat dissipation film layer is located, and the elastic thermal conductive sheet is connected to a position where the bending areas of the second surface of the heat dissipation film layer are located. The first surface and the second surface are opposite surfaces.
-
公开(公告)号：US11972989B2
公开(公告)日：2024-04-30
申请号：US17253960
申请日：2019-11-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Li Xiao , Dongni Liu , Minghua Xuan , Jiao Zhao , Haoliang Zheng , Zhenyu Zhang , Liang Chen , Hao Chen , Jing Liu , Qi Qi
CPC classification number: H01L22/32 , G01R31/54 , G01R31/58 , H01L22/22 , H01L24/02 , H01L27/124 , H10K59/131 , H01L25/167 , H01L2224/02321 , H01L2224/02375 , H01L2224/02379
Abstract: The present application provides a method for detecting a broken fanout wire of a display substrate, and a display substrate, and belongs to the field of display technology. In the method for detecting a broken fanout wire, the display substrate includes a base substrate having first and second surfaces opposite to each other, and a plurality of connection structures disposed at intervals on the first surface; and each connection structure includes first and second pads and a fanout wire electrically connecting the first pad to the second pad. The method for detecting a broken fanout wire includes: forming at least one detection unit, which includes: connecting at least two connection structures in series through a connecting part; and measuring a head and an end of the detection unit to obtain resistance of the detection unit, and determining whether there is a broken fanout wire in the detection unit.
-
公开(公告)号：US11901486B2
公开(公告)日：2024-02-13
申请号：US17256185
申请日：2020-04-03
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Liang Chen , Lei Wang , Minghua Xuan , Dongni Liu , Li Xiao , Detao Zhao , Hao Chen
CPC classification number: H01L33/20 , H01L24/81 , H01L33/005 , H01L24/14 , H01L2933/0066
Abstract: Provided is a method for transferring a chip, including: disposing a target substrate in a sealed chamber; applying charges of different polarities to a first alignment bonding structure of the target substrate and a first chip bonding structure of the chip, and injecting an insulation fluid flowing in a first direction into the sealed chamber, so that the first chip bonding structure is aligned with the first alignment bonding structure; applying charges of different polarities to a second alignment bonding structure of the target substrate and a second chip bonding structure of the chip, and changing the flowing direction of the insulation fluid to a second direction, so that the second chip bonding structure is aligned with the second alignment bonding structure; and applying a bonding force to the chip, so that the chip bonding structures is bonded to the alignment bonding structures.
-
公开(公告)号：US11847966B2
公开(公告)日：2023-12-19
申请号：US17760733
申请日：2021-03-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Haoliang Zheng , Minghua Xuan , Dongni Liu , Zhenyu Zhang , Li Xiao , Liang Chen , Hao Chen , Jiao Zhao , Lijun Yuan , Yi Ouyang , Qi Qi
IPC: G09G3/3233 , G11C19/28
CPC classification number: G09G3/3233 , G11C19/28 , G09G2300/043 , G09G2300/0426 , G09G2300/0819 , G09G2300/0842 , G09G2310/0286 , G09G2310/08
Abstract: A shift register (SR) includes a voltage control circuit (110) and a bias compensation circuit (120). The voltage control circuit (110) is configured to control a voltage at a first node (Output) to be a first voltage or a second voltage. The bias compensation circuit (120) is configured to: when the voltage at the first node (Output) is the first voltage, transmit a first signal received by a first signal terminal (VDD-A) to a first signal output terminal (EM1), and transmit a second signal received by a second signal terminal (VDD-B) to a second signal output terminal (EM2); and in response to the voltage at the first node (Output) being the second voltage, transmit a signal received by a first voltage terminal (LVGL1) to the first signal output terminal (EM1) and the second signal output terminal (EM2).
-
-
-
-
-
-
-
-
-
Search Results
85
records
(took 0.026 seconds)
