摘要:
Provided is a method of testing a phase change random access memory (PRAM). The method may include providing a plurality of PRAM cells each coupled between each of a plurality of first lines and each of a plurality of second lines intersecting the first lines, selecting at least one of the plurality of first lines while deselecting the remaining first lines and the plurality of second lines, pre-charging the selected at least one of the plurality of first lines to a predetermined or given voltage level, and sensing a change in the voltage level of the selected first line while supplying a monitoring voltage to the selected first line.
摘要:
A phase-change memory device is provided. The phase-change memory device includes a phase-change memory cell array including a first memory block having a plurality of phase-change memory cells each connected between each of a plurality of bit lines and a first word line, a second memory block having a plurality of phase-change memory cells each connected between each of the plurality of bit lines and a second word line, and first and second pull-down transistors pulling-down each voltage level of the first and the second word lines and sharing a node and a row driver including a first and a second pull-up transistor pulling-up each voltage level of the first and the second word lines.
摘要:
Provided is a method of testing a phase change random access memory (PRAM). The method may include providing a plurality of PRAM cells each coupled between each of a plurality of first lines and each of a plurality of second lines intersecting the first lines, selecting at least one of the plurality of first lines while deselecting the remaining first lines and the plurality of second lines, pre-charging the selected at least one of the plurality of first lines to a predetermined or given voltage level, and sensing a change in the voltage level of the selected first line while supplying a monitoring voltage to the selected first line.
摘要:
A phase-change memory device is provided. The phase-change memory device includes a phase-change memory cell array including a first memory block having a plurality of phase-change memory cells each connected between each of a plurality of bit lines and a first word line, a second memory block having a plurality of phase-change memory cells each connected between each of the plurality of bit lines and a second word line, and first and second pull-down transistors pulling-down each voltage level of the first and the second word lines and sharing a node and a row driver including a first and a second pull-up transistor pulling-up each voltage level of the first and the second word lines.
摘要:
In a nonvolatile memory device, a program operation is performed on a plurality of nonvolatile memory cells by programming data having a first logic state in a first group among a plurality of selected memory cells selected from the plurality of nonvolatile memory cells during a first program interval of the program operation, and thereafter, programming data having a second logic state different from the first logic state in a second group among the selected memory cells during a second program interval of the program operation after the first program interval.
摘要:
A phase change memory device includes a memory array including a plurality of phase change memory cells, each phase change memory cell including a phase change material and a diode, a plurality of column selection transistors connecting bit lines connected to the phase change memory cells to corresponding data lines, and a control node connecting the data lines to a sense amplifier unit. In a write operation mode, control voltages obtained by boosting a first voltage are respectively applied to the control node and gates of the column selection transistors, and a ground voltage is applied to a word line of a selected one of the phase change memory cells. In a standby mode, word lines and bit lines connected to the phase change memory cells of the memory array are maintained at the same voltage. According to the phase change memory device and a driving method thereof, a sufficient write voltage is supplied to a write driver, a column decoder and a row decoder in the write operation mode, and a voltage lower is applied to the write driver, the column decoder and the row decoder in the read operation mode and the standby mode, thereby reducing current consumption and enhancing operational reliability.
摘要:
A phase change memory device includes a memory array including a plurality of phase change memory cells, each phase change memory cell including a phase change material and a diode, a plurality of column selection transistors connecting bit lines connected to the phase change memory cells to corresponding data lines, and a control node connecting the data lines to a sense amplifier unit. In a write operation mode, control voltages obtained by boosting a first voltage are respectively applied to the control node and gates of the column selection transistors, and a ground voltage is applied to a word line of a selected one of the phase change memory cells. In a standby mode, word lines and bit lines connected to the phase change memory cells of the memory array are maintained at the same voltage. According to the phase change memory device and a driving method thereof, a sufficient write voltage is supplied to a write driver, a column decoder and a row decoder in the write operation mode, and a voltage lower is applied to the write driver, the column decoder and the row decoder in the read operation mode and the standby mode, thereby reducing current consumption and enhancing operational reliability.
摘要:
A phase change memory device of one aspect includes a memory array including a plurality of phase change memory cells, a write boosting circuit, and a write driver. The write boosting circuit boosts a first voltage and outputs a first control voltage in response to a control signal in a first operation mode, and boosts the first voltage and outputs a second control voltage in response to the control signal in a second operation mode and a third operation mode. The write driver is driven by the first control voltage in the first operation mode and writes data to a selected memory cell of the memory array.
摘要:
An integrated circuit that is capable of being burn-in tested with an AC stress and a testing method using the same are provided. The integrated circuit includes an address transforming means and a data generating means. The address transforming means transforms the addresses of the memory device selected and generates an address signal responsive to a clock signal. The data generating means generates a data signal that alternates between a first state and a second state responsive to the clock signal and provides the data signal to the selected memory device. The integrated circuit includes a switch for coupling the test supply line to the normal supply line during testing and intercepting the test supply line from the normal supply line during normal operations responsive to a control signal. The integrated circuit of the present invention allows a wafer burn-in test by sequentially and repeatedly applying the AC stress to all the memory devices.
摘要:
An integrated circuit that is capable of being burn-in tested with an AC stress and a testing method using the same are provided. The integrated circuit includes an address transforming means and a data generating means. The address transforming means transforms the addresses of the memory cell selected and generates an address signal responsive to a clock signal. The data generating means generates a data signal that alternates between a first state and a second state responsive to the clock signal and provides the data signal to the selected memory cell. The integrated circuit includes a switch for coupling the test supply line to the normal supply line during testing and intercepting the test supply line from the normal supply line during normal operations responsive to a control signal. The integrated circuit of the present invention allows a wafer burn-in test by sequentially and repeatedly applying the AC stress to all the memory cells.