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公开(公告)号：US08255740B2
公开(公告)日：2012-08-28
申请号：US12891309
申请日：2010-09-27
IPC分类号： G06F11/00
CPC分类号： G06F11/0793 , G06F11/073
摘要： Embodiments of the present invention include computer-implemented methods for selectively applying remedial actions, according to a predefined order, for reducing the error rate in a computer memory system. In one embodiment, an ordered set of remedial actions are sequentially invoked in response to a single-bit error (SBE) in a DIMM reaching successive error thresholds. For example, in an air-cooled system, the remedial actions may include dynamically increasing a DIMM refresh rate, dynamically increasing a rate of airflow used to cool the DIMMs, and dynamically throttling the DIMMs. The remedial actions may be layered as they are successively invoked, to provide a cumulative remedial effect. At least two of the remedial actions may be simultaneously invoked in response to a multi-bit error rate reaching an associated threshold.
摘要翻译： 本发明的实施例包括用于根据预定义的顺序选择性地应用补救动作以减少计算机存储器系统中的错误率的计算机实现的方法。 在一个实施例中，响应于DIMM中的单位错误（SBE）达到连续的错误阈值，顺序地调用有序的一组补救动作。 例如，在风冷系统中，补救措施可以包括动态地增加DIMM刷新速率，动态地增加用于冷却DIMM的气流速率，以及动态地调节DIMM。 补救措施可以按照它们被依次调用来分层，以提供累积的补救效果。 响应于达到相关阈值的多位错误率，可以同时调用至少两个补救动作。
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公开(公告)号：US20110250048A1
公开(公告)日：2011-10-13
申请号：US12756472
申请日：2010-04-08
CPC分类号： F04D29/4226 , F04D29/422 , F04D29/462
摘要： Methods, apparatus, and products are disclosed for improving the airflow exiting a blower that has one or more adjustable guide vanes that are affixed to the blower at one or more pivot points located in an outlet of the blower that include: determining a rotational speed of an impeller in the blower and adjusting a position of at least one of the adjustable guide vanes in dependence upon the rotational speed of the impeller.
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公开(公告)号：US07969736B1
公开(公告)日：2011-06-28
申请号：US12701640
申请日：2010-02-08
申请人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, Jr. , Jason A. Matteson , Mark E. Steinke
发明人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, Jr. , Jason A. Matteson , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H01L23/36 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.
摘要翻译： 通过在相邻DIMM之间定位导热底座来冷却DIMM。 诸如热管或金属杆的导热基座通过导热元件从DIMM接收热量，导热元件被选择性地偏压抵靠所安装的DIMM。 底座将热量传送到沿着DIMM端部延伸的液体导管，其中循环液体带走热量。 导热元件提供可调整的跨度以适应DIMM表面之间的距离的变化。 可以安装本发明的实施例而不延伸到DIMM的高度之上。
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14.发明授权公开(公告)号：US07660109B2
公开(公告)日：2010-02-09
申请号：US11957619
申请日：2007-12-17
CPC分类号： H05K7/20754 , F25D17/06 , F25D2317/0655 , F25D2317/0661 , Y10T29/49826
摘要： Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.
摘要翻译： 提供了用于促进采用蒸气压缩热交换系统的电子系统以及前后盖的空气冷却的装置和方法。 热交换系统的蒸发器壳体安装到电子系统的系统壳体，并且至少部分地延伸到系统壳体的空气入口侧和出口侧之间。 蒸发器壳体包括空气入口和出口以及蒸发器。 前盖与空气入口侧或空气出口开口相邻地安装在系统或蒸发器壳体上，后盖与空气出口侧或进气口相邻地安装在系统或蒸发器壳体上。 系统壳体，后盖，蒸发器壳体和前盖一起限定通过系统壳体和蒸发器壳体的闭环气流路径，其中蒸气压缩热交换系统冷却空气循环通过。
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公开(公告)号：US20120010754A1
公开(公告)日：2012-01-12
申请号：US12833526
申请日：2010-07-09
申请人： Jason A. Matteson
发明人： Jason A. Matteson
CPC分类号： H05K7/20836
摘要： Embodiments of the invention include an adaptive system and method for cooling a computer system. A plurality of interchangeable fans may be provided for cooling the computer system. Each fan may have different operational limits, but with a minimum fan speed selected so that all of the fans produce substantially the same airflow rate at the respective minimum fan speed. In one embodiment, the operational limits are stored in a computer-readable storage medium on a computer system cooling fan. The stored fan speeds are electronically retrieved from the fan, and a fan speed table is automatically generated from the retrieved maximum and minimum fan speeds. The fan speed table includes cooling state values indexed to specific fan speed values. The fan is operated at a fan speed associated with a dynamically selected cooling state.
摘要翻译： 本发明的实施例包括用于冷却计算机系统的自适应系统和方法。 可以提供多个可互换的风扇来冷却计算机系统。 每个风扇可能具有不同的操作限制，但是选择了最小风扇速度，以便所有的风扇在相应的最小风扇速度下产生基本相同的气流速率。 在一个实施例中，操作限制被存储在计算机系统冷却风扇上的计算机可读存储介质中。 从风扇电子地取回存储的风扇速度，并从检索到的最大和最小风扇速度自动生成风扇速度表。 风扇转速表包括根据特定风扇转速值索引的冷却状态值。 风扇以与动态选择的冷却状态相关联的风扇速度运行。
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公开(公告)号：US06927975B2
公开(公告)日：2005-08-09
申请号：US10607713
申请日：2003-06-27
CPC分类号： H05K7/20727 , G06F1/183 , G06F1/20
摘要： A method and system for packaging a computer system is disclosed. The computer system is capable of including a plurality of blades, a first plurality of devices, and a second plurality of devices. The method and system include providing a chassis having a first cavity, a first plenum, a second plenum and a common plenum therein. The first cavity retains the blades in parallel. The chassis is configured such that air sufficient to cool the blades is drawn into the chassis and through the blades. The first plenum is configured such that a first portion of the air sufficient to cool the first plurality of devices is drawn from the blades into the first plenum, through the first plurality of devices and into the common plenum. The second plenum is configured in an analogous manner for the second plurality of devices. The common plenum is configured such that a remaining portion of the air from the blades is drawn into the common plenum, and such that the first and second portions of the air are received into the common plenum from the first and second plurality of devices, respectively.
摘要翻译： 公开了一种用于包装计算机系统的方法和系统。 计算机系统能够包括多个叶片，第一多个装置和第二多个装置。 该方法和系统包括提供具有第一空腔，第一增压室，第二增压室和公共气室的底盘。 第一腔保持叶片平行。 底盘被构造成使得足以冷却叶片的空气被吸入底架并通过叶片。 第一增压室构造成使得足以冷却第一多个装置的空气的第一部分从叶片通过第一多个装置并入共同的压力通道而被从叶片抽入第一集气室。 第二增压室以与第二多个装置类似的方式配置。 公共气室被构造成使得来自叶片的空气的剩余部分被吸入公共气室，并且使得空气的第一和第二部分分别从第一和第二多个装置接收到公共增压室中 。
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公开(公告)号：US08907994B2
公开(公告)日：2014-12-09
申请号：US13778699
申请日：2013-02-27
CPC分类号： B41J2/315 , B41J2/32 , B41J11/009
摘要： A printer has a heat source disposed adjacent a temperature sensor to transfer heat upon activation across a portion of an introduced print media to the temperature sensor and a controller to receive a signal from the temperature sensor and to obtain a temperature signature generally identifying attributes of the introduced print media and to adjust print head settings in response to the identified attributes. The printer may further comprise a sensor to detect access to a print media storage compartment and to initiate examination of the heat transfer properties of the introduced print media upon detecting that the print storage compartment has been accessed.
摘要翻译： 打印机具有设置在温度传感器附近的热源，以在激活时将热量传递到引入的打印介质的一部分到温度传感器，以及控制器，以接收来自温度传感器的信号，并且获得温度特征， 引入打印介质并根据识别的属性调整打印头设置。 打印机还可以包括传感器，用于检测对打印介质存储隔间的访问，并且在检测到已经访问了打印存储隔间时，开始检查引入的打印介质的传热特性。
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公开(公告)号：US20140009882A1
公开(公告)日：2014-01-09
申请号：US13543089
申请日：2012-07-06
CPC分类号： H05K7/20454 , F28D15/04 , G06F1/20 , H05K7/20218 , H05K7/20336 , Y10T29/49826
摘要： An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.
摘要翻译： 提供了用于将热量从电子部件传送出去的装置和方法。 在一个实施例中，一种方法将适形的热界面元件定位成与电子部件进行热传导接触。 导热构件设置在适形的热界面元件内。 导热构件与歧管联接，使得导热构件与歧管热传导接触。 可以在不拆卸设备的情况下安装或移除电子部件。
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公开(公告)号：US08567483B2
公开(公告)日：2013-10-29
申请号：US12613938
申请日：2009-11-06
申请人： Vinod Kamath , Jason A. Matteson , Aparna Vallury
发明人： Vinod Kamath , Jason A. Matteson , Aparna Vallury
CPC分类号： H01L23/427 , F28D15/0266 , F28F3/02 , H01L23/4006 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： One embodiment provides a heatsink having a flexible base and height-adjusted cooling fins. The flexible base includes a single base plate, with cooling fins and heat pipes secured directly to an upper surface of the single base plate. The use of the single base plate allows the length of the cooling fins to be increased. The use of a single base plate also allows the base to flex when mounted at the outer region of the base plate to a circuit board using fasteners. The flexure of the base biases the heatsink against the heat-generating component. The flexure also displaces the outer cooling fins, and the length of the outer cooling fins is further increased to compensate for the anticipate displacement.
摘要翻译： 一个实施例提供具有柔性基座和高度调节的散热片的散热器。 柔性基座包括单个基板，其中冷却翅片和热管直接固定在单个基板的上表面上。 使用单个底板允许冷却翅片的长度增加。 使用单个基板还允许基座在使用紧固件安装在基板的外部区域时弯曲到电路板。 基座的弯曲使散热器偏压发热部件。 该挠曲件还使外部冷却翅片移位，并且进一步增加外部冷却翅片的长度以补偿预期的位移。
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20.发明授权公开(公告)号：US07675744B2
公开(公告)日：2010-03-09
申请号：US11263207
申请日：2005-10-31
申请人： Yoshihiro Fujie , Kenji Hidaka , Shah Mohammad Rezaul Islam , Robert A. Kubo , Bret W. Lehman , Robert M. Lindsay , Gregg S. Lucas , Jason A. Matteson , Koji Nakase , Hirokazu Nishimura , Kifumi Numata , Michihiro Okamoto , Tony C. Sass , Kenneth R. Schneebeli , Tohru Sumiyoshi , Yoshihiko Terashita
发明人： Yoshihiro Fujie , Kenji Hidaka , Shah Mohammad Rezaul Islam , Robert A. Kubo , Bret W. Lehman , Robert M. Lindsay , Gregg S. Lucas , Jason A. Matteson , Koji Nakase , Hirokazu Nishimura , Kifumi Numata , Michihiro Okamoto , Tony C. Sass , Kenneth R. Schneebeli , Tohru Sumiyoshi , Yoshihiko Terashita
IPC分类号： G06F1/20
摘要： A data storage library includes a drive enclosure bay which can be adapted to work with multiple air-flow configuration requirements. This is accomplished by creating air-flow ports in the top and bottom of the drive enclosure bay, by forming drive tray slots and printed circuit board ports in associated drive trays, by creating frame ports and PCB notches in associated interface cards, and replacing traditional connectors with slimmer but longer connectors that provide additional standoff and improved air-flow.
摘要翻译： 数据存储库包括驱动器机箱托架，其可以适应于多种气流配置要求。 这是通过在驱动器机架托架的顶部和底部创建气流端口，通过在相关联的驱动器托盘中形成驱动器托盘槽和印刷电路板端口，通过在相关联的接口卡中创建框架端口和PCB凹口来替代传统的 连接器具有更细长但更长的连接器，可提供额外的间隔和改进的气流。
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