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公开(公告)号：US08255740B2
公开(公告)日：2012-08-28
申请号：US12891309
申请日：2010-09-27
IPC分类号： G06F11/00
CPC分类号： G06F11/0793 , G06F11/073
摘要： Embodiments of the present invention include computer-implemented methods for selectively applying remedial actions, according to a predefined order, for reducing the error rate in a computer memory system. In one embodiment, an ordered set of remedial actions are sequentially invoked in response to a single-bit error (SBE) in a DIMM reaching successive error thresholds. For example, in an air-cooled system, the remedial actions may include dynamically increasing a DIMM refresh rate, dynamically increasing a rate of airflow used to cool the DIMMs, and dynamically throttling the DIMMs. The remedial actions may be layered as they are successively invoked, to provide a cumulative remedial effect. At least two of the remedial actions may be simultaneously invoked in response to a multi-bit error rate reaching an associated threshold.
摘要翻译： 本发明的实施例包括用于根据预定义的顺序选择性地应用补救动作以减少计算机存储器系统中的错误率的计算机实现的方法。 在一个实施例中，响应于DIMM中的单位错误（SBE）达到连续的错误阈值，顺序地调用有序的一组补救动作。 例如，在风冷系统中，补救措施可以包括动态地增加DIMM刷新速率，动态地增加用于冷却DIMM的气流速率，以及动态地调节DIMM。 补救措施可以按照它们被依次调用来分层，以提供累积的补救效果。 响应于达到相关阈值的多位错误率，可以同时调用至少两个补救动作。
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公开(公告)号：US20120079314A1
公开(公告)日：2012-03-29
申请号：US12891309
申请日：2010-09-27
IPC分类号： G06F11/07
CPC分类号： G06F11/0793 , G06F11/073
摘要： Embodiments of the present invention include computer-implemented methods for selectively applying remedial actions, according to a predefined order, for reducing the error rate in a computer memory system. In one embodiment, an ordered set of remedial actions are sequentially invoked in response to a single-bit error (SBE) in a DIMM reaching successive error thresholds. For example, in an air-cooled system, the remedial actions may include dynamically increasing a DIMM refresh rate, dynamically increasing a rate of airflow used to cool the DIMMs, and dynamically throttling the DIMMs. The remedial actions may be layered as they are successively invoked, to provide a cumulative remedial effect. At least two of the remedial actions may be simultaneously invoked in response to a multi-bit error rate reaching an associated threshold.
摘要翻译： 本发明的实施例包括用于根据预定义的顺序选择性地应用补救动作以减少计算机存储器系统中的错误率的计算机实现的方法。 在一个实施例中，响应于DIMM中的单位错误（SBE）达到连续的错误阈值，顺序地调用有序的一组补救动作。 例如，在风冷系统中，补救措施可以包括动态地增加DIMM刷新速率，动态地增加用于冷却DIMM的气流速率，以及动态地调节DIMM。 补救措施可以按照它们被依次调用来分层，以提供累积的补救效果。 响应于达到相关阈值的多位错误率，可以同时调用至少两个补救动作。
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公开(公告)号：US07969736B1
公开(公告)日：2011-06-28
申请号：US12701640
申请日：2010-02-08
申请人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, Jr. , Jason A. Matteson , Mark E. Steinke
发明人： Madhusudan K. Iyengar , Vinod Kamath , Howard V. Mahaney, Jr. , Jason A. Matteson , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H01L23/36 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.
摘要翻译： 通过在相邻DIMM之间定位导热底座来冷却DIMM。 诸如热管或金属杆的导热基座通过导热元件从DIMM接收热量，导热元件被选择性地偏压抵靠所安装的DIMM。 底座将热量传送到沿着DIMM端部延伸的液体导管，其中循环液体带走热量。 导热元件提供可调整的跨度以适应DIMM表面之间的距离的变化。 可以安装本发明的实施例而不延伸到DIMM的高度之上。
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公开(公告)号：US07660109B2
公开(公告)日：2010-02-09
申请号：US11957619
申请日：2007-12-17
CPC分类号： H05K7/20754 , F25D17/06 , F25D2317/0655 , F25D2317/0661 , Y10T29/49826
摘要： Apparatus and method are provided for facilitating air-cooling of an electronics system employing a vapor-compression heat exchange system, and front and back covers. An evaporator housing of the heat exchange system is mounted to a system housing of the electronics system and extends at least partially between air inlet and outlet sides of the system housing. The evaporator housing includes air inlet and outlet openings, and an evaporator. The front cover is mounted to the system or evaporator housing adjacent to the air inlet side or air outlet opening, and the back cover is mounted to the system or evaporator housing adjacent to the air outlet side or air inlet opening. Together, the system housing, back cover, evaporator housing and front cover define a closed loop airflow path passing through the system housing and evaporator housing, with the vapor-compression heat exchange system cooling air circulating therethrough.
摘要翻译： 提供了用于促进采用蒸气压缩热交换系统的电子系统以及前后盖的空气冷却的装置和方法。 热交换系统的蒸发器壳体安装到电子系统的系统壳体，并且至少部分地延伸到系统壳体的空气入口侧和出口侧之间。 蒸发器壳体包括空气入口和出口以及蒸发器。 前盖与空气入口侧或空气出口开口相邻地安装在系统或蒸发器壳体上，后盖与空气出口侧或进气口相邻地安装在系统或蒸发器壳体上。 系统壳体，后盖，蒸发器壳体和前盖一起限定通过系统壳体和蒸发器壳体的闭环气流路径，其中蒸气压缩热交换系统冷却空气循环通过。
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公开(公告)号：US20140009882A1
公开(公告)日：2014-01-09
申请号：US13543089
申请日：2012-07-06
CPC分类号： H05K7/20454 , F28D15/04 , G06F1/20 , H05K7/20218 , H05K7/20336 , Y10T29/49826
摘要： An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.
摘要翻译： 提供了用于将热量从电子部件传送出去的装置和方法。 在一个实施例中，一种方法将适形的热界面元件定位成与电子部件进行热传导接触。 导热构件设置在适形的热界面元件内。 导热构件与歧管联接，使得导热构件与歧管热传导接触。 可以在不拆卸设备的情况下安装或移除电子部件。
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公开(公告)号：US08567483B2
公开(公告)日：2013-10-29
申请号：US12613938
申请日：2009-11-06
申请人： Vinod Kamath , Jason A. Matteson , Aparna Vallury
发明人： Vinod Kamath , Jason A. Matteson , Aparna Vallury
CPC分类号： H01L23/427 , F28D15/0266 , F28F3/02 , H01L23/4006 , H01L23/467 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： One embodiment provides a heatsink having a flexible base and height-adjusted cooling fins. The flexible base includes a single base plate, with cooling fins and heat pipes secured directly to an upper surface of the single base plate. The use of the single base plate allows the length of the cooling fins to be increased. The use of a single base plate also allows the base to flex when mounted at the outer region of the base plate to a circuit board using fasteners. The flexure of the base biases the heatsink against the heat-generating component. The flexure also displaces the outer cooling fins, and the length of the outer cooling fins is further increased to compensate for the anticipate displacement.
摘要翻译： 一个实施例提供具有柔性基座和高度调节的散热片的散热器。 柔性基座包括单个基板，其中冷却翅片和热管直接固定在单个基板的上表面上。 使用单个底板允许冷却翅片的长度增加。 使用单个基板还允许基座在使用紧固件安装在基板的外部区域时弯曲到电路板。 基座的弯曲使散热器偏压发热部件。 该挠曲件还使外部冷却翅片移位，并且进一步增加外部冷却翅片的长度以补偿预期的位移。
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7.发明授权公开(公告)号：US10180665B2
公开(公告)日：2019-01-15
申请号：US13234563
申请日：2011-09-16
申请人： Thomas M. Brey , Vinod Kamath , Jason A. Matteson
发明人： Thomas M. Brey , Vinod Kamath , Jason A. Matteson
摘要： A fluid-cooled computer system includes a plurality of heat-generating components and a cooling system configured for supplying a cooling fluid at a controlled cooling fluid flow rate to cool the heat-generating components. A temperature-based cooling control circuit includes a temperature sensor configured for sensing a temperature of the heat-generating components and control logic for increasing a cooling fluid flow rate in response to the temperature exceeding a temperature threshold. A power-based cooling control circuit is configured for identifying and quantifying an increasing power consumption trend over a target time interval and, during a period that the temperature of the electronic device does not exceed the temperature threshold, increasing a cooling fluid flow rate to the electronic device in response to the magnitude of the increasing power consumption trend exceeding a power threshold. In one option, the fluid-cooled computer system is a server and the heat-generating components include a processor.
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8.发明授权Optimization of system acoustic signature and cooling capacity with intelligent user controls 有权通过智能用户控制优化系统声学特征和制冷量公开(公告)号：US09110642B2
公开(公告)日：2015-08-18
申请号：US13274835
申请日：2011-10-17
CPC分类号： G06F1/206 , G06F1/3206 , H05K7/20209 , H05K7/20718 , Y02D10/16
摘要： A computer-implemented method comprises accessing historical operating data for a unit of information technology equipment, wherein the historical operating data includes power consumption, fan speed, inlet air temperature, workload, and any processor throttling events at various points in time. The method further comprises receiving user input selecting a fan speed, and using the historical operating data to determine a performance impact that is expected from operating the unit at the selected fan speed, where the power consumption is a proxy for performance. The estimated performance impact of the selected fan speed and one or more alternative fan speeds is then displayed.
摘要翻译： 计算机实现的方法包括访问信息技术设备单元的历史操作数据，其中历史操作数据包括功率消耗，风扇速度，入口空气温度，工作负载以及在不同时间点的任何处理器调节事件。 该方法还包括接收选择风扇速度的用户输入，以及使用历史操作数据来确定在所选择的风扇速度下操作单元所期望的性能影响，其中功耗是性能的代理。 然后显示所选风扇速度和一个或多个替代风扇速度的估计性能影响。
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9.发明授权Liquid cooling apparatus and method for facilitating cooling of an electronics system 失效用于促进电子系统冷却的液体冷却装置和方法公开(公告)号：US07639499B1
公开(公告)日：2009-12-29
申请号：US12168259
申请日：2008-07-07
申请人： Levi A. Campbell , Richard C. Chu , Martin J. Crippen , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Jason A. Matteson , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Martin J. Crippen , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Vinod Kamath , Jason A. Matteson , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20
CPC分类号： H05K7/20772
摘要： Apparatus and method are provided for facilitating liquid cooling one or more components of an electronic subsystem chassis disposed within an electronics rack. The apparatus includes a rack-level coolant manifold assembly and at least one movable chassis-level manifold subassembly. The rack-level coolant manifold assembly includes a rack-level inlet manifold and a rack-level outlet manifold, and each movable chassis-level manifold subassembly includes a chassis-level coolant inlet manifold coupled in fluid communication with the rack-level inlet manifold, and a chassis-level coolant outlet manifold coupled in fluid communication with the rack-level outlet manifold. The chassis-level manifold subassembly is slidably coupled to the electronics rack to facilitate access to one or more removable components of the electronic subsystem chassis. In one embodiment, the electronics subsystem chassis is a multi-blade center system having multiple removable blades, each blade being an electronics subsystem.
摘要翻译： 提供了设备和方法，以便于液体冷却设置在电子机架内的电子子系统机架的一个或多个部件。 该设备包括机架级冷却剂歧管组件和至少一个可移动底盘级歧管组件。 机架级冷却剂歧管组件包括机架级入口歧管和机架级出口歧管，并且每个可移动底盘级歧管组件包括与机架级入口歧管流体连通地联接的底盘级冷却剂入口歧管， 以及与所述齿条级出口歧管流体连通地联接的底盘级冷却剂出口歧管。 底盘级歧管子组件可滑动地联接到电子机架，以便于接近电子子系统底盘的一个或多个可拆卸部件。 在一个实施例中，电子系统底盘是具有多个可移除刀片的多刀片中心系统，每个刀片是电子子系统。
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公开(公告)号：US09089076B2
公开(公告)日：2015-07-21
申请号：US13543089
申请日：2012-07-06
CPC分类号： H05K7/20454 , F28D15/04 , G06F1/20 , H05K7/20218 , H05K7/20336 , Y10T29/49826
摘要： An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.
摘要翻译： 提供了用于将热量从电子部件传送出去的装置和方法。 在一个实施例中，一种方法将适形的热界面元件定位成与电子部件进行热传导接触。 导热构件设置在适形的热界面元件内。 导热构件与歧管连接，使得导热构件与歧管热传导接触。 可以在不拆卸设备的情况下安装或移除电子部件。
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