公开(公告)号：US20130311127A1

公开(公告)日：2013-11-21

申请号：US13944430

申请日：2013-07-17

Applicant: Broadcom Corporation

Inventor： Arya Reza BEHZAD ,  Ahmadreza ROFOUGARAN ,  Sam Ziqun ZHAO ,  Jesus Alfonso CASTANEDA ,  Michael BOERS

IPC: G01R31/319

CPC classification number: G01R31/319 ,  G01R31/2834 ,  G01R31/3025 ,  G01R31/311 ,  H01L23/544 ,  H01L2223/54433 ,  H01L2924/0002 ,  Y10T29/49121 ,  H01L2924/00

Abstract: Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Abstract translation: 公开了同时无线地测试形成在半导体晶片上的半导体元件的方法和装置。 半导体部件通过公共通信信道将各自的测试结果传送到无线自动测试设备。 多个接收天线在三维空间中观察多个方向的结果。 无线自动测试设备确定一个或多个半导体组件是否按预期运行，并且可选地，可以使用三维空间的属性来确定一个或多个半导体组件的位置。 无线测试设备还可以通过检测在独立测试操作之前，期间和/或之后由半导体晶片发射，传输和/或反射的红外能量来确定半导体组件的性能。

公开(公告)号：US20150303878A1

公开(公告)日：2015-10-22

申请号：US14712743

申请日：2015-05-14

Applicant: BROADCOM CORPORATION

Inventor： Tirdad SOWLATI ,  Ehsan ADABI ,  Sayedfarid SHIRINFAR ,  Ahmadreza ROFOUGARAN

IPC: H03F1/02 ,  H03F3/21 ,  H03F3/193

CPC classification number: H03F1/0205 ,  H03F1/0272 ,  H03F3/193 ,  H03F3/195 ,  H03F3/211 ,  H03F3/24 ,  H03F2200/105 ,  H03F2200/405 ,  H03F2200/451 ,  H03F2200/78 ,  H03F2203/21142 ,  H03G3/20

Abstract: An apparatus includes a cascode amplifier. The cascode amplifier includes a first transistor and a second transistor. The cascode amplifier is configured to receive a first bias voltage, a second bias voltage, and a signal. The cascode amplifier is also configured to amplify the signal based at least on the first bias voltage and the second bias voltage. The apparatus also includes a first feedback module and a second feedback module. The first feedback module is configured to adjust the first bias voltage based at least on the amplified signal. The second feedback module is configured to adjust the second bias voltage based at least on a voltage distribution across the first transistor and the second transistor. A system and method for maintaining cascode amplifier performance are also provided.

Abstract translation: 一种装置包括共源共栅放大器。 共源共栅放大器包括第一晶体管和第二晶体管。 共射共栅放大器被配置为接收第一偏置电压，第二偏置电压和信号。 级联放大器还被配置为至少基于第一偏置电压和第二偏置电压来放大信号。 该装置还包括第一反馈模块和第二反馈模块。 第一反馈模块被配置为至少基于放大的信号来调整第一偏置电压。 第二反馈模块被配置为至少基于跨越第一晶体管和第二晶体管的电压分布来调整第二偏置电压。 还提供了用于维持共源共栅放大器性能的系统和方法。

公开(公告)号：US20150280325A1

公开(公告)日：2015-10-01

申请号：US14737895

申请日：2015-06-12

Applicant: Broadcom Corporation

Inventor： Ahmadreza ROFOUGARAN

IPC: H01Q13/22

CPC classification number: G01S13/06 ,  G06K7/10316 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01Q1/2283 ,  H01Q13/20 ,  H01Q13/22 ,  H01Q15/006 ,  H01Q15/0066 ,  H01Q15/23 ,  H01Q19/06 ,  H04B1/04 ,  H04B1/0458 ,  H04B5/0031 ,  H04B7/24 ,  Y10T307/25 ,  H01L2924/00

Abstract: Methods and systems for configuring a leaky wave antenna (LWA) utilizing micro-electromechanical systems (MEMS) are disclosed and may include configuring a resonant frequency of one or more LWAs in a wireless device utilizing MEMS actuation. RF signals may be communicated using the LWAs. The LWAs may be integrated in metal layers in a chip, an integrated circuit package, and/or a printed circuit board in the wireless device. The LWAs may include microstrip waveguides where a cavity height of the LWAs may be dependent on a spacing between conductive lines in the microstrip waveguides. The LWAs may be configured to transmit the wireless signals at a desired angle. The integrated circuit package may be affixed to a printed circuit board and an integrated circuit may be flip-chip-bonded to the integrated circuit package. An air gap may be integrated adjacent to one or more of the metal layers for the MEMS actuation.

Abstract translation: 公开了利用微机电系统（MEMS）来配置泄漏波天线（LWA）的方法和系统，并且可以包括在利用MEMS致动的无线设备中配置一个或多个LWAs的谐振频率。 可以使用LWAs来传送RF信号。 LWAs可以集成在无线设备中的芯片，集成电路封装和/或印刷电路板中的金属层中。 LWAs可以包括微带波导，其中LWAs的空腔高度可以取决于微带波导中的导线之间的间隔。 LWAs可以被配置为以期望的角度发送无线信号。 集成电路封装可以固定到印刷电路板上，并且集成电路可以倒装芯片地结合到集成电路封装。 空气间隙可以与用于MEMS致动的一个或多个金属层相邻地集成。

公开(公告)号：US20140087676A1

公开(公告)日：2014-03-27

申请号：US13628488

申请日：2012-09-27

Applicant: BROADCOM CORPORATION

Inventor： Farid SHIRINFAR ,  Med NARIMAN ,  Maryam ROFOUGARAN ,  Ahmadreza ROFOUGARAN

IPC: H04B1/04

CPC classification number: H04B1/0483 ,  H04B1/0458

Abstract: A transmitter front-end for wireless chip-to-chip communication, and potentially for other, longer range (e.g., several meters or several tens of meters) device-to-device communication, is disclosed. The transmitter front-end includes a distributed power amplifier capable of providing an output signal with sufficient power for wireless transmission by an on-chip or on-package antenna to another nearby IC chip or device located several meters or several tens of meters away. The distributed power amplifier can be fully integrated (i.e., without using external components, such as bond wire inductors) on a monolithic silicon substrate using, for example, a complementary metal oxide semiconductor (CMOS) process.

Abstract translation: 公开了一种用于无线芯片到芯片通信的发射机前端，并且潜在地用于其他较长距离（例如，几米或几十米）的设备到设备通信。 发射机前端包括分布式功率放大器，其能够提供具有足够功率的输出信号，用于通过片上或封装内天线到距离几米或几十米远的另外附近的IC芯片或设备的无线传输。 分布式功率放大器可以使用例如互补金属氧化物半导体（CMOS）工艺，在单片硅衬底上完全集成（即，不使用外部组件，例如接合线电感器）。