公开(公告)号：US11123954B2

公开(公告)日：2021-09-21

申请号：US15921034

申请日：2018-03-14

Applicant: Corning Incorporated

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Dana Craig Bookbinder ,  Theresa Chang ,  Shiwen Liu ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B7/06 ,  B32B37/26 ,  B32B17/06 ,  C03C17/22 ,  C03C23/00 ,  C03C27/06 ,  C03C27/10 ,  B32B7/02

Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.

公开(公告)号：US20200181009A1

公开(公告)日：2020-06-11

申请号：US16327145

申请日：2017-08-29

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Jiangwei Feng ,  Georgiy M Guryanov ,  Jhih-Wei Liang ,  Shiwen Liu ,  Prantik Mazumder

IPC: C03C17/32 ,  B32B17/10

Abstract: Described herein are articles and methods of making articles, including a first sheet and a second sheet, wherein the thin sheet and carrier are bonded together using a coating layer, preferably a hydrocarbon polymer coating layer, and associated deposition methods and inert gas treatments that may be applied on either sheet, or both, to control van der Waals, hydrogen and covalent bonding between the sheets. The coating layer bonds the sheets together to prevent formation of a permanent bond at high temperature processing while at the same time maintaining a sufficient bond to prevent delamination during high temperature processing.

公开(公告)号：US09042416B1

公开(公告)日：2015-05-26

申请号：US13837270

申请日：2013-03-15

Applicant: Corning Incorporated

Inventor： Chin-Kuo Ho ,  Martin Hai Hu ,  Yabo Li ,  Shiwen Liu ,  Chung-En Zah

IPC: H01S5/00 ,  H01S5/34

CPC classification number: H01S5/3409 ,  H01S5/2031 ,  H01S5/305 ,  H01S5/34

Abstract: A GRINSCH laser having an asymmetric configuration wherein the optical confinement is weighted more to the n-doped multilayer section than to the p-doped multilayer section. The GRINSCH laser can emit laser light at a wavelength λ=976 nm over a broad area with a beam power of 11.4 W at a 12 A bias current at a temperature of 20° C. Fabry-Perot and distributed Bragg reflector GRINSCH laser configurations are disclosed.

Abstract translation: 具有不对称配置的GRINSCH激光器，其中光学限制比n掺杂多层部分更多地加权，而不是p掺杂多层部分。 GRINSCH激光器可在广泛的区域发射波长λ= 976nm的激光，在温度为20°C的12 A偏置电流下，波束功率为11.4 W。法布里 - 珀罗和分布式布拉格反射镜GRINSCH激光器配置为 披露

公开(公告)号：US11577992B2

公开(公告)日：2023-02-14

申请号：US16754655

申请日：2018-10-12

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  David Francis Dawson-Elli ,  Shiwen Liu ,  Chuanche Wang

IPC: C03C17/02

Abstract: A method includes depositing a surface modification layer on sidewalls of a plurality of cavities of a shaped article. The surface modification layer is formed from a glass material including a mobile component. The shaped article is formed from a glass material, a glass ceramic material, or a combination thereof. At least a portion of the mobile component is migrated from the surface modification layer into surface regions of the sidewalls of the shaped article, whereby subsequent to the migration, the surface regions have a reduced annealing point compared to a bulk of the shaped article. The surface modification layer and the surface regions of the sidewalls are reflowed. A surface roughness of the surface modification layer disposed on the sidewalls following the reflowing is less than a surface roughness of the sidewalls prior to the depositing.

公开(公告)号：US11114309B2

公开(公告)日：2021-09-07

申请号：US16524925

申请日：2019-07-29

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Shiwen Liu

IPC: B32B3/26 ,  B32B33/00 ,  C03C15/00 ,  C03C17/22 ,  C03C17/30 ,  C03C23/00 ,  B05D3/00 ,  B05D3/06 ,  B05D3/10 ,  B05D5/00 ,  H01L21/48 ,  H01L21/308 ,  H01L21/311 ,  B05D1/00 ,  H01L21/683 ,  H01L23/498 ,  H01L21/768 ,  B23K103/00 ,  B23K26/53 ,  B32B17/06 ,  C03C3/04 ,  C23C16/27

Abstract: Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

公开(公告)号：US20180297324A1

公开(公告)日：2018-10-18

申请号：US15921034

申请日：2018-03-14

Applicant: Corning Incorporated

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Dana Craig Bookbinder ,  Theresa Chang ,  Shiwen Liu ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B7/06 ,  B32B17/06 ,  C03C27/10 ,  C03C27/06 ,  C03C23/00 ,  C03C17/22 ,  B32B7/02 ,  B32B37/26

Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.

公开(公告)号：US20170036419A1

公开(公告)日：2017-02-09

申请号：US15122366

申请日：2015-01-26

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Robert Alan Bellman ,  Dana Craig Bookbinder ,  Theresa Chang ,  Shiwen Liu ,  Robert George Manley ,  Pantik Mazumder

IPC: B32B7/06 ,  B32B37/26 ,  B32B7/02

CPC classification number: B32B7/06 ,  B32B7/02 ,  B32B17/06 ,  B32B17/064 ,  B32B37/26 ,  B32B2315/08 ,  B32B2457/20 ,  B32B2457/206 ,  C03C17/22 ,  C03C23/006 ,  C03C27/06 ,  C03C27/10 ,  C03C2217/28 ,  C03C2217/77 ,  C03C2218/153

Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.

Abstract translation: 一种将具有薄片接合面的薄片与具有载体接合面的载体可控地接合的方法，通过在至少一个薄片接合面和载体接合面上沉积碳质表面改性层，将极性基团与 表面改性层，然后经由表面改性层将薄片接合表面粘合到载体接合表面。 表面改性层可以包括具有第一极性基团浓度的块状碳层和具有第二极性基团浓度的表面层，其中第二极性基团浓度高于第一极性基团浓度。 表面改性层沉积及其处理可以通过等离子体聚合技术进行。