公开(公告)号：US20180057390A1

公开(公告)日：2018-03-01

申请号：US15560390

申请日：2016-03-23

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Xinghua Li ,  Sasha Marjanovic ,  Moussa N'Gom ,  David Andrew Pastel ,  Garrett Andrew Piech ,  Daniel Schnitzler ,  Robert Stephen Wagner ,  James Joseph Watkins

IPC: C03B33/02 ,  B23K26/364 ,  C03C3/093

CPC classification number: C03B33/0222 ,  B23K26/364 ,  B23K26/53 ,  B23K2103/54 ,  C03B33/0215 ,  C03C3/093 ,  Y02P40/57

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (

公开(公告)号：US20150165560A1

公开(公告)日：2015-06-18

申请号：US14536009

申请日：2014-11-07

Applicant: CORNING INCORPORATED

Inventor： Thomas Hackert ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: B23K26/38 ,  C03B33/08 ,  B23K26/02

CPC classification number: C03B33/082 ,  B23K26/0608 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/382 ,  B23K26/389 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/04 ,  C03B33/091 ,  Y02P40/57 ,  Y10T428/15 ,  Y10T428/24273

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

Abstract translation: 本发明涉及用于在透明材料（特别是玻璃）的薄衬底中切割和分离内部轮廓的方法。 该方法涉及利用超短脉冲激光器在衬底中形成穿孔或孔，其后可以使用CO 2激光束来促进穿孔线周围的完全分离。