公开(公告)号：US11773004B2

公开(公告)日：2023-10-03

申请号：US15560390

申请日：2016-03-23

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Xinghua Li ,  Sasha Marjanovic ,  Moussa N'Gom ,  David Andrew Pastel ,  Garrett Andrew Piech ,  Daniel Schnitzler ,  Robert Stephen Wagner ,  James Joseph Watkins

IPC: C03B33/02 ,  B23K26/364 ,  C03C3/093 ,  B23K26/53 ,  B23K103/00

CPC classification number: C03B33/0222 ,  B23K26/364 ,  B23K26/53 ,  C03B33/0215 ,  C03C3/093 ,  B23K2103/54 ,  Y02P40/57

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (

公开(公告)号：US20180118602A1

公开(公告)日：2018-05-03

申请号：US15792873

申请日：2017-10-25

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Frank Fabian Herrnberger ,  Tim Meyne ,  Albert Roth Nieber ,  Florian Spaeth

IPC: C03B33/03 ,  C03B33/08 ,  C03B35/18 ,  B65H5/02

CPC classification number: C03B33/03 ,  B65G49/064 ,  B65G2249/045 ,  B65H5/026 ,  B65H2404/25 ,  C03B33/0222 ,  C03B33/082 ,  C03B35/18

Abstract: A glass sheet processing apparatus includes a glass sheet processing station including a laser cutting assembly that includes an optical arrangement positioned in a beam path of the laser providing a laser beam focal line that is formed on a beam output side of the optical arrangement. A glass holding conveyor belt carries a glass sheet by the laser cutting assembly so that the laser beam focal line is positioned on the glass sheet with the glass sheet on the glass holding conveyor belt. The glass holding conveyor belt is configured to carry multiple glass sheets to the laser cutting assembly for cutting the multiple glass sheets on the glass holding conveyor belt in a repeated fashion.

公开(公告)号：US20200049552A1

公开(公告)日：2020-02-13

申请号：US16536559

申请日：2019-08-09

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Tobias Christian Roeder ,  Uwe Stute

IPC: G01J1/42 ,  G01J1/44 ,  G01B11/28 ,  B23K26/073 ,  B23K26/53

Abstract: A laser system includes a controller comprising a processor and a non-transitory machine-readable memory, a laser head configured to output a laser beam, a work bed positioned opposite the laser head, and a power meter communicatively coupled to the electronic control unit and integrated within the work bed. The laser system further includes a knife edge plate positioned between the power meter and the laser head, and a machine-readable instruction set stored in the non-transitory machine readable memory that causes the laser system to perform at least the following when executed by the processor: position the laser head at a distance from the power meter, cause the laser head to output the laser beam, translate the laser head across the power meter, receive power signals from the power meter as the laser beam is translated across the power meter, and calculate a spot size based on the power signals.

公开(公告)号：US20190144325A1

公开(公告)日：2019-05-16

申请号：US16097999

申请日：2017-05-04

Applicant: CORNING INCORPORATED

Inventor： Bradley Frederick Bowden ,  Xiaoju Guo ,  Thomas Hackert ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: C03B33/02 ,  B23K26/53 ,  C03B33/04 ,  C03B33/09

Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

公开(公告)号：US20160368809A1

公开(公告)日：2016-12-22

申请号：US15251605

申请日：2016-08-30

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/08 ,  B23K26/53 ,  C03B33/04 ,  B23K26/06 ,  C03B33/02 ,  B23K26/00 ,  B23K26/0622

CPC classification number: C03B33/082 ,  B23K26/0608 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/382 ,  B23K26/389 ,  B23K26/53 ,  B23K26/55 ,  B23K2103/54 ,  C03B33/0222 ,  C03B33/04 ,  C03B33/091 ,  Y02P40/57 ,  Y10T428/15 ,  Y10T428/24273

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

公开(公告)号：US20210347673A1

公开(公告)日：2021-11-11

申请号：US17383708

申请日：2021-07-23

Applicant: CORNING INCORPORATED

Inventor： Bradley Frederick Bowden ,  Xiaoju Guo ,  Thomas Hackert ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/53

Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

公开(公告)号：US11111170B2

公开(公告)日：2021-09-07

申请号：US16097999

申请日：2017-05-04

Applicant: CORNING INCORPORATED

Inventor： Bradley Frederick Bowden ,  Xiaoju Guo ,  Thomas Hackert ,  Garrett Andrew Piech ,  Kristopher Allen Wieland

IPC: B23K26/38 ,  B23K26/50 ,  C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/53 ,  B23K103/00

Abstract: A method for cutting, separating and removing interior contoured shapes in thin substrates, particularly glass substrates. The method involves the utilization of an ultra-short pulse laser to form defect lines in the substrate that may be followed by use of a second laser beam to promote isolation of the part defined by the interior contour.

公开(公告)号：US10982998B2

公开(公告)日：2021-04-20

申请号：US16536559

申请日：2019-08-09

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Tobias Christian Roeder ,  Uwe Stute

IPC: G01J1/42 ,  B23K26/53 ,  B23K26/073 ,  G01B11/28 ,  G01J1/44

Abstract: A laser system includes a controller comprising a processor and a non-transitory machine-readable memory, a laser head configured to output a laser beam, a work bed positioned opposite the laser head, and a power meter communicatively coupled to the electronic control unit and integrated within the work bed. The laser system further includes a knife edge plate positioned between the power meter and the laser head, and a machine-readable instruction set stored in the non-transitory machine readable memory that causes the laser system to perform at least the following when executed by the processor: position the laser head at a distance from the power meter, cause the laser head to output the laser beam, translate the laser head across the power meter, receive power signals from the power meter as the laser beam is translated across the power meter, and calculate a spot size based on the power signals.

公开(公告)号：US20200055766A1

公开(公告)日：2020-02-20

申请号：US16608037

申请日：2018-04-24

Applicant: CORNING INCORPORATED

Inventor： Alejandro Antonio Becker ,  Michele Marie-Louise Fredholm ,  Thomas Hackert ,  Albert Roth Nieber ,  Sergio Tsuda

IPC: C03B33/02 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/359 ,  B23K26/53 ,  C03B23/025 ,  C03B33/033

Abstract: In some embodiments, a method of forming a glass article comprises perforating a glass substrate along a contour with a laser forming a plurality of perforations, such that the contour separates a first portion of the glass substrate from a second portion of the glass substrate. After perforating, thermal forming the glass substrate into a non-planar shape with a mold, and separating the first portion of the glass substrate from the second portion of the glass substrate.

公开(公告)号：US10233112B2

公开(公告)日：2019-03-19

申请号：US15251605

申请日：2016-08-30

Applicant: Corning Incorporated

Inventor： Thomas Hackert ,  Sasha Marjanovic ,  Garrett Andrew Piech ,  Sergio Tsuda ,  Robert Stephen Wagner

IPC: C03B33/08 ,  B23K26/00 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/53 ,  C03B33/02 ,  C03B33/04 ,  C03B33/09 ,  B23K26/382 ,  B23K26/55 ,  B23K26/359 ,  B23K103/00

Abstract: The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.