摘要:
On the back of a wafer there are deposited firstly a gold layer and then an aluminium layer (eventually including a small silicon percent). It is finally carried out a thermic treatment at low temperature, which causes the aluminium migration towards the wafer through the gold layer.
摘要:
Matrix of memory cells formed using a method allowing for a self-alignment of the respective source region with the respective field oxide layer and the respective overlying polysilicon layer of each single cell of the matrix, the matrix including at least one first ROM memory cell suitable for permanently storing a first logic level, associated with a respective row and a respective column of the matrix, the first cell including a silicon substrate of a first conductivity type over which a first isolation region and a second isolation region are formed delimiting therebetween a longitudinal stripe, a gate element extending transversally through the stripe from at least one side of the first isolation region to at least one side of the second isolation region, a third region of a second conductivity type and a fourth region of a second conductivity type formed in the substrate along the stripe, and a field oxide region adapted to prevent the formation of a conductive channel in the substrate, and at least a second ROM cell for permanently storing a second logic level, identical to the first ROM memory cell but not provided with the field oxide region.
摘要:
A CMOS device and process are disclosed in which two types of N-channel MOS transistors are provided, one being formed in a P-well and one being formed outside the P-well where the relatively low doping concentration of P-type substrate serves as a channel defining region. This second type N-channel transistor an support higher junction voltages due to the lower p-type doping concentration than is possible for the first type N-channel transistor formed in the higher doping concentration P-well. A mask is provided to prevent boron doping in the substrate at the site of the high voltage transistor during the implantation step which defines the P-well.
摘要:
Nonuniformities of luminance characteristics in a field emission display (FED) are compensated pixel by pixel by storing a matrix of correction values, determined by testing, and by applying a corrected drive signal through the relative column drive stages. The individual pixel's correction factor that is applied to the corresponding video signal may be stored in digital or analog form in a nonvolatile memory array. Various embodiments are described including the use of a second updatable RAM array wherein pixel's correction factors are calculated and stored at every power-on to provide an opportunity of trimming-up the luminance of the display for compensating long term decline of luminance due to the phosphors ageing process.
摘要:
A monolithic integrated circuit of either the MOS or CMOS type comprises an intermediate layer of polycrystalline silicon, a layer of a silicide of a refractory metal overlying said polycrystalline silicon layer, and regions of preset area and preset paths formed in the polycrystalline silicon layer and the silicide layer; the preset area regions and preset paths forming respectively high resistivity resistances and low resistivity interconnection lines for an intermediate connection level.
摘要:
A method of manufacturing an integrated semiconductor device having at least one non-volatile floating gate memory cell and at least one logic transistor. The method includes growing a first gate oxide layer over a silicon substrate, depositing a first polysilicon layer over the first gate oxide layer, selectively etching and removing the first polysilicon layer in order to define the floating gate of the memory cell, introducing dopant in order to obtain source and drain regions of the memory cell, depositing a dielectric layer, selectively etching and removing the dielectric layer and the first polysilicon layer in a region wherein the logic transistor will be formed, depositing a second polysilicon layer, selectively etching and removing the second polysilicon layer in order to define the gate of the logic transistor and the control gate of the memory cell. Between selectively etching the dielectric and depositing a second polysilicon layer, a first sub-step of removing the first gate oxide layer in the region for the logic transistor, and a second sub-step of growing a second oxide gate layer over the region, the second gate oxide layer having a different thickness than the first gate oxide layer.
摘要:
A programming voltage is supplied to a control gate of a non-volatile memory cell via a control gate line. A supply voltage is coupled to a first plate of a capacitor and a reference voltage is coupled to a second plate of the capacitor. The supply voltage is then uncoupled from the first plate and the reference voltage is uncoupled from the second plate. Next, the reference voltage is coupled to the first plate to generate the programming voltage on the second plate.
摘要:
A process for forming low threshold voltage P-channel MOS transistors in semiconductor integrated circuits for analog applications, said circuits including high resistivity resistors formed in a layer of polycrystalline silicon and N-channel MOS transistors having active areas which have been obtained by implantation in a P-type well, comprises the steps of,providing a first mask over both said resistors and the semiconductor regions where the low threshold voltage P-channel transistors are to be formed,doping the polycrystalline layer uncovered by said first mask,--providing a second mask for protecting the resistors and the semiconductor regions where said low threshold voltage P-channel transistors are to be formed, andN+ implanting the active areas of the N-channel transistors.
摘要:
A programming voltage is supplied to a control gate of a non-volatile memory cell via a control gate line. A supply voltage is coupled to a first plate of a capacitor and a reference voltage is coupled to a second plate of the capacitor. The supply voltage is then uncoupled from the first plate and the reference voltage is uncoupled from the second plate. Next, the reference voltage is coupled to the first plate to generate the programming voltage on the second plate.
摘要:
Highly reliable direct contacts may be formed by defining a direct contact area within a larger area purposely implanted and diffused for ensuring electrical continuity in the semiconductor. Patterning may define the contacting polysilicon within an implanted direct contact area so that the definition edges thereof fall on a gate oxide layer thus preventing an etching of the semiconductor during the unavoidable over-etching that concludes the polysilicon patterning step. Preferably, a pre-definition of the direct contact area is performed through a first, deposited layer of polysilicon, which effectively protects a gate oxide layer during a HF wash prior to depositing a second, contacting layer of polysilicon of adequate thickness.