摘要:
Provided is a multiple transposition method for superconducting wire, by making each superconducting wire unit from second-generation superconducting wires that were firstly transposed and then transposing each superconducting wire unit in such a manner that the phase of each unit can be changed along the length, comprising preparing wires by making curves on superconducting wires in such a manner that the superconducting wires of a thin multiple layer grown epitaxially are slit in zigzags and then making the curves repeatedly and by machining the wires with a desired length; making first-transposed superconducting wire units by combining a plurality of the prepared wires such that curves of adjacent wires come in touch to each other and are superposed; preparing a superconducting wire unit bundle by arranging the first-transposed superconducting wires units and by locating a plurality of the first-transposed superconducting wire units in parallel along the length; and making a second transposition on the first-transposed superconducting wire units by rotating the plurality of superconducting wire units on the central axis of the superconducting wire unit bundle along the length to be twisted and combined with each other.
摘要:
Provided is a method of predicting failure in geotechnical structures using an AE method instead of a conventional displacement or stress measuring method, which belongs to a field of rock mechanics and geotechnical engineering. The method is a measurement technology for identifying signs of failure in geotechnical structures using Acoustic Emission (AE) signals generated by damage in the geotechnical structure and also providing management standard for failure prediction.
摘要:
Example embodiments disclose an image sensor capable of preventing or reducing image lag and a method of manufacturing the same. Example methods may include forming a gate insulating film and a gate conductive film doped with a first-conductive-type dopant on a semiconductor substrate; forming a transfer gate pattern by patterning the gate insulating film and the gate conductive film; and fabricating a transfer gate electrode by forming a first-conductive-type photodiode in the semiconductor substrate adjacent to one region of the transfer gate pattern, by forming a second-conductive-type photodiode on the first-conductive-type photodiode, and by forming a first-conductive-type floating diffusion region in the semiconductor substrate adjacent to the other region of the transfer gate pattern.
摘要:
A method of fabricating an image sensor may include providing a substrate including light-receiving and non-light-receiving regions; forming a plurality of gates on the non-light-receiving region; ion-implanting a first-conductivity-type dopant into the light-receiving region to form a first dopant region of a pinned photodiode; primarily ion-implanting a second-conductivity-type dopant, different from the first-conductivity-type dopant, into an entire surface of the substrate, using the gates as a first mask; forming spacers on both side walls of the gates; and secondarily ion-implanting the second-conductivity-type dopant into the entire surface of the substrate, using the plurality of gates including the spacers as a second mask, to complete a second dopant region of the pinned photodiode. An image sensor may include the substrate; a transfer gate formed on the non-light-receiving region; a first dopant region in the light-receiving region; and a second dopant region formed on a surface of the light-receiving region.
摘要:
A flip-chip package may include: a semiconductor chip having first pads arranged substantially along a first direction; a substrate having second pads, arranged substantially in a zigzag form aligned with the first pads as a center line, and facing the semiconductor chip; and conductive bumps for electrically connecting the first pads to the second pads in a one-to-one relationship. Adjacent conductive bumps may extend in different directions. A method of manufacturing a flip-chip package may include: forming conductive bumps that extend along different directions on first pads of a semiconductor chip; and connecting second pads of a substrate to the conductive bumps in a one-to-one relationship. A method of manufacturing a flip-chip package may include: forming conductive bumps that extend along different directions on second pads of a substrate; and connecting first pads of a semiconductor chip to the conductive bumps in a one-to-one relationship.
摘要:
Embodiments of the invention provide an information input system for a terminal and a multifunctional button assembly for use in the information input system and methods for operating the same. The multifunctional button assembly can include a lever control button, a rotary button and a switch that can be mounted on a substrate. The multifunctional button assembly of the invention can provide advantages in that since the number of functions provided by the multifunctional button assembly is relatively increased, more functions can be concurrently employed, and a terminal employing the multifunctional button assembly can be manufactured to be light, thin, short and compact.
摘要:
An air purifier designed to allow dust collected on a surface of a dust filter therein to be conveniently and rapidly removed from the dust filter without separating the dust filter from the air purifier unit. The air purifier includes a vibrating member equipped adjacent to the dust filter, and a vibration motor assembly equipped to the vibrating member to remove dust attached to the dust filter through vibratory motion. The dust filter is equipped at an angle within the housing for the air purifier such that an upper end of the dust filter is closer to a front side of the housing than a lower end of the dust filter. The air purifier may further include a tray equipped below the dust filter to collect the dust that drops from the dust filter when the dust filter is vibrated by vibration of the vibrating member. The tray has a rear plate extending towards the lower end of the dust filter to prevent the dust collected in the tray from being scattered and then reattached to the dust filter. One or more surfaces of the dust filter may be coated to prevent static electricity from accumulating thereon so as to easily remove the dust.
摘要:
The method for encoding a date for universal recognition provides a representation of a date that eliminates ambiguities that may arise because of different date formats widely used throughout the world. A date is encoded by first expressing the date as at least a calendar month and a calendar year within a calendar system. A month identifier is encoded for the calendar month. The month identifier comprises a first identifier field having a first association with the name of the month, and a second identifier field having a second association with the name of the month. Next, a year identifier is formed for the calendar year. A date representation is formed by formatting the month identifier together with the year identifier. Visual indicia of the date representation are formed on an article to express a date of interest, such as an expiration date on a credit card.
摘要:
A light guide plate for a surface light-emitting device and a method of manufacturing the same are disclosed wherein the light guide plate is constructed in the form of an optical waveguide including an upper cladding film, core films formed with V-cut grooves, and a lower cladding film, so that since the upper and lower cladding films with a relatively low refractive index are respectively located on upper and lower surfaces of the core films, external foreign substances cannot penetrate into the core films, and the core films are not brought into contact with other components, whereby optical transmission properties are not changed and brightness can be also enhanced, and since the V-cut grooves are formed or both the V-cut grooves and optical waveguides are formed at the same time by means of a simple hot embossing process, the manufacturing costs can be saved.
摘要:
The present invention relates to a method and an apparatus for structural diagnosis, which generates torsional waves upon a shaft, beam or pipe having arbitrary cross-sections, such as a circular cross-section, and senses existence or location of the cracks through analyzing reflected waves. The present invention provides a magnetostrictive transducer comprising a plurality of ferromagnetic strips attached, around circumference of a member having an arbitrary cross-section with a fixed inclination; a first housing disposed to surround the ferromagnetic strips, the first housing being made of insulating material; and a coil wound around the first housing. The magnetostrictive transducer according to the present invention can generate torsional waves upon a member when a current is supplied to the coil, and can measure reflected torsional waves. Further, the present invention provides an apparatus and a method for structural diagnosis using the magnetostrictive transducer.