Abstract:
An inclined exposure lithography system is disclosed, which comprises: a substrate; a photoresist layer, formed on the substrate; a mask, disposed over the photoresist layer with a gap therebetween; and a refraction element disposed over the mask so that a light beam from a light source is refracted by a specific angle.
Abstract:
The present invention relates to a polarized light emitting diode (LED) device and the method for manufacturing the same, in which the LED device comprises: a base, a light emitting diode (LED) chip, a polarizing waveguide and a packaging material. In an exemplary embodiment, the LED chip is disposed on the base and is configured with a first light-emitting surface for outputting light therefrom; and the waveguide, being comprised of a polarization layer, a reflection layer, a conversion layer and a light transmitting layer, is disposed at the optical path of the light emitted from the LED chip; and the packaging material is used for packaging the waveguide, the LED chip and the base into a package.
Abstract:
An illumination device including a base, at least one LED light source and a first diffusing element is provided. The base has a supporting plane. The LED light source disposed on the supporting plane has a light emitting surface substantially parallel to the supporting plane. The first diffusing element disposed on the supporting plane is a hollow column surrounding the LED light source. An inner diameter width of the first diffusing element is gradually reduced outward from the base. The first diffusing element has a rough surface comprising a plurality of surface structures.
Abstract:
The disclosed is a method for patterning a photoresist layer. An object is provided, a photoresist layer is formed on the object, and an ink pattern is printed on the photoresist layer. Shielded by the ink pattern, the photoresist is exposed and developed to be patterned. In addition, a layered material is optionally formed between the object and the photoresist layer.
Abstract:
A mold structure and the manufacturing method thereof are disclosed. The mold structure is comprised of: an axle; a roller, axially ensheathing the axle; and a mold having a specific imprint pattern of microstructures formed thereon, being arranged to mount on the periphery of the roller while connecting to the axle; wherein a pulling force is exerted on the mold by the axle for stretching the mold while enabling the same to tensely adhere upon the periphery of the roller.
Abstract:
A track type supporting mechanism for supporting at least one machine is disclosed in the present invention. The track type supporting mechanism includes a base, at least one linear guideway disposed on the base, at least one sliding block slidably disposed on the at least one linear guideway, and at least one supporting platform disposed on the at least one sliding block for supporting the at least one machine, so that the at least one machine slides relative to the base via the at least one linear guideway and the at least one sliding block.
Abstract:
A die structure, a manufacturing method and a substrate, wherein the die structure is constituted by a chip on wafer (COW) and the substrate, and the substrate is formed by stacking and then cutting a plurality of thermal and electrical conductive poles and a plurality of insulating material layers. Moreover, the fabricating of the die structure comprises a plurality of COWs carried on a carrier board is bonded on the substrate, the plurality of COWs are in contact with the plurality of thermal and electrical conductive poles on the substrate, and then the carrier board is removed. After that, a phosphor plate is adhered on the plurality of COWs so as to form a stacked structure. Thereafter, the stacked structure is cut, thus forming a plurality of die structures having at least one COW.
Abstract:
A track type supporting mechanism for supporting at least one machine is disclosed in the present invention. The track type supporting mechanism includes a base, at least one linear guideway disposed on the base, at least one sliding block slidably disposed on the at least one linear guideway, and at least one supporting platform disposed on the at least one sliding block for supporting the at least one machine, so that the at least one machine slides relative to the base via the at least one linear guideway and the at least one sliding block.
Abstract:
The present invention relates to a polarized light emitting diode (LED) device and the method for manufacturing the same, in which the LED device comprises: a base, a light emitting diode (LED) chip, a polarizing waveguide and a packaging material. In an exemplary embodiment, the LED chip is disposed on the base and is configured with a first light-emitting surface for outputting light therefrom; and the waveguide, being comprised of a polarization layer, a reflection layer, a conversion layer and a light transmitting layer, is disposed at the optical path of the light emitted from the LED chip; and the packaging material is used for packaging the waveguide, the LED chip and the base into a package.
Abstract:
An optical diffusion structure includes an optical diffusion structure comprising a plurality of convex portions and a plurality of concave portions. Each convex portion is adjacent to a plurality of concave portions and each concave portion is adjacent to a plurality of convex portions. The convex portions, the concave portions and each junction of the convex and concave portions have a curvature different from 0. The optical diffusion structure further includes a diffusion plate having a first surface, wherein the optical diffusion structure is formed on the first surface, and the convex portions are arranged in a two dimensional array along a first direction and a second direction, and the concave portions are arranged in a two dimensional array along a third direction and a fourth direction.