-
11.发明申请公开(公告)号：US20070170940A1
公开(公告)日：2007-07-26
申请号：US11695597
申请日：2007-04-02
Applicant: Richard Chen , Ezekiel Kruglick , Christopher Bang , Dennis Smalley , Pavel Lembrikov
Inventor： Richard Chen , Ezekiel Kruglick , Christopher Bang , Dennis Smalley , Pavel Lembrikov
IPC: G01R31/02
CPC classification number: C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
-
12.发明申请Vertical microprobes for contacting electronic components and method for making such probes 审中-公开用于接触电子部件的垂直微探针和用于制造这种探针的方法公开(公告)号：US20060238209A1
公开(公告)日：2006-10-26
申请号：US11325404
申请日：2006-01-03
Applicant: Richard Chen , Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Kieun Kim , Gang Zhang , Dennis Smalley
Inventor： Richard Chen , Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Kieun Kim , Gang Zhang , Dennis Smalley
IPC: G01R31/02
CPC classification number: G01R3/00 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01R1/06716 , G01R1/06722 , G01R1/06738
Abstract: Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.
Abstract translation: 用于测试或以其他方式与半导体管芯或其他电子部件进行电接触的多层探针结构通过在多个覆盖层和附着层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，结构可以包括旨在增强功能性，可构建性或两者的配置。
-
13.发明申请公开(公告)号：US20050179458A1
公开(公告)日：2005-08-18
申请号：US11028960
申请日：2005-01-03
Applicant: Richard Chen , Ezekiel Kruglick , Christopher Bang , Dennis Smalley , Pavel Lembrikov
Inventor： Richard Chen , Ezekiel Kruglick , Christopher Bang , Dennis Smalley , Pavel Lembrikov
IPC: G01R31/02
CPC classification number: C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
-
公开(公告)号：US20080105355A1
公开(公告)日：2008-05-08
申请号：US11929597
申请日：2007-10-30
Applicant: Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
Inventor： Ananda Kumar , Ezekiel Kruglick , Adam Cohen , Kieun Kim , Gang Zhang , Richard Chen , Christopher Bang , Vacit Arat , Michael Lockard , Uri Frodis , Pavel Lembrikov , Jeffrey Thompson
CPC classification number: G01R3/00 , G01R1/06761 , G01R1/07307 , Y10T29/49002 , Y10T156/10
Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.
Abstract translation: 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。 在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。 一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。 一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。 保留材料可以用作焊接掩模材料。
-
15.发明申请Cantilever Microprobes For Contacting Electronic Components and Methods for Making Such Probes 有权用于接触电子元件的悬臂式微孔和制造这种探针的方法公开(公告)号：US20080100326A1
公开(公告)日：2008-05-01
申请号：US11929666
申请日：2007-10-30
Applicant: Richard Chen , Ezekiel Kruglick , Christopher Bang , Dennis Smalley , Pavel Lembrikov
Inventor： Richard Chen , Ezekiel Kruglick , Christopher Bang , Dennis Smalley , Pavel Lembrikov
IPC: G01R1/067
CPC classification number: C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及悬臂式探针结构的各种设计。 一些实施例涉及制造这种悬臂结构的方法。 在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗 能力和/或类似物。
-
Patent Agency Ranking
公开(公告)号：US20060053625A1
公开(公告)日：2006-03-16
申请号：US11177798
申请日：2005-07-07
Applicant: Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard , Christopher Bang
Inventor： Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard , Christopher Bang
CPC classification number: G01R3/00 , C25D1/003 , G01R1/073 , Y10T29/49204 , Y10T29/49222
Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。
-
公开(公告)号：US20060006888A1
公开(公告)日：2006-01-12
申请号：US10949738
申请日：2004-09-24
Applicant: Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Dennis Smalley , Kieun Kim , Richard Chen , Gang Zhang
Inventor： Ezekiel Kruglick , Christopher Bang , Vacit Arat , Adam Cohen , Dennis Smalley , Kieun Kim , Richard Chen , Gang Zhang
IPC: G01R31/02
CPC classification number: G01R1/06716 , G01R1/0483 , G01R1/06733 , G01R1/06744 , G01R1/07357 , G01R31/2886
Abstract: Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.
Abstract translation: 用于测试半导体管芯的多层探针结构通过多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，结构可以包括大致螺旋形构造，当探针从衬底向外延伸，波纹管状构造等时具有窄半径的螺旋形构造。 在一些实施例中，提供了多个探针的阵列。
-
18.发明申请Complex microdevices and apparatus and methods for fabricating such devices 有权复杂的微型装置以及用于制造这种装置的装置和方法公开(公告)号：US20050221529A1
公开(公告)日：2005-10-06
申请号：US11139391
申请日：2005-05-27
Applicant: Christopher Bang , Adam Cohen , Michael Lockard , John Evans
Inventor： Christopher Bang , Adam Cohen , Michael Lockard , John Evans
CPC classification number: H02N1/008 , B33Y10/00 , B81C1/0019 , C25D1/003
Abstract: Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB™).
Abstract translation: 本发明的各种实施例涉及包括传感器，致动器，阀，扫描反射镜，加速度计，开关等的各种微型装置。 在一些实施例中，通过电化学制造（EFAB TM）形成器件。
-
19.发明申请Electrochemical fabrication method for producing compliant beam-like structures 审中-公开用于生产符合梁状结构的电化学制造方法公开(公告)号：US20050053849A1
公开(公告)日：2005-03-10
申请号：US10883891
申请日：2004-07-02
Applicant: Adam Cohen , Michael Lockard , Christopher Bang , Marvin Kilgo
Inventor： Adam Cohen , Michael Lockard , Christopher Bang , Marvin Kilgo
Abstract: Embodiments of the invention are directed to the formation of beam-like structures using electrochemical fabrication techniques where the beam like structures have narrow regions and wider regions such that a beam of desired compliance is obtained. In some embodiments, narrower regions of the beam are thinner than a minimum feature size but are formable as a result of the thicker regions. In some embodiments the beam-like structures are formed from a plurality of adhered layers.
Abstract translation: 本发明的实施例涉及使用电化学制造技术形成束状结构，其中束状结构具有窄区域和较宽区域，使得获得所需柔性束。 在一些实施例中，光束的较窄区域比最小特征尺寸更薄，但是由于较厚的区域而可形成。 在一些实施例中，束状结构由多个粘附层形成。
-
公开(公告)号：US20080108221A1
公开(公告)日：2008-05-08
申请号：US11931308
申请日：2007-10-31
Applicant: Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard , Christopher Bang
Inventor： Kieun Kim , Adam Cohen , Willa Larsen , Richard Chen , Ananda Kumar , Ezekiel Kruglick , Vacit Arat , Gang Zhang , Michael Lockard , Christopher Bang
IPC: H01L21/44
Abstract: Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
Abstract translation: 本发明的实施例涉及形成具有各种构造的微探针尖元件。 在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。 在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。 探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制， 由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。
-
-
-
-
-
-
-
-
-
Search Results
25
records
(took 0.027 seconds)
