公开(公告)号：US08808800B2

公开(公告)日：2014-08-19

申请号：US13409950

申请日：2012-03-01

申请人： Ananda H. Kumar ,  Jorge Sotelo Albarran ,  Adam L. Cohen ,  Kieun Kim ,  Michael S. Lockard ,  Uri Frodis ,  Dennis R. Smalley

发明人： Ananda H. Kumar ,  Jorge Sotelo Albarran ,  Adam L. Cohen ,  Kieun Kim ,  Michael S. Lockard ,  Uri Frodis ,  Dennis R. Smalley

IPC分类号： B05D3/00

CPC分类号： B81C1/00666 ,  C25D5/022

摘要： Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

摘要翻译： 用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组，它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。

公开(公告)号：US07524427B2

公开(公告)日：2009-04-28

申请号：US11029218

申请日：2005-01-03

申请人： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

发明人： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

IPC分类号： B81C1/00

CPC分类号： C25D1/003 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1653 ,  C25D5/022 ,  C25D5/10

摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US07517462B2

公开(公告)日：2009-04-14

申请号：US11029014

申请日：2005-01-03

申请人： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

发明人： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

IPC分类号： B81C1/00

CPC分类号： B44C1/22 ,  B33Y10/00 ,  B81C1/00492 ,  C03C15/00 ,  C03C25/68 ,  C23C18/1605 ,  C23C18/161 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/405 ,  C23F1/00 ,  C25D1/003 ,  C25D5/02 ,  C25D5/10 ,  H01L21/2885 ,  H01L21/44 ,  H01L21/4763 ,  H01L21/76885

摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

摘要翻译： 本发明的一些实施例涉及在电介质或部分电介质基底上建立单层或多层结构的技术。 某些实施方案将种子层材料直接沉积到基底材料上，而其它实施例使用中间粘合层材料。 一些实施例使用不同种子层材料和/或用于牺牲和结构导电建筑材料的粘合层材料。 一些实施例将种子层和/或粘合层材料应用于有选择性的方式，而其它实施例以毯子的方式应用材料。 一些实施例通过平面化操作去除外来沉积物（例如沉积到不想要形成层的一部分的区域），而其他实施例通过蚀刻操作去除外来材料。 其它实施方案涉及使用至少一种导电结构材料，至少一种导电牺牲材料和至少一种电介质材料形成的多层中尺度或微结构结构的电化学制造。 在一些实施方案中，电介质材料是可UV固化的光聚合物。

公开(公告)号：US20080105355A1

公开(公告)日：2008-05-08

申请号：US11929597

申请日：2007-10-30

申请人： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

发明人： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

IPC分类号： B32B37/00 ,  B23K31/02

CPC分类号： G01R3/00 ,  G01R1/06761 ,  G01R1/07307 ,  Y10T29/49002 ,  Y10T156/10

摘要： Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

摘要翻译： 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。 在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。 一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。 一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。 保留材料可以用作焊接掩模材料。

公开(公告)号：US20050202180A1

公开(公告)日：2005-09-15

申请号：US11029165

申请日：2005-01-03

申请人： Adam Cohen ,  Uri Frodis ,  Michael Lockard ,  Ananda Kumar ,  Gang Zhang ,  Dennis Smalley

发明人： Adam Cohen ,  Uri Frodis ,  Michael Lockard ,  Ananda Kumar ,  Gang Zhang ,  Dennis Smalley

IPC分类号： B05D1/38 ,  C08K3/00 ,  C25D3/30 ,  C25D3/38 ,  C25D3/48 ,  C25D5/02 ,  C25D5/10 ,  C25D21/12 ,  H01L21/288 ,  H01L21/301 ,  H01L21/302 ,  H01L21/4763 ,  H01L21/768

CPC分类号： C25D5/48 ,  B33Y10/00 ,  B81C1/00492 ,  B81C99/0065 ,  B81C2201/0104 ,  B81C2201/0197 ,  C25D1/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76885 ,  Y10T156/1052

摘要： Electrochemical fabrication methods for forming single and multilayer mesoscale and microscale structures are disclosed which include the use of diamond machining (e.g. fly cutting or turning) to planarize layers. Some embodiments focus on systems of sacrificial and structural materials which are useful in Electrochemical fabrication and which can be diamond machined with minimal tool wear (e.g. Ni—P and Cu, Au and Cu, Cu and Sn, Au and Cu, Au and Sn, and Au and Sn—Pb), where the first material or materials are the structural materials and the second is the sacrificial material). Some embodiments focus on methods for reducing tool wear when using diamond machining to planarize structures being electrochemically fabricated using difficult-to-machine materials (e.g. by depositing difficult to machine material selectively and potentially with little excess plating thickness, and/or pre-machining depositions to within a small increment of desired surface level (e.g. using lapping or a rough cutting operation) and then using diamond fly cutting to complete he process, and/or forming structures or portions of structures from thin walled regions of hard-to-machine material as opposed to wide solid regions of structural material.

摘要翻译： 公开了用于形成单层和多层中尺度和微结构的电化学制造方法，其包括使用金刚石加工（例如飞切或车削）来平坦化层。 一些实施例集中于可用于电化学制造的牺牲和结构材料的系统，并且可以以最小的工具磨损（例如Ni-P和Cu，Au和Cu，Cu和Sn，Au和Cu，Au和Sn， 和Au和Sn-Pb），其中第一材料或材料是结构材料，第二材料是牺牲材料）。 一些实施例着重于在使用金刚石加工以平面化使用难以加工的材料进行电化学制造的结构（例如，通过沉积难以机械材料选择性且潜在地具有少量多余电镀厚度和/或预加工沉积 到所需表面水平的小增量（例如使用研磨或粗切割操作），然后使用金刚石飞切切割来完成其加工，和/或从硬质材料的薄壁区域形成结构或部分结构 而不是结构材料的宽固体区域。

公开(公告)号：US6049421A

公开(公告)日：2000-04-11

申请号：US009269

申请日：1998-01-20

申请人： Ryan S. Raz ,  Uri Frodis ,  Duncan A. Newman

发明人： Ryan S. Raz ,  Uri Frodis ,  Duncan A. Newman

IPC分类号： G02B21/00 ,  G02B21/26 ,  G02B21/34 ,  G02B21/36

CPC分类号： G02B21/34 ,  G02B21/002 ,  G02B21/26

摘要： A system is provided for the automated imaging of a succession of microscope slides (S). The slides are mounted in carriers and loaded into cassettes. Slide carriers from a first cassette in a slide loader (2) are ejected from the cassette into a loading station and thence moved by an actuator onto a stage beneath a microscope objective (6) which images a sub-area of a circular sample area on the slide onto an imaging sensor (10) whence images are digitized and stored. The stage (4) is conjointly rotated by a motor (22) as a carrier (24) for the stage is moved linearly, so as to execute a spiral scan of sub-areas of the sample area which sub-areas are successively imaged using a strobe lamp (12) to illuminate the sample area at intervals during the scan determined by signals from an encoder (25). A preliminary scan, which may be in an opposite direction along the spiral, may be used to obtain, for a focus actuator (18), focusing data used during the scan. As a following slide carrier is loaded onto the stage for scanning, the previous slide carrier is ejected into a chute from which an actuator inserts it into a further cassette in the same orientation in which it left the first cassette.

摘要翻译： 提供了一系列用于一系列显微镜幻灯片（S）的自动成像的系统。 载玻片安装在载体中并装入盒中。 从滑块装载机（2）中的第一盒中滑动载架从盒子中弹出到装载站，然后由致动器移动到显微镜物镜（6）下方的台上，该显微镜物镜将圆形样品区域的子区域成像 将图像数字化并存储在成像传感器（10）上。 通过电动机（22）将载物台（4）作为载体（24）共同旋转，使载物台线性地移动，从而对采样区域的子区域进行螺旋扫描，该子区域依次成像，使用 频闪灯（12），用于在由来自编码器（25）的信号确定的扫描期间间隔照射样品区域。 可以使用沿着螺旋沿相反方向的初步扫描，以获得聚焦致动器（18）在扫描期间使用的聚焦数据。 由于以下滑动载体被装载到载物台上用于扫描，所以先前的滑动载体被弹出到滑槽中，致动器将滑动载架从其从其从离开第一盒的相同方向插入到另一盒中。

公开(公告)号：US08382423B1

公开(公告)日：2013-02-26

申请号：US12168787

申请日：2008-07-07

申请人： Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

发明人： Uri Frodis ,  Adam L. Cohen ,  Michael S. Lockard

IPC分类号： F04D1/08

CPC分类号： A61B17/32002 ,  A61B17/22012 ,  A61B17/3201 ,  A61B17/320758 ,  A61B2017/00345 ,  A61B2017/00526 ,  A61B2017/00539 ,  A61B2017/00544 ,  A61B2017/00553 ,  A61B2017/320775

摘要： Embodiments are directed to micro-scale or meso-scale devices having hydraulic or pneumatic actuation mechanisms incorporating bearings elements (such as ball bearings, cylindrical bearings, interference bearings, or hydrostatic bearings. Devices of some embodiments are turbines. Some devices may function as medical devices. Other embodiments are directed to multi-layer, multi-material electrochemical fabrication methods for producing such devices.

摘要翻译： 实施例涉及具有包括轴承元件（例如球轴承，圆柱形轴承，干涉轴承或静压轴承）的液压或气动致动机构的微尺度或中尺度装置，一些实施例的装置是涡轮机，一些装置可以用作医疗 其他实施例涉及用于制造这种装置的多层多材料电化学制造方法。

公开(公告)号：US20110315556A1

公开(公告)日：2011-12-29

申请号：US13206133

申请日：2011-08-09

申请人： Adam L. Cohen ,  Jill R. Thomassian ,  Michael S. Lockard ,  Marvin M. Kilgo, III ,  Uri Frodis ,  Dennis R. Smalley

发明人： Adam L. Cohen ,  Jill R. Thomassian ,  Michael S. Lockard ,  Marvin M. Kilgo, III ,  Uri Frodis ,  Dennis R. Smalley

IPC分类号： C25D5/02

CPC分类号： C25D1/003 ,  C25D1/00 ,  C25D1/20 ,  C25D5/02 ,  C25D5/022 ,  C25D5/10 ,  C25D5/14 ,  C25D5/48 ,  C25D5/50

摘要： Numerous electrochemical fabrication methods and apparatus are provided for producing multi-layer structures (e.g. having meso-scale or micro-scale features) from a plurality of layers of deposited materials using adhered masks (e.g. formed from liquid photoresist or dry film), where two or more materials may be provided per layer where at least one of the materials is a structural material and one or more of any other materials may be a sacrificial material which will be removed after formation of the structure. Materials may comprise conductive materials that are electrodeposited or deposited in an electroless manner. In some embodiments special care is undertaken to ensure alignment between patterns formed on successive layers.

摘要翻译： 提供了多种电化学制造方法和装置，用于使用粘附的掩模（例如由液体光致抗蚀剂或干膜形成）从多层沉积材料制备多层结构（例如具有中尺度或微尺度特征），其中两个 或者可以在每层中提供更多的材料，其中至少一种材料是结构材料，并且任何其它材料中的一种或多种可以是在形成结构之后被去除的牺牲材料。 材料可以包括以无电解方式电沉积或沉积的导电材料。 在一些实施例中，特别注意确保在连续层上形成的图案之间的对准。

公开(公告)号：US06951456B2

公开(公告)日：2005-10-04

申请号：US10630513

申请日：2003-07-29

申请人： Adam L. Cohen ,  Paul D. Ronney ,  Uri Frodis ,  Lars Sitzki ,  Eckart H. Meiburg ,  Steffen Wussow

发明人： Adam L. Cohen ,  Paul D. Ronney ,  Uri Frodis ,  Lars Sitzki ,  Eckart H. Meiburg ,  Steffen Wussow

IPC分类号： F23D14/66 ,  F28D9/04 ,  H01L35/00 ,  H01L35/16 ,  H01L35/30 ,  H01L35/32 ,  H02N11/00 ,  F23D14/02

CPC分类号： F28D9/04 ,  F23C3/00 ,  F23C2900/03001 ,  F23M2900/13003 ,  F28F2260/02 ,  H01L35/00 ,  H01L35/30 ,  Y10T428/31504

摘要： A generally toroidal counterflow heat exchanger is the main element of a combustor that operates at a micro scale. The combustor includes a central combustion region with openings to a reactant gas channel and an exhaust gas channel. The reactant channel and exhaust channels are coiled around each other in a spiral configuration that reduces heat loss. An electric current microgenerator is similar and also includes a thermoelectric active wall composed of n-type and p-type thermoelectric elements as part of a channel wall of the microcombustor. The thermoelectric active wall includes fins configured to increase the temperature differential across the thermoelectric elements relative to the temperature difference between the thermoelectric elements and the reactant and exhaust gases. A method of monolithically fabricating such microdevices by electrodepositing multiple layers of material is also provided.

摘要翻译： 大致环形逆流热交换器是以微观尺度工作的燃烧器的主要元件。 燃烧器包括具有到反应气体通道和排气通道的开口的中心燃烧区域。 反应物通道和排气通道以螺旋构造彼此卷绕，从而减少热损失。 电流微发电机是类似的，并且还包括由作为微型燃烧器的通道壁的一部分的n型和p型热电元件组成的热电活性壁。 热电活性壁包括翅片，其构造成相对于热电元件和反应物和废气之间的温差增加跨热电元件的温差。 还提供了通过电沉积多层材料来整体地制造这种微器件的方法。

公开(公告)号：US20050199583A1

公开(公告)日：2005-09-15

申请号：US11029218

申请日：2005-01-03

申请人： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

发明人： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

IPC分类号： B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  C25D5/02 ,  C25D5/10 ,  H01L21/44 ,  H01L21/4763

CPC分类号： C25D1/003 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/1653 ,  C25D5/022 ,  C25D5/10

摘要： Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.