Abstract:
In an exemplary embodiment, a fin active region is protruded along one direction from a bulk silicon substrate on which a shallow trench insulator is entirely formed so as to cover the fin active region. The shallow trench insulator is removed to selectively expose an upper part and sidewall of the fin active region, along a line shape that at least one time crosses with the fin active region, thus forming a trench. The fin active region is exposed by the trench and thereon a gate insulation layer is formed. Thereby, productivity is increased and performance of the device is improved. A fin FET employs a bulk silicon substrate of which a manufacturing cost is lower than that of a conventional SOI type silicon substrate. Also, a floating body effect can be prevented, or is substantially reduced.
Abstract:
A fin field effect transistor (FinFET) includes a substrate, a fin, a gate electrode, a gate insulation layer, and source and drain regions in the fin. The fin is on and extends laterally along and vertically away from the substrate. The gate electrode covers sides and a top of a portion of the fin. The gate insulation layer is between the gate electrode and the fin. The source region and the drain region in the fin and adjacent to opposite sides of the gate electrode. The source region of the fin has a different width than the drain region of the fin.
Abstract:
The present invention relates to bisphenyl-2,3,5,6-tetrafluoro-4-trifluoromethylphenylphosphine oxide compounds and synthesis thereof, more particularly to novel bisphenyl-2,3,5,6-tetrafluoro-4-trifluoromethylphenylphosphine oxide compounds having both a perfluorinated benzene substituent and a phosphine oxide moiety. Compounds of the invention can be useful as a monomer for preparing polyimides having a low dielectric constant and a superior adhesion while maintaining the superior thermal and mechanical properties of polyimides themselves, and their synthesis thereof.
Abstract:
Methods of forming field effect transistors (FETs) having fin-shaped active regions include patterning a semiconductor substrate to define a fin-shaped semiconductor active region therein, which is surrounded by a trench. At least an upper portion of the fin-shaped semiconductor active region is covered with a sacrificial layer. This sacrificial layer is selectively etched-back to define sacrificial spacers on sidewalls of the fin-shaped semiconductor active region. The electrically insulating region is formed on the sacrificial spacers. The sacrificial spacers are then removed by selectively etching the sacrificial spacers using the electrically insulating region as an etching mask. An insulated gate electrode is then formed on the sidewalls of the fin-shaped semiconductor active region.
Abstract:
A liquid crystal display device includes a backlight unit having a lamp, wherein the lamp includes opposing ends and electrodes at respective ones of the opposing ends; at least one thermoelectric device operably proximate to the lamp; and a liquid crystal (LC) panel over the backlight unit. Each thermoelectric device includes a hot junction disposed near the lamp; a cold junction spaced apart from the hot junction and disposed farther from the lamp than the hot junction; two different thermoelectric materials between the hot and cold junctions, wherein the two different thermoelectric materials are spaced from each other and wherein opposing ends of each of the different thermoelectric materials contact the hot and cold junctions; and first and second wires connected to respective ones of the two different thermoelectric materials.
Abstract:
The present invention provides an apparatus for transmitting/receiving information for digital multimedia broadcast (DMB) service and method thereof, by which data required for decoding is transmitted fast and by which the received data is facilitated to be quickly decoded. The present invention includes coding a service information including at least one of a simplified PAT (program association table), a modified PMT (program map table), a modified IOD (initial object descriptor), and an ES (elementary stream) descriptor into a FIC (fast information channel) structure and performing interleaving and error correction on an audio/video signal to code into an MSC (main service channel) structure, multiplexing the FIC-coded service information, the MSC-coded audio/video signal, and data, modulating the multiplexed signal, and converting the modulated signal to an RF (radio frequency) band signal to transmit.
Abstract:
A polycrystalline semiconductor layer is formed on a cell active region and a peripheral active region of a substrate. A buried gate electrode is formed in the substrate in the cell active region at a level below the polycrystalline semiconductor layer after forming the polycrystalline semiconductor layer. A gate electrode is formed on the substrate in the peripheral active region from the polysilicon semiconductor layer after forming the buried gate electrode.
Abstract:
Semiconductor memory devices include a semiconductor substrate and a plurality of semiconductor material pillars in a spaced relationship on the semiconductor substrate. Respective surrounding gate electrodes surround ones of the pillars. A first source/drain region is in the semiconductor substrate between adjacent ones of the pillars and a second source/drain region is in an upper portion of at least one of the adjacent pillars. A buried bit line is in the first source/drain region and electrically coupled to the first source/drain region and a storage node electrode is on the upper portion of the at least one of the adjacent pillars and electrically contacting with the second source/drain region.