Abstract:
A first non-volatile memory may store first data and a second non-volatile memory may store second data. An authentication component may be coupled with the first non-volatile memory and the second non-volatile memory and may receive a request to perform an authentication operation. In response to the request to perform the authentication operation, the authentication component may access the first data stored at the first non-volatile memory and the second data stored at the second non-volatile memory and determine whether the second data stored at the second non-volatile memory has become unreliable based on a memory disturbance condition. In response to determining that the second data stored at the second non-volatile memory has become unreliable, a corrective action associated with the first data stored at the first non-volatile memory may be performed.
Abstract:
A first non-volatile memory may store first data and a second non-volatile memory may store second data. An authentication component may be coupled with the first non-volatile memory and the second non-volatile memory and may receive a request to perform an authentication operation. In response to the request to perform the authentication operation, the authentication component may access the first data stored at the first non-volatile memory and the second data stored at the second non-volatile memory and determine whether the second data stored at the second non-volatile memory has become unreliable based on a memory disturbance condition. In response to determining that the second data stored at the second non-volatile memory has become unreliable, a corrective action associated with the first data stored at the first non-volatile memory may be performed.
Abstract:
A camouflage circuit instantiated on a semiconductor substrate includes a transient-comparison circuit that briefly expresses a value representative of either a one or a zero in dependence upon reference elements that are visibly indistinct from a perspective normal to the planar surface substrate surface, but that nevertheless exhibit distinct electrical responses. Transient comparisons that define logic states only briefly vastly complicate the use of reverse-engineering tools and techniques that rely on optical stimulation to sense when transistors are on or off.
Abstract:
A request to perform a memory operation addressed to a first address corresponding to a first logical unit of logical units of a memory is received. Address mask data that corresponds to the logical units is identified. Multiple transformed addresses are determined using the first address and the address mask data. The transformed addresses can include a target address corresponding to the first logical unit and additional addresses corresponding to other logical units. The memory operation is performed at the target address corresponding to the first logical unit and dummy memory operations are performed at the additional addresses corresponding to the additional logical units.
Abstract:
A pattern detector circuit is provided in a security chip, wherein the pattern detector circuit monitors accesses of a plurality of configuration registers, each of the plurality of configuration registers having a corresponding address. In response to receiving from a host a predefined sequence of accesses of the plurality of configuration registers for one or more operations to the plurality of configuration registers, a processor in the pattern detector circuit determines a value indicative of a current version of a netlist for the security chip. The determined value is made available to be obtained by a read operation by the host at a specific configuration register address.
Abstract:
A resistor mesh with distributed sensing points is provided in a security chip as an anti-tamper shield. An analog multiplexing circuit is configured to receive a pair of digital selection values created by an algorithm processing circuit, and produce a respective differential voltage formed by a pair of voltages obtained at a pair of selected sensing points within the resistor mesh corresponding to the pair of digital selection values. Each differential voltage is converted into a corresponding digital output value. An algorithm processing circuit is configured to receive a respective digital output value associated with each pair of digital selection values and derive a binary value based on a subset of the digital output values, wherein the binary value is unique to the security chip.
Abstract:
A physically unclonable function circuit (PUF) is used to generate a fingerprint value based on the uniqueness of the physical characteristics (e.g., resistance, capacitance, connectivity, etc.) of a tamper prevention (i.e., shielding) structure that includes through-silicon vias and metallization on the backside of the integrated circuit. The physical characteristics depend on random physical factors introduced during manufacturing. This causes the chip-to-chip variations in these physical characteristics to be unpredictable and uncontrollable which makes more difficult to duplicate, clone, or modify the structure without changing the fingerprint value. By including the through-silicon vias and metallization on the backside of the integrated circuit as part of the PUF, the backside of the chip can be protected from modifications that can be used to help learn the secure cryptographic keys and/or circumvent the secure cryptographic (or other) circuitry.
Abstract:
The embodiments herein are directed to technologies for backside security meshes of semiconductor packages. One package includes a substrate having a first interconnect terminal of a first type and a second interconnect terminal of a second type. The package also includes a first security mesh structure disposed on a first side of an integrated circuit die and a conductive path coupled between the first interconnect terminal and the second interconnect terminal. The first security mesh structure is coupled to the first interconnect terminal and the second interconnect terminal being coupled to a terminal on a second side of the integrated circuit die.
Abstract:
A value corresponding to a physical variation of a device may be received. Furthermore, helper data associated with the physical variation of the device may be received. A result data may be generated based on a combination of the value corresponding to the physical variation of the device and the helper data. An error correction operation may be performed on the result data to identify one or more code words associated with the error correction operation. Subsequently, a target data may be generated based on the one or more code words.
Abstract:
The embodiments described herein describe technologies of self-timed pattern generators. The self-timed pattern generators can be used to form a random number generator to generate a random digital value. Asynchronous digital logic in a first generator asynchronously updates a next state based on a current state, a second state of a second generator that is before the first generator in the chain or ring topology, and a third state of a third generator that is after the first generator in the chain or ring topology. The self-timed pattern generators are to output a random digital value based at least in part on the current state output from the first generator.