摘要:
A transistor (50) comprising a gate conductor (68) and a gate insulator (66) separating the gate conductor from a semiconductor material (64) having a first conductivity type. The transistor further comprises a drain region (782) having the first conductivity type. The transistor further comprises an angular implanted region (70) having a second conductivity type complementary of the first conductivity type and having an angular implanted region edge (70a) underlying the gate conductor, and the transistor includes a source region (781) formed at least in part within the angular implanted region. Finally, a transistor channel (74) is defined between an edge (71a) of the source region proximate the gate conductor and the angular implanted region edge (70a) underlying the gate conductor.
摘要:
An intergrated circuit drain extension transistor for sub micron CMOS processes. A transistor gate (40) is formed over a CMOS n-well region (80) and a CMOS p-well region (70) in a silicon substrate (10). Transistor source regions (50), (140) and drain regions (55), (145) are formed in the various CMOS well regions to form drain extension transistors where the CMOS well regions (70), (80) serve as the drain extension regions of the transistor.
摘要:
A RESURF LDMOS transistor (64) includes a RESURF region (42) that is self-aligned to a LOCOS field oxide region (44). The self-alignment produces a stable breakdown voltage BVdss by eliminating degradation associated with geometric misalignment and process tolerance variation.