公开(公告)号：US20060214292A1

公开(公告)日：2006-09-28

申请号：US11087180

申请日：2005-03-22

申请人： Sairam Agraharam ,  Carlton Hanna ,  Dongming He ,  Vasudeva Atluri ,  Debendra Mallik ,  Matthew Escobido ,  Sujit Sharan

发明人： Sairam Agraharam ,  Carlton Hanna ,  Dongming He ,  Vasudeva Atluri ,  Debendra Mallik ,  Matthew Escobido ,  Sujit Sharan

IPC分类号： H01L23/48

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/13 ,  H01L2224/13017 ,  H01L2224/13099 ,  H01L2224/16058 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05099

摘要： In one embodiment, the invention provides a method comprising fabricating a die bump on a die, the die bump being shaped and dimensioned to at least reduce the flow of solder material used, to attach the die bump to a package substrate, towards an under bump metallurgy (UBM) layer located below the die bump. Advantageously, the method may comprise performing a substrate reflow operation to attach the package substrate to the die bump, without performing a separate wafer reflow operation to reflow the die bump.

公开(公告)号：US06989586B2

公开(公告)日：2006-01-24

申请号：US10403313

申请日：2003-03-31

申请人： Sairam Agraharam ,  Carlton Hanna ,  Vasudeva Atluri ,  Dongming He

发明人： Sairam Agraharam ,  Carlton Hanna ,  Vasudeva Atluri ,  Dongming He

IPC分类号： H01L23/02

CPC分类号： H05K1/111 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/13 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/16225 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/30105 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： Mechanical stresses are reduced between an electronic component having relatively low fracture toughness and a substrate having relatively greater fracture toughness. In an embodiment, the component may be a die having mounting contacts formed of a low yield strength material, such as solder. A package substrate has columnar lands formed of a relatively higher yield strength material, such as copper, having a relatively higher melting point than the component contacts and having a relatively high current-carrying capacity. The component contacts may be hemispherical in shape. The lands may be substantially cylinders, truncated cones or pyramids, inverted truncated cones or pyramids, or other columnar shapes. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

摘要翻译： 具有较低断裂韧性的电子部件和具有相对较大断裂韧性的基材之间的机械应力降低。 在一个实施例中，组件可以是具有由低屈服强度材料（例如焊料）形成的安装触点的模具。 封装衬底具有由相对较高屈服强度的材料（例如铜）形成的柱状焊盘，其具有比部件接触更高的熔点并且具有相对高的载流能力。 部件触点的形状可以是半球形。 土地可以是基本上圆柱体，截头圆锥体或棱锥体，倒置的锥形锥体或棱锥体，或其他柱状形状。 还描述了制造方法以及将包装应用于电子组件和电子系统。

公开(公告)号：US20050266613A1

公开(公告)日：2005-12-01

申请号：US11173585

申请日：2005-06-30

申请人： Sairam Agraharam ,  Carlton Hanna ,  Vasudeva Atluri ,  Dongming He

发明人： Sairam Agraharam ,  Carlton Hanna ,  Vasudeva Atluri ,  Dongming He

IPC分类号： H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K1/111 ,  H01L23/49811 ,  H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/13 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/13099 ,  H01L2224/13109 ,  H01L2224/16225 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/30105 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： Mechanical stresses are reduced between an electronic component having relatively low fracture toughness and a substrate having relatively greater fracture toughness. In an embodiment, the component may be a die having mounting contacts formed of a low yield strength material, such as solder. A package substrate has columnar lands formed of a relatively higher yield strength material, such as copper, having a relatively higher melting point than the component contacts and having a relatively high current-carrying capacity. The component contacts may be hemispherical in shape. The lands may be substantially cylinders, truncated cones or pyramids, inverted truncated cones or pyramids, or other columnar shapes. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

摘要翻译： 具有较低断裂韧性的电子部件和具有相对较大断裂韧性的基材之间的机械应力降低。 在一个实施例中，组件可以是具有由低屈服强度材料（例如焊料）形成的安装触点的模具。 封装衬底具有由相对较高屈服强度的材料（例如铜）形成的柱状焊盘，其具有比部件接触更高的熔点并且具有相对高的载流能力。 部件触点的形状可以是半球形。 土地可以是基本上圆柱体，截头圆锥体或棱锥体，倒置的锥形锥体或棱锥体，或其他柱状形状。 还描述了制造方法以及将包装应用于电子组件和电子系统。