公开(公告)号：US20160254218A1

公开(公告)日：2016-09-01

申请号：US15051852

申请日：2016-02-24

Applicant: DELTA ELECTRONICS,INC.

Inventor： Shouyu HONG ,  Kai LU ,  Zhenqing ZHAO

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L21/78

CPC classification number: H01L21/565 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/97 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/85

Abstract: The disclosure discloses a packaging module of a power converting circuit and a method for manufacturing the same. The packaging module of the power converting circuit includes a substrate, a molding layer and a plurality of pins. A power device is assembled at the substrate, a plurality of pins electrically are coupled to the power device, the molding layer covers the surface of the substrate with the power device, and at least a contact surface of the pins configured to electrically connect an external circuit is exposed. The molding layer includes a main hat-body part and a hat-brim part, the main hat-body part and the hat-brim part form a hat-shaped molding layer, and the hat-brim part is used to increase a creepage distance between the contact surfaces of the pins located at the top of the molding layer and the bottom of the substrate.

Abstract translation: 本公开公开了一种功率转换电路的封装模块及其制造方法。 电力转换电路的封装模块包括基板，成形层和多个销。 功率器件组装在衬底上，多个引脚电连接到功率器件，成型层用功率器件覆盖衬底的表面，并且至少一个引脚的接触表面被配置为电连接外部 电路暴露。 成型层包括主帽体部和帽帽部，主帽体部和帽帽部形成帽状成型层，帽帽部用于增加爬电距离 位于模制层顶部的销的接触表面与基底的底部之间。

公开(公告)号：US20190304882A1

公开(公告)日：2019-10-03

申请号：US16258747

申请日：2019-01-28

Applicant: Delta Electronics,Inc.

Inventor： Shouyu HONG ,  Haibin XU ,  Wei CHENG ,  Tao WANG ,  Zhenqing ZHAO

IPC: H01L23/495 ,  H01L21/48

Abstract: The present disclosure relates to a power module and a manufacturing method thereof. The power module includes: a group of switch elements, a molding part and a connector. The group of switch elements includes at least one pair of switch elements. The molding part molds the group of switch elements. The connector includes a signal terminal and a power terminal respectively electrically connected to the signal end and power end of the group of switch elements, and both fanned out from the molding part. The power terminal includes a positive power terminal, a negative power terminal and an output power terminal. The positive power terminal and the negative power terminal are respectively a first metal layer and a second metal layer which are at least partially stacked, and an insulating layer is disposed between the first metal layer and the second metal layer.

公开(公告)号：US20190261531A1

公开(公告)日：2019-08-22

申请号：US16404854

申请日：2019-05-07

Applicant: Delta Electronics,Inc.

Inventor： Le LIANG ,  Zhenqing ZHAO

IPC: H05K7/14 ,  H01L25/07

Abstract: A method for manufacturing a stack structure comprises: providing a lead frame having a metal frame, at least two metal plate portions and a plurality of connection ribs, the connection ribs each comprises a first end, a second end and a connection portion; directly mounting electronic components for constructing two modules on the metal plate portions; packaging the electronic components of the first module, the first ends of the metal connection components which are electrically connected to the first module and the first ends of the part of the connection ribs which are electrically connected to the first module are packaged therein; removing the metal frame and part or whole of the connection ribs, the remaining connection ribs forms pins; and bending the metal connection component so that the two modules connected by the metal connection components are stacked one upon the other, to form the stack structure.

公开(公告)号：US20180124922A1

公开(公告)日：2018-05-03

申请号：US15720062

申请日：2017-09-29

Applicant: Delta Electronics, Inc.

Inventor： Pengkai JI ,  Shouyu HONG ,  Zhenqing ZHAO ,  Jianhong Zeng

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H05K3/40 ,  H01L23/28

CPC classification number: H01L23/3121 ,  H01L21/561 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49811 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40

Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.

公开(公告)号：US20160300777A1

公开(公告)日：2016-10-13

申请号：US15094038

申请日：2016-04-08

Applicant: DELTA ELECTRONICS,INC.

Inventor： Shouyu HONG ,  Yanlin CHEN ,  Zhenqing ZHAO

IPC: H01L23/373 ,  H01L23/367

CPC classification number: H01L23/3733 ,  H01L23/3737 ,  H01L2224/0603 ,  H01L2224/4846

Abstract: A power module and a thermal interface structure are provided herein. The thermal interface structure includes: a base and a plurality of filler particles distributed in the base. When the filler particles are under pressure, at least a part of the filler particles are deformed, and at least two adjacent filler particles partially contact with each other to form a heat-conducting path for transferring heat.

Abstract translation: 本文提供了功率模块和热接口结构。 热界面结构包括：基底和分散在基底中的多个填料颗粒。 当填料颗粒处于压力下时，填料颗粒的至少一部分变形，并且至少两个相邻的填料颗粒彼此部分接触以形成用于传递热量的导热路径。

公开(公告)号：US20160118177A1

公开(公告)日：2016-04-28

申请号：US14879263

申请日：2015-10-09

Applicant: DELTA ELECTRONICS, INC.

Inventor： Haibin XU ,  Tao WANG ,  Shouyu HONG ,  Zhenqing ZHAO ,  Yicong XIE ,  Zengsheng WANG

IPC: H01F27/24 ,  H01F27/28 ,  H01F41/02

CPC classification number: H01F3/14 ,  H01F27/2804

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.

Abstract translation: 提供了磁芯部件及其间隙控制方法。 磁芯部件包括第一磁性部件，第二磁性部件和设置在它们之间的第一间隙控制结构。 第一间隙控制结构包括触变材料并施加在第一磁性部件上并固化，第二磁性部件设置在固化的第一间隙控制结构上，第一磁性部件和第二磁性部件之间的间隙由 第一间隙控制结构的有效高度。 间隙控制结构在固化后具有最小的可变性，并且其有效高度可以始终保持在所需的间隙高度。