公开(公告)号：US20160254217A1

公开(公告)日：2016-09-01

申请号：US14918837

申请日：2015-10-21

Applicant: Delta Electronics, Inc.

Inventor： Kai LU ,  Zhenqing ZHAO ,  Shouyu HONG ,  Tao WANG ,  Le LIANG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49555 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/8382 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665

Abstract: The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.

Abstract translation: 本公开公开了一种功率转换电路的封装模块及其制造方法。 电源转换电路的封装模块可表面安装在系统板上。 功率转换电路的封装模块包括：基板，功率器件模具，模制层和多个引脚。 基板具有金属层，绝缘基板层和导热层。 绝缘基板层设置在金属层与导热层之间。 功率器件管芯耦合到金属层。 衬底的金属层上的器件嵌入成型层中。 多个引脚电耦合到金属层并且嵌入到模制层中，电耦合到系统板的每个引脚的至少接触表面被暴露，并且接触表面平行和/或垂直于 导热层。 具有这种结构的封装模块占地面积小，便于批量生产。

公开(公告)号：US20160165749A1

公开(公告)日：2016-06-09

申请号：US14959635

申请日：2015-12-04

Applicant: DELTA ELECTRONICS,INC.

Inventor： Shouyu HONG ,  Yanlin CHEN ,  Zhenqing ZHAO

IPC: H05K7/20

CPC classification number: H01L23/3677 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49568 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A power module and a method for manufacturing the same are provided. The power module comprises: a substrate, at least one power device, and an organic heat dissipating structure. The substrate has an upper surface and a lower surface. The organic heat dissipating structure comprises a plurality of organic heat dissipating protrusions and it is located on the upper surface side or the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly.

Abstract translation: 提供了一种功率模块及其制造方法。 功率模块包括：衬底，至少一个功率器件和有机散热结构。 基板具有上表面和下表面。 有机散热结构包括多个有机散热突起，并且其位于基板的上表面侧或下表面侧，并被配置为向外传递由动力装置产生的热量。

公开(公告)号：US20190280413A1

公开(公告)日：2019-09-12

申请号：US16234861

申请日：2018-12-28

Applicant: Delta Electronics,Inc.

Inventor： Shouyu HONG ,  Qingdong CHEN ,  Ganyu ZHOU ,  Pengkai JI ,  Yiqing YE ,  Zhenqing ZHAO

IPC: H01R13/22 ,  H01R13/405 ,  H01R43/16 ,  H01R12/71

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

公开(公告)号：US20190304882A1

公开(公告)日：2019-10-03

申请号：US16258747

申请日：2019-01-28

Applicant: Delta Electronics,Inc.

Inventor： Shouyu HONG ,  Haibin XU ,  Wei CHENG ,  Tao WANG ,  Zhenqing ZHAO

IPC: H01L23/495 ,  H01L21/48

Abstract: The present disclosure relates to a power module and a manufacturing method thereof. The power module includes: a group of switch elements, a molding part and a connector. The group of switch elements includes at least one pair of switch elements. The molding part molds the group of switch elements. The connector includes a signal terminal and a power terminal respectively electrically connected to the signal end and power end of the group of switch elements, and both fanned out from the molding part. The power terminal includes a positive power terminal, a negative power terminal and an output power terminal. The positive power terminal and the negative power terminal are respectively a first metal layer and a second metal layer which are at least partially stacked, and an insulating layer is disposed between the first metal layer and the second metal layer.

公开(公告)号：US20180124922A1

公开(公告)日：2018-05-03

申请号：US15720062

申请日：2017-09-29

Applicant: Delta Electronics, Inc.

Inventor： Pengkai JI ,  Shouyu HONG ,  Zhenqing ZHAO ,  Jianhong Zeng

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/30 ,  H05K3/40 ,  H01L23/28

CPC classification number: H01L23/3121 ,  H01L21/561 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/492 ,  H01L23/49811 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40

Abstract: The present invention provides a power module and a manufacturing method thereof. The power module includes a carrier board and a lead component stacked relative to the carrier board. The lead component includes an initial plane, plural first pins and plural second pin. The initial plane includes a vertical projection overlapping with the carrier board. The first pins are electrically connected to the carrier board and vertical to the initial plane. The second pins are electrically connected to the carrier board and vertical to the initial plane. An isolation gap is disposed in the initial plane and located between the first pins and the second pins. The initial plane is separated into a first plane and a second plane by the isolation gap, so as to electrically isolate the first pins and the second pins from each other.

公开(公告)号：US20160300777A1

公开(公告)日：2016-10-13

申请号：US15094038

申请日：2016-04-08

Applicant: DELTA ELECTRONICS,INC.

Inventor： Shouyu HONG ,  Yanlin CHEN ,  Zhenqing ZHAO

IPC: H01L23/373 ,  H01L23/367

CPC classification number: H01L23/3733 ,  H01L23/3737 ,  H01L2224/0603 ,  H01L2224/4846

Abstract: A power module and a thermal interface structure are provided herein. The thermal interface structure includes: a base and a plurality of filler particles distributed in the base. When the filler particles are under pressure, at least a part of the filler particles are deformed, and at least two adjacent filler particles partially contact with each other to form a heat-conducting path for transferring heat.

Abstract translation: 本文提供了功率模块和热接口结构。 热界面结构包括：基底和分散在基底中的多个填料颗粒。 当填料颗粒处于压力下时，填料颗粒的至少一部分变形，并且至少两个相邻的填料颗粒彼此部分接触以形成用于传递热量的导热路径。

公开(公告)号：US20160118177A1

公开(公告)日：2016-04-28

申请号：US14879263

申请日：2015-10-09

Applicant: DELTA ELECTRONICS, INC.

Inventor： Haibin XU ,  Tao WANG ,  Shouyu HONG ,  Zhenqing ZHAO ,  Yicong XIE ,  Zengsheng WANG

IPC: H01F27/24 ,  H01F27/28 ,  H01F41/02

CPC classification number: H01F3/14 ,  H01F27/2804

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.

Abstract translation: 提供了磁芯部件及其间隙控制方法。 磁芯部件包括第一磁性部件，第二磁性部件和设置在它们之间的第一间隙控制结构。 第一间隙控制结构包括触变材料并施加在第一磁性部件上并固化，第二磁性部件设置在固化的第一间隙控制结构上，第一磁性部件和第二磁性部件之间的间隙由 第一间隙控制结构的有效高度。 间隙控制结构在固化后具有最小的可变性，并且其有效高度可以始终保持在所需的间隙高度。

公开(公告)号：US20200350721A1

公开(公告)日：2020-11-05

申请号：US16934076

申请日：2020-07-21

Applicant: Delta Electronics,Inc.

Inventor： Shouyu HONG ,  Qingdong CHEN ,  Ganyu ZHOU ,  Pengkai JI ,  Yiqing YE ,  Zhenqing ZHAO

IPC: H01R13/22 ,  H01R12/71 ,  H01R43/16 ,  H01R13/405

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

公开(公告)号：US20190229033A1

公开(公告)日：2019-07-25

申请号：US16373984

申请日：2019-04-03

Applicant: Delta Electronics,Inc.

Inventor： Shouyu HONG ,  Zhenqing ZHAO

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H05K7/20 ,  H01L25/07

Abstract: A power module and a method for manufacturing the same are provided. The power module comprises: a substrate, at least one power device, and an organic heat dissipating structure. The substrate has an upper surface and a lower surface. The organic heat dissipating structure comprises a plane layer and a plurality of organic heat dissipating protrusions formed on a lower surface of the plane layer, wherein an upper surface of the plane layer is attached on the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly.

公开(公告)号：US20180358157A1

公开(公告)日：2018-12-13

申请号：US16104961

申请日：2018-08-20

Applicant: Delta Electronics,Inc.

Inventor： Haibin XU ,  Tao WANG ,  Shouyu HONG ,  Zhenqing ZHAO ,  Yicong XIE ,  Zengsheng WANG

IPC: H01F3/14 ,  H01F27/28

CPC classification number: H01F3/14 ,  H01F27/2804

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.