公开(公告)号：US20190280413A1

公开(公告)日：2019-09-12

申请号：US16234861

申请日：2018-12-28

Applicant: Delta Electronics,Inc.

Inventor： Shouyu HONG ,  Qingdong CHEN ,  Ganyu ZHOU ,  Pengkai JI ,  Yiqing YE ,  Zhenqing ZHAO

IPC: H01R13/22 ,  H01R13/405 ,  H01R43/16 ,  H01R12/71

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

公开(公告)号：US20170112001A1

公开(公告)日：2017-04-20

申请号：US15291155

申请日：2016-10-12

Applicant: DELTA ELECTRONICS,INC.

Inventor： Le LIANG ,  Zhenqing ZHAO

IPC: H05K5/00 ,  H05K7/14 ,  H05K5/02

CPC classification number: H05K7/1432 ,  H01L25/07 ,  H01L2224/48247

Abstract: Disclosed is a stack structure and its manufacturing method. The stack structure includes at least two stacked modules, wherein at least one of the modules is a power module; at least one metal connection component which is in integrated structure and comprises a first end, a second end and a connection portion with the first end being electrically connected to one of the modules and the second end being electrically connected to the other module; at least one molding compound packaging the at least one module and the end of the metal connection component which is electrically connected to the module, respectively.

公开(公告)号：US20160381785A1

公开(公告)日：2016-12-29

申请号：US15081365

申请日：2016-03-25

Applicant: DELTA ELECTRONICS, INC.

Inventor： Kai LU ,  Zhenqing ZHAO ,  Tao WANG ,  Le LIANG

IPC: H05K1/02 ,  H01L25/065 ,  H01L23/31 ,  H01L23/367 ,  H05K1/11 ,  H01L23/495

CPC classification number: H01L25/0657 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49589 ,  H01L2224/16225 ,  H01L2224/48137 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0263 ,  H05K3/284 ,  H05K2201/10166 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: A molding type power module includes: a leadframe including a first step and a second step; a first planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the first step respectively; and a second planar power device including a first surface having electrodes and a second surface opposite to the first surface, the electrodes being correspondingly bond to the second step respectively, wherein, the first surface of the first planar power device and the first surface of the second planar power device face each other, the projected areas thereof on a vertical direction at least partially overlap, and the first planar power device at least has one electrode electronically connected with the electrodes of the second planar power device.

Abstract translation: 一种成型型电力模块包括：引线框，包括第一步骤和第二步骤; 第一平面功率器件，其包括具有电极的第一表面和与所述第一表面相对的第二表面，所述电极分别对应地结合到所述第一台阶; 以及第二平面功率器件，其包括具有电极的第一表面和与所述第一表面相对的第二表面，所述电极分别对应地结合到所述第二台阶，其中，所述第一平面功率器件的第一表面和所述第一表面的第一表面 第二平面功率器件彼此面对，其垂直方向上的投影面积至少部分重叠，并且第一平面功率器件至少具有与第二平面功率器件的电极电连接的一个电极。

公开(公告)号：US20160254217A1

公开(公告)日：2016-09-01

申请号：US14918837

申请日：2015-10-21

Applicant: Delta Electronics, Inc.

Inventor： Kai LU ,  Zhenqing ZHAO ,  Shouyu HONG ,  Tao WANG ,  Le LIANG

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49555 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/8382 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/0781 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/37099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665

Abstract: The present disclosure discloses a package module of a power conversion circuit and a manufacturing method thereof. The package module of the power conversion circuit is surface-mountable on a system board. The package module of the power conversion circuit includes: a substrate, a power device die, a molding layer and a plurality of pins. The substrate has a metal layer, an insulating substrate layer and a thermal conductive layer. The insulating substrate layer is disposed between the metal layer and the thermal conductive layer. The power device die is coupled to the metal layer. Devices on the metal layer of the substrate are embedded in the molding layer. The plurality of pins is electrically coupled to the metal layer and embedded in the molding layer, at least a contact surface of each of the pins which is electrically coupled to the system board is exposed, and the contact surface is parallel and/or perpendicular to the thermal conductive layer. The package module with this structure occupies a small area, and facilitates batch production.

Abstract translation: 本公开公开了一种功率转换电路的封装模块及其制造方法。 电源转换电路的封装模块可表面安装在系统板上。 功率转换电路的封装模块包括：基板，功率器件模具，模制层和多个引脚。 基板具有金属层，绝缘基板层和导热层。 绝缘基板层设置在金属层与导热层之间。 功率器件管芯耦合到金属层。 衬底的金属层上的器件嵌入成型层中。 多个引脚电耦合到金属层并且嵌入到模制层中，电耦合到系统板的每个引脚的至少接触表面被暴露，并且接触表面平行和/或垂直于 导热层。 具有这种结构的封装模块占地面积小，便于批量生产。

公开(公告)号：US20160165749A1

公开(公告)日：2016-06-09

申请号：US14959635

申请日：2015-12-04

Applicant: DELTA ELECTRONICS,INC.

Inventor： Shouyu HONG ,  Yanlin CHEN ,  Zhenqing ZHAO

IPC: H05K7/20

CPC classification number: H01L23/3677 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49568 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2924/0002 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A power module and a method for manufacturing the same are provided. The power module comprises: a substrate, at least one power device, and an organic heat dissipating structure. The substrate has an upper surface and a lower surface. The organic heat dissipating structure comprises a plurality of organic heat dissipating protrusions and it is located on the upper surface side or the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly.

Abstract translation: 提供了一种功率模块及其制造方法。 功率模块包括：衬底，至少一个功率器件和有机散热结构。 基板具有上表面和下表面。 有机散热结构包括多个有机散热突起，并且其位于基板的上表面侧或下表面侧，并被配置为向外传递由动力装置产生的热量。

公开(公告)号：US20200350721A1

公开(公告)日：2020-11-05

申请号：US16934076

申请日：2020-07-21

Applicant: Delta Electronics,Inc.

Inventor： Shouyu HONG ,  Qingdong CHEN ,  Ganyu ZHOU ,  Pengkai JI ,  Yiqing YE ,  Zhenqing ZHAO

IPC: H01R13/22 ,  H01R12/71 ,  H01R43/16 ,  H01R13/405

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

公开(公告)号：US20190229033A1

公开(公告)日：2019-07-25

申请号：US16373984

申请日：2019-04-03

Applicant: Delta Electronics,Inc.

Inventor： Shouyu HONG ,  Zhenqing ZHAO

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/433 ,  H01L23/495 ,  H05K7/20 ,  H01L25/07

Abstract: A power module and a method for manufacturing the same are provided. The power module comprises: a substrate, at least one power device, and an organic heat dissipating structure. The substrate has an upper surface and a lower surface. The organic heat dissipating structure comprises a plane layer and a plurality of organic heat dissipating protrusions formed on a lower surface of the plane layer, wherein an upper surface of the plane layer is attached on the lower surface side of the substrate and configured to transfer heat generated by the power device outwardly.

公开(公告)号：US20180358157A1

公开(公告)日：2018-12-13

申请号：US16104961

申请日：2018-08-20

Applicant: Delta Electronics,Inc.

Inventor： Haibin XU ,  Tao WANG ,  Shouyu HONG ,  Zhenqing ZHAO ,  Yicong XIE ,  Zengsheng WANG

IPC: H01F3/14 ,  H01F27/28

CPC classification number: H01F3/14 ,  H01F27/2804

Abstract: There is provided a magnetic core component and the gap control method thereof. The magnetic core component includes a first magnetic component, a second magnetic component and a first gap control structure disposed therebetween. The first gap control structure includes thixotropic material and is applied on the first magnetic component and is cured, the second magnetic component is disposed on the cured first gap control structure, and a gap between the first magnetic component and the second magnetic component is controlled by an effective height of the first gap control structure. The gap control structure has minimum variability after it is cured, and its effective height can be always kept at a required gap height.

公开(公告)号：US20160352244A1

公开(公告)日：2016-12-01

申请号：US15165273

申请日：2016-05-26

Applicant: DELTA ELECTRONICS,INC.

Inventor： Wei CHENG ,  Shouyu HONG ,  Zhenqing ZHAO ,  Tao WANG

IPC: H02M7/00 ,  H05K7/20 ,  H05K1/18

CPC classification number: H05K7/209 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/49811 ,  H01L2224/32225 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/73265 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0271 ,  H05K2201/066 ,  H05K2201/10053 ,  H05K2201/10166 ,  H05K2201/10409 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate.

Abstract translation: 提供电源电路模块。 封装电源电路模块包括：压板，包括突出体; 一个框架; 以及承载电源电路的基板，所述电力电路至少包括电力开关装置; 框架设置在基板和压板之间，框架支撑压板，并且由基板，压板和框架形成基本封闭的空间; 并且当在压板上施加外力时，突出体压靠基板并与基板绝缘接触，并且外力均匀地在基板上传递。

公开(公告)号：US20170012030A1

公开(公告)日：2017-01-12

申请号：US15151730

申请日：2016-05-11

Applicant: DELTA ELECTRONICS,INC.

Inventor： Tao WANG ,  Zhenqing ZHAO ,  Zeng LI ,  Kai LU

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31 ,  H01L23/498 ,  H01L25/07

CPC classification number: H01L25/162 ,  H01L23/053 ,  H01L23/24 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/05032 ,  H01L2924/05042 ,  H01L2924/0532 ,  H01L2924/05432 ,  H01L2924/12035 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/13023 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1426 ,  H01L2924/15724 ,  H01L2924/15738 ,  H01L2924/15747 ,  H01L2924/15763 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: The present disclosure provides a power module with the integration of a control circuit at least, including: a power substrate; a power device mounted on the power substrate; and at least one control substrate which supports the control circuit, is electrically connected with the power substrate and disposed at an angle of inclination on a surface of the power substrate on which the power device is mounted; wherein the angle of inclination is greater than or equal to 45 degrees and smaller than or equal to 135 degrees. In the power module provided by the present disclosure, only the power substrate as well as the connections between the control substrate and the power substrate occupies the footprint area of the power module, and thus the horizontal footprint area of the power module is effectively reduced and thereby the power density of the power module is increased.

Abstract translation: 本公开提供了一种至少具有集成控制电路的功率模块，包括：功率基板; 安装在电源基板上的电源装置; 并且至少一个支撑所述控制电路的控制基板与所述电力基板电连接并且以与所述电力设备安装在所述电力基板上的倾斜角成角度地配置; 其中所述倾斜角度大于或等于45度且小于或等于135度。 在本公开提供的功率模块中，仅功率基板以及控制基板与功率基板之间的连接占据功率模块的覆盖区域，因此有效地减小了功率模块的水平占用面积， 从而增加了功率模块的功率密度。