公开(公告)号：US4315042A

公开(公告)日：1982-02-09

申请号：US924518

申请日：1978-07-14

Applicant: Donald J. Spigarelli

Inventor： Donald J. Spigarelli

IPC: B23K1/015 ,  B23K3/06 ,  H05K3/34 ,  B23K1/08 ,  B05D5/12

CPC classification number: B23K3/0646 ,  B23K1/015 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/044 ,  H05K2203/088 ,  H05K2203/1518 ,  Y10S134/902

Abstract: The method of solder leveling comprising maintaining a zone of hot saturated inert vapor at substantially the temperature of molten solder above a molten bath of solder, moving the part to be treated through the vapor at a rate such that it will become uniformly heated to substantially the temperature of the molten solder prior to immersion therein, immersing the part in the molten solder, withdrawing the part from the molten solder through the saturated vapor to the ambient atmosphere and, while withdrawing the part, projecting streams of hot, high density fluid on the surfaces of the part in directions opposite to the direction of withdrawal to sweep the surfaces of the excess solder.

Abstract translation: 焊料平整的方法包括将基本上熔融焊料的温度基本上保持在焊料的熔融浴上的热饱和惰性蒸气区域，使待处理部分通过蒸气以使得其将被均匀地加热到基本上 熔融焊料在浸入之前的温度，将部件浸入熔融焊料中，将熔融焊料的部分通过饱和蒸气排出到周围环境中，并且在抽出部分的同时将热的高密度流体流喷射到 该部分的表面在与取出方向相反的方向上扫掠多余焊料的表面。

公开(公告)号：US4077467A

公开(公告)日：1978-03-07

申请号：US652984

申请日：1976-01-28

Applicant: Donald J. Spigarelli

Inventor： Donald J. Spigarelli

IPC: B23K1/015 ,  F28D15/00

CPC classification number: B23K1/015 ,  Y10S134/902

Abstract: An apparatus for soldering an article which is placed within a first confined region in hot saturated vapors of a primary high temperature liquid. The vapors condense on the article to heat the article for such purpose. A second body of hot saturated vapors of a secondary liquid having a lower boiling point and density than the primary liquid provides a secondary vapor blanket in a second confined region of the apparatus which causes the primary vapors to condense and return to a primary liquid reservoir so that their escape from the apparatus is prevented. The temperature of the secondary liquid is controlled independently of the primary liquid.Preferably, the apparatus is such that the article is sequentially inserted into the first and second confined regions and sequentially removed therein, the article remaining in each of the regions temporarily during which times the regions are prevented from communication with each other and with the ambient atmosphere so that an effective vapor-lock operation occurs. The article may be pre-heated to a higher temperature than that of the secondary vapors before insertion therein to prevent undesirable flux removal before soldering takes place. The primary and secondary liquids and flux remaining on the article after soldering can be removed by spraying the article with distilled secondary liquid as it passes through the secondary vapors on the removal of the article from the apparatus.

Abstract translation: 一种用于焊接物品的装置，其被放置在初级高温液体的热饱和蒸气中的第一限制区域内。 文章中的蒸气冷凝用于此目的的物品。 具有比主要液体低的沸点和密度的第二液体的热饱和蒸气的第二体在设备的第二限制区域中提供二次蒸汽毯，其使主蒸汽冷凝并返回到主液体储存器 防止从设备逃脱。 辅助液体的温度独立于主要液体进行控制。

公开(公告)号：US5471310A

公开(公告)日：1995-11-28

申请号：US64426

申请日：1993-05-20

Applicant: Donald J. Spigarelli ,  John M. DeCarlo

Inventor： Donald J. Spigarelli ,  John M. DeCarlo

IPC: H05K13/08 ,  G01B11/27

CPC classification number: H05K13/08

Abstract: A guidance type placement apparatus for placing and mounting integrated circuit (IC) components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus includes an image acquisition processing subsystem. The image acquisition subsystem is operative to generate images of at least one pair of diagonally opposed corners of the placement site and IC device from the same optical perspective.

Abstract translation: 一种用于将集成电路（IC）部件或装置，特别是微型间距集成电路装置（FPD）放置和安装的引导型放置装置，与印刷电路板对齐。 该装置包括图像采集处理子系统。 图像采集子系统可操作以从相同的光学透视图生成放置位置和IC器件的至少一对斜对角的图像。

公开(公告)号：US5433368A

公开(公告)日：1995-07-18

申请号：US974200

申请日：1992-11-10

Applicant: Donald J. Spigarelli

Inventor： Donald J. Spigarelli

IPC: B23K1/012 ,  H05K13/00 ,  H05K3/00

CPC classification number: H05K13/0061 ,  B23K1/012 ,  B23K2201/06 ,  B23K2201/18

Abstract: A processing system includes at least one processing chamber, a conveyor disposed through the chamber and a drive unit coupled to the conveyor and intermittently activated by a drive controller for driving the conveyor for a first predetermined interval of time at a preselected one of a plurality of speeds and stopping the conveyor for a second predetermined interval of time. The processing system further includes a temperature control system to provide the processing chamber with a first internal region having a first predetermined temperature and a second internal region having a second predetermined temperature, and one or more temperature sensors disposed to monitor the temperature in at least one predetermined region of the processing chamber.

Abstract translation: 一种处理系统包括至少一个处理室，通过该室设置的传送器，以及耦合到传送器的驱动单元，并且由驱动控制器间歇地启动，用于以预定的多个 速度并使输送机停止第二预定时间间隔。 所述处理系统还包括温度控制系统，用于向所述处理室提供具有第一预定温度的第一内部区域和具有第二预定温度的第二内部区域，以及一个或多个温度传感器，所述温度传感器设置成在至少一个 处理室的预定区域。

公开(公告)号：US5234151A

公开(公告)日：1993-08-10

申请号：US936950

申请日：1992-08-28

Applicant: Donald J. Spigarelli

Inventor： Donald J. Spigarelli

IPC: B23K3/08 ,  H05K3/34

CPC classification number: H05K3/3457 ,  B23K3/08 ,  H05K3/3421 ,  H05K2201/10151 ,  H05K2203/0126 ,  H05K2203/163 ,  H05K3/3484 ,  Y02P70/613

Abstract: A method is provided for non-contact and contact sensing of phase changes of a solder material. By adding solder to a preexisting solder joint or substrate, an infrared sensor with limited resolution capability is able to discriminate between various solder characteristics at the solder enhanced site and other thermally distracting components when the solder transitions from a solid to a liquid phase or from a liquid to a solid phase. One type of contact sensing of solder reflow is accomplished by holding a thermocouple against a solder joint. When the pre-existing solder volume is insufficient to produce the desired results, additional solder is added to the solder joint or lead. The additional solder may be solid solder, a solder pre-form, or solder paste. Contact sensing may also be achieved by placing a spring loaded probe against the solder and detecting the probe's movement as the solder softens. In another contact reflow detection technique, a thermocouple sensor is housed in a protective sleeve fillable with solder paste or molten solder. The sensor is placed against a substrate adjacent a solder joint, and is heated simultaneously with the solder joint. Detection of solder reflow in the sleeve by the thermocouple signals reflow of the adjacent solder joint.

Abstract translation: 提供了用于焊接材料的相变的非接触和接触感测的方法。 通过向预先存在的焊点或衬底添加焊料，具有有限分辨能力的红外传感器能够区分焊料增强位置处的各种焊接特性和其他热分散部件，当焊料从固体转变为液相或从 液体固相。 通过将热电偶保持在焊接接头上来实现一种类型的焊料回流接触感测。 当预先存在的焊料体积不足以产生期望的结果时，附加的焊料被添加到焊点或引线中。 附加的焊料可以是固体焊料，焊料预形成或焊膏。 也可以通过将弹簧加载的探针放置在焊料上并在焊料软化时检测探头的运动来实现接触感测。 在另一种接触回流检测技术中，热电偶传感器容纳在可焊膏或熔融焊料填充的保护套管中。 将传感器放置在靠近焊接接头的基板上，并与焊点同时加热。 通过热电偶检测套管内的焊料回流信号，回流焊接相邻焊点。

公开(公告)号：US4832250A

公开(公告)日：1989-05-23

申请号：US54959

申请日：1987-05-28

Applicant: Donald J. Spigarelli ,  William F. Drislane

Inventor： Donald J. Spigarelli ,  William F. Drislane

IPC: H05K13/08

CPC classification number: H05K13/0486

Abstract: An electronic circuit board rework and repair system having a carriage manually movable to successive station positions and having a table thereon movable along mutually orthogonal axes for positioning of a circuit board clamped to the table. At a first station, a circuit board is loaded onto the table, and a microscope can be swung into position for inspection of the loaded board. At a second station, an intended component or circuit board site can be aligned by way of a visual image of the component and site, and the table locked in position. At a third station, the selected component or circuit board site is automatically in alignment with a programmable heater for selected heating of the component contacts and removal of the component by a pickup probe associated with the heater. The system is calibrated such that there is alignment between a visually established position at the second station and that component position under the heater at the third station. Components can also be attached to selected sites of a circuit board by operation of the system.

Abstract translation: 一种电子电路板返修和修复系统，其具有可手动地移动到连续站位置的托架，并且具有可沿着相互正交的轴线移动的工作台，用于定位夹在工作台上的电路板。 在第一站，将电路板装载到工作台上，并且可以将显微镜摆放到位以检查装载的板。 在第二站，可以通过组件和站点的视觉图像对准预期的组件或电路板位置，并且将表锁定在适当位置。 在第三站，所选择的部件或电路板位置自动与可编程加热器对准，用于选择加热部件触点并通过与加热器相关联的拾取探头去除部件。 该系统被校准，使得在第二站处的可视建立位置和第三站处的加热器下方的组件位置之间存在对准。 组件也可以通过系统的操作连接到电路板的选定位置。

公开(公告)号：US4757780A

公开(公告)日：1988-07-19

申请号：US865232

申请日：1986-05-20

Applicant: Donald J. Spigarelli ,  Douglas J. Peck ,  Walter J. Hall ,  James L. Finney

Inventor： Donald J. Spigarelli ,  Douglas J. Peck ,  Walter J. Hall ,  James L. Finney

IPC: B23K1/015 ,  B23K1/018 ,  B23K1/08 ,  H05K3/34 ,  H05K3/24 ,  B05C3/10

CPC classification number: H05K3/34 ,  B23K1/015 ,  B23K1/018 ,  B23K1/085 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/044 ,  H05K2203/0746 ,  H05K2203/0776 ,  H05K2203/088 ,  H05K2203/1509

Abstract: A vapor phase system for soldering of a workpiece. A vessel for containing an electronic liquid which is heated to generate a zone of saturated vapor. A first inclined throat communicates with the vessel and a solder pot is located within the vessel. The solder pot including a reservoir for containing molten solder, a second throat aligned with the first throat and communicating at one end with molten solder contained in the reservoir means and communicating at the other end with the saturated vapor, molten solder contained in the reservoir means is pumped through the second throat and is captured by the reservoir and a conveyor carries work product through the first throat, through the saturated vapor and into the second throat whereby the work product will become immersed in the molten solder contained within the second throat.

Abstract translation: 用于焊接工件的气相系统。 用于容纳电子液体的容器，其被加热以产生饱和蒸汽区域。 第一倾斜喉管与容器连通，并且容器内设有焊锡锅。 焊料罐包括用于容纳熔融焊料的储存器，与第一喉部对准的第二喉部，并且在一端与包含在储存器装置中的熔融焊料连通，并且在另一端与在储存器装置中包含的饱和蒸气，熔融焊料连通 被泵送通过第二喉管并且被储存器捕获，并且输送器通过第一喉管，通过饱和蒸气并将其运送到第二喉部，由此工件将浸入包含在第二喉部内的熔融焊料中。

公开(公告)号：US4558524A

公开(公告)日：1985-12-17

申请号：US433662

申请日：1982-10-12

Applicant: Douglas J. Peck ,  Donald J. Spigarelli

Inventor： Douglas J. Peck ,  Donald J. Spigarelli

IPC: B23K1/015 ,  H01L21/00 ,  F26B19/00

CPC classification number: H01L21/67034 ,  B23K1/015 ,  Y10S134/902

Abstract: A single vapor system for soldering, fusing, or brazing includes vertically disposed chambers which provide a draining and drying zone above a vapor processing zone. Draining occurs in the upper zone with no additional heat being added in vapor recovery. A sealing system is utilized which is actuated by the carrier elevator as an article-carrying basket is moved into and out of the zones. The sealing system includes a moveable top cover resting on the top of the article-carrying basket, with the top cover being left at the top of the draining and drying zone to seal the top of this zone when the basket is lowered to the bottom of this zone. A moveable bottom plate is raised by pulleys and weights, spring returns or other means to the bottom of the draining and drying zone such that the bottom plate seals the bottom of this zone, isolating the zones one from the other. Liquid drained from the article in the upper zone flows into a peripheral channel at the bottom plate to provide a liquid seal around the perimeter of the bottom plate. An unheated primary vapor recovery system and a combined system vent and unheated secondary recovery system are utilized for the draining and drying zone. In one embodiment, the carrier elevator includes basket-lowering straps or tapes which pass through cylindrical or square channels carried by the top plate, with the channels carrying slit and chamfered discs for prevention of vapor leakage at the points where the tapes pass through the top plate. In a completely automated embodiment, the carrier elevator is provided with an endless horizontal belt, with the belt being driven only when the carrier reaches the load/unload position.

Abstract translation: 用于焊接，熔合或钎焊的单一蒸气系统包括垂直设置的室，其在蒸气处理区之上提供排水和干燥区。 在上部区域发生排水，在蒸气回收中不加入额外的热量。 使用密封系统，当携带货物的篮子移入和移出区域时，该系统由承运人电梯启动。 密封系统包括搁置在物品携带篮的顶部上的可移动的顶盖，顶盖留在排水和干燥区的顶部，以在篮被下降到底部的顶部时密封该区的顶部 这个区域。 可移动的底板通过滑轮和重物，弹簧返回或其它装置升高到排水和干燥区域的底部，使得底板密封该区域的底部，将区域彼此隔离。 从上部区域中的物品排出的液体流入底板的周边通道，以提供围绕底板周边的液体密封。 用于排水和干燥区的未加热的初级蒸气回收系统和组合系统通风口和未加热的二次回收系统。 在一个实施例中，托架升降机包括穿过由顶板承载的圆柱形或正方形通道的落篮带或带，通道承载狭缝和倒角盘，以防止带通过顶部的点处的蒸汽泄漏 盘子。 在完全自动化的实施例中，承运人电梯设置有环形水平带，只有当承载件到达装载/卸载位置时，带才被驱动。

公开(公告)号：US5317803A

公开(公告)日：1994-06-07

申请号：US962066

申请日：1992-10-16

Applicant: Donald J. Spigarelli ,  John M. DeCarlo ,  Karl E. Bahr

Inventor： Donald J. Spigarelli ,  John M. DeCarlo ,  Karl E. Bahr

IPC: H05K13/04 ,  H05K3/30

CPC classification number: H05K13/0465 ,  H05K13/0408 ,  Y10T29/49144 ,  Y10T29/53191

Abstract: An integrated circuit device support tool which includes a device for providing a vacuum for holding an integrated circuit device to be soldered to a printed circuit board. The tool also includes a plurality of thin, pressure transferring members for pressing the leads of the integrated circuit device against a printed circuit board during soldering. The pressure transferring members are of a thin material so as not to provide a heat sink during the soldering operation.

Abstract translation: 一种集成电路器件支持工具，其包括用于提供用于保持待焊接到印刷电路板的集成电路器件的真空的器件。 该工具还包括多个薄的压力传递构件，用于在焊接期间将集成电路装置的引线压靠印刷电路板。 压力传递构件是薄的材料，以便在焊接操作期间不提供散热器。

公开(公告)号：US5309545A

公开(公告)日：1994-05-03

申请号：US749116

申请日：1991-08-23

Applicant: Donald J. Spigarelli ,  John M. DeCarlo ,  John A. Romano ,  William F. Drislane

Inventor： Donald J. Spigarelli ,  John M. DeCarlo ,  John A. Romano ,  William F. Drislane

IPC: B23K1/005 ,  H05K3/34 ,  H05K13/04 ,  B23K1/012

CPC classification number: B23K1/0053 ,  H05K13/0465 ,  H05K3/3421 ,  H05K3/3494

Abstract: A combined radiative and convective rework system is provided for repair, replacement, removal and rework of an electronic component on a printed circuit board. The system includes a guide for guiding heat-inducing radiation and heated gas towards at least one lead of the electronic component, and for preventing the heat-inducing radiation from damaging the body of the component. A heater, including a source of infrared radiation, provides the heat-inducing radiation and the heated gas. In one embodiment, the guide includes a single funnel cooperative with apparatus for reducing component body heating. In second and third embodiments, the guide includes two concentric funnels which form a volume which is traversed by the heat-inducing radiation and heated gas, and which provide at least one narrow region of heat energy to at least one of the leads, but not directly to the component body. In another embodiment, a plurality of removable guides are provided, each being specialized for use with a variety of different component types and sizes. The system also includes a viewing system for viewing the component along a central axis of symmetry of the guide.

Abstract translation: 提供组合的辐射和对流返修系统用于印刷电路板上的电子部件的修理，更换，移除和返修。 该系统包括用于将导热辐射和加热气体引向电子部件的至少一个引线的引导件，并且用于防止热诱导辐射损坏部件的主体。 包括红外辐射源的加热器提供导热辐射和加热的气体。 在一个实施例中，引导件包括与用于减少部件主体加热的装置协作的单漏斗。 在第二和第三实施例中，引导件包括形成体积的两个同心漏斗，该体积由导热辐射和加热气体穿过，并且向至少一个引线提供至少一个狭窄的热能区域，但不包括 直接到组件体。 在另一个实施例中，提供了多个可移除的引导件，每个引导件专门用于各种不同的部件类型和尺寸。 该系统还包括用于沿导向件的中心对称轴线观察部件的观察系统。